Patents Assigned to Littelfuse, Inc.
  • Patent number: 10878980
    Abstract: A polymeric positive temperature coefficient (PPTC) device including a PPTC body, a first electrode disposed on a first side of the PPTC body, and a second electrode disposed on a second side of the PPTC body, wherein the PPTC body is formed of a PPTC material that includes a polymer matrix and a conductive filler, wherein the conductive filler defines 20%-39% by volume of the PPTC material.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: December 29, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Jianhua Chen, Chun Kwan Tsang
  • Patent number: 10854581
    Abstract: A die stack assembly includes first and second power semiconductor device dice. The first die has a P type peripheral edge separation structure that extends from the top planar semiconductor surface of the first die all the way to the bottom planar semiconductor surface of the die, and that is doped at least in part with aluminum. The backside of the first die is mounted to the backside of the second die. A metal feature that is not covered with passivation, and that can serve as a bonding pad, is disposed on part of the peripheral edge separation structure. A metal member (for example, a bond wire or metal clip) contacts the metal feature such that an electrical connection is established from the metal member, through the metal feature, through the peripheral edge separation structure of the first die, and to an electrode of the second die.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: December 1, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Elmar Wisotzki, Frank Ettingshausen
  • Patent number: 10847335
    Abstract: A disc fuse including an electrically insulating substrate having a via formed therethrough extending between a first surface and a second surface of the substrate, an electrically conductive first terminal disposed on the first surface of the substrate, and an electrically conductive second terminal disposed on the second surface of the substrate, the second terminal including an outer portion having an inner edge defining a through-hole in the second terminal, the second terminal further including a fuse portion extending from the inner edge, the fuse portion comprising a fusible element terminating in a contact pad, wherein the substrate provides an electrically insulating barrier between the first terminal and the second terminal and wherein the via provides an electrical connection between the first terminal and the contact pad.
    Type: Grant
    Filed: November 10, 2019
    Date of Patent: November 24, 2020
    Assignee: Littelfuse, Inc
    Inventors: Maria Lily E. Rosios, Albert Enriquez, Todd Dietsch, Werner Johler
  • Patent number: 10847658
    Abstract: An inverse diode die has a high reverse breakdown voltage, a short reverse recovery time Trr, and is rugged in terms of reverse breakdown voltage stability over long term use in hard commutation applications. The die has an unusually lightly doped bottomside P type anode region and also has an N? type drift region above it. Both regions are of bulk wafer material. An N+ type contact region extends down into the drift region. A topside metal electrode is on the contact region. A P type silicon peripheral sidewall region laterally rings around the drift region. A topside passivation layer rings around the topside electrode. A bottomside metal electrode is on the bottom of the die. The die has a deep layer of hydrogen ions that extends through the N? drift region. The die also has a shallow layer of ions. Both ion layers are implanted from the bottomside.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: November 24, 2020
    Assignee: Littelfuse, Inc.
    Inventor: Elmar Wisotzki
  • Publication number: 20200365358
    Abstract: A fuse module including a mounting block formed of an electrically insulating material, the mounting block including a rear wall extending from a base, a fuse plate including an electrically conductive bus bar disposed on a bottom of the base, a fusible element electrically connected to the bus bar and disposed adjacent a rear of the rear wall, and a fuse terminal electrically connected to the fusible element and extending over a top of the rear wall, along a front of the rear wall, and onto a top of the base, the fuse module further including an electrically conductive terminal post extending from the top of the base through the fuse terminal for facilitating connection to an electrical component.
    Type: Application
    Filed: September 10, 2018
    Publication date: November 19, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Julio Urrea, Gary Bold, Hector Perez, Matt Yurkanin, Alexander Conrad
  • Publication number: 20200357543
    Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.
    Type: Application
    Filed: July 29, 2020
    Publication date: November 12, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Edward W. Rutter, JR., Yuriy B. Matus, Martin Pineda
  • Publication number: 20200357594
    Abstract: An exemplary embodiment of active/passive automotive fuse module in accordance with the present disclosure may include an electrically insulating base, a fuse plate including a bus bar portion disposed on a top surface of the base above a projectile cavity formed in the base, the fuse plate further including a fusible portion electrically connected to the bus bar portion and adapted to open when an amount of current flowing through the fuse plate exceeds a current rating of the active/passive automotive fuse module, the active/passive automotive fuse module further including a pyrotechnic interrupter (PI) disposed atop the base and including a projectile positioned above the bus bar portion, the PI configured to drive the projectile through the bus bar portion upon actuation of the PI.
    Type: Application
    Filed: April 21, 2020
    Publication date: November 12, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Julio C. Urrea, Gary M. Bold, Juergen Scheele
  • Publication number: 20200355736
    Abstract: A circuit protection device including a primary fuse, and a positive temperature coefficient (PTC) device and a secondary fuse electrically connected in series with one another and in parallel with the primary fuse, the secondary fuse formed of a quantity of solder disposed on a dielectric surface, wherein the dielectric surface exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric surface to create a galvanic opening.
    Type: Application
    Filed: May 9, 2019
    Publication date: November 12, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Yuriy Borisovich Matus, Martin Pineda, Kedar V. Bhatawadekar
  • Patent number: 10833675
    Abstract: A latching relay includes a supply terminal, a load terminal, first and second coupling circuits, a latch circuit, first and second transistors, and a local supply node coupled to a capacitor. In one example, the supply terminal is coupled to a supply node and the load terminal is coupled to the load. The first and second transistors control the conductivity of a drive transistor coupled to the load. A microcontroller controls the latching relay to switch the load on and off. To enable the load, the microcontroller sinks current from the supply terminal and through the first coupling circuit. While the load is enabled, the capacitor is discharged. The latching relay is operable in a refresh mode in which current is pulsed through the first coupling circuit causing capacitor to be re-charged from the supply terminal. To disable the load, the microcontroller sinks current through the second coupling circuit.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: November 10, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Michael J. Gambuzza, Eirik L. Gude
  • Publication number: 20200328015
    Abstract: A PPTC device including a PPTC body, a first electrode, disposed on a first side of the fuse component, a second electrode, disposed on a second side of the PPTC body, wherein the PPTC body comprises a polymer matrix and a conductive filler.
    Type: Application
    Filed: October 19, 2017
    Publication date: October 15, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Zhiyong Zhou, Jianhua Chen, Chun-Kwan Tsan
  • Patent number: 10804688
    Abstract: Arc fault detection devices and methods are described current between a source and a load is periodically measured. A variance of the periodically measured current values is derived and an arc fault can be detected abased on the derived variance. A variance interval signal can be incremented based on the derived variance increasing above a threshold level and a low pass filter arranged to detect an arc based on the incremented variance interval signal.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: October 13, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Mohamed Ayeb, Ludwig Brabetz, Leonard Gysen, Markus Horn, Tobias Kerner, Carsten Fock
  • Patent number: 10790108
    Abstract: Approaches herein provided surface mounted devices each configured as a stand-alone component suitable for attachment to a substrate such as a printed circuit board (PCB). In some embodiments, a method includes forming a base housing, coupling an electronic component to the base housing, and forming a cover over the electronic component, wherein the cover is coupled to the base housing. The electronic component may include a fusible link/element extending between terminals, the terminals wrapped around an exterior of base housing. The device may then be coupled to the PCB, for example, by attaching the terminals to an upper surface of the PCB.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: September 29, 2020
    Assignee: Littelfuse, Inc.
    Inventors: James Beckert, Gregory Stumpo
  • Publication number: 20200298802
    Abstract: An optical rain sensor including a plurality of light detecting elements and a plurality of peripheral light emitting elements disposed on a printed circuit board (PCB) and surrounding a central light emitting element disposed on the PCB, wherein, in a first mode of operation, the central light emitting element is configured to emit light beams toward the plurality of light detecting elements, and wherein, in a second mode of operation, each of the peripheral light emitting elements is configured to emit light beams toward the plurality of light detecting elements.
    Type: Application
    Filed: March 17, 2020
    Publication date: September 24, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Mindaugas Ketlerius, MANGIRDAS RASIULIS
  • Publication number: 20200300775
    Abstract: A rain and temperature sensing module including a housing having a cover plate formed of a transparent material, a printed circuit board disposed within the housing and having a light emitter, a light receiver, and a temperature sensing element disposed thereon, a transparent compound disposed within the housing and covering the light emitter, the light receiver, and the temperature sensing element, the transparent compound filling a space between the printed circuit board and the cover plate, wherein the transparent compound has a refractive index that is substantially equal to a refractive index of the cover plate, and wherein the transparent compound provides a thermally conductive medium between the cover plate and the temperature sensing element.
    Type: Application
    Filed: March 17, 2020
    Publication date: September 24, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Mindaugas Ketlerius, MANGIRDAS RASIULIS, PAULIUS ALISAUSKAS
  • Patent number: 10784026
    Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.
    Type: Grant
    Filed: January 20, 2019
    Date of Patent: September 22, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Edward W. Rutter, Jr., Yuriy B. Matus, Martin Pineda
  • Patent number: 10777947
    Abstract: A universal serial bus (USB) cable including a power conductor configured to transmit power between a first device and a second device, a configuration channel (CC) conductor configured to allow the first device and the second device to determine whether a connection has been established via the USB cable, and a first positive temperature coefficient (PTC) element coupled to the CC conductor and configured to mitigate current flowing through the CC conductor if a temperature of the first PTC element rises above a predefined trip temperature.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: September 15, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Boris Golubovic, Kunghao Yu
  • Patent number: 10777340
    Abstract: A polymeric positive temperature coefficient (PPTC) device including a PPTC body, a first electrode disposed on a first side of the PPTC body, and a second electrode disposed on a second side of the PPTC body, wherein the PPTC body is formed of a PPTC material that includes a maximum of 65% by volume of a conductive filler, wherein 10%-39% by volume of the PPTC material is a conductive ceramic filler and wherein the rest of the conductive filler includes at least one of carbon and a metallic filler.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: September 15, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Jianhua Chen, Chun Kwan Tsang
  • Publication number: 20200286988
    Abstract: In one embodiment, a power semiconductor device may include a semiconductor substrate, wherein the semiconductor substrate comprises an active device region and a junction termination region. The power semiconductor device may also include a polysilicon layer, disposed over the semiconductor substrate. The polysilicon layer may include an active device portion, disposed over the active device region, and defining at least one semiconductor device; and a junction termination portion, disposed over the junction termination region, the junction termination portion defining a ring structure.
    Type: Application
    Filed: March 6, 2019
    Publication date: September 10, 2020
    Applicant: Littelfuse, Inc.
    Inventor: Kyoung Wook Seok
  • Patent number: 10763662
    Abstract: A two-terminal electronic fuse device involves two switches, four diodes, switch control circuitry, and a storage capacitor, connected in a particular topology. When AC current flows through the fuse, a charging current charges the storage capacitor. Energy stored in the storage capacitor is then used to power the switch control circuitry. If the voltage on the storage capacitor drops, then the switches are opened briefly and at the correct time. Opening the switches allows the charging current to flow. By opening the switches and charging the storage capacitor only at times of low current flow through the fuse, the disturbance of load current flowing through the fuse is minimized. If an overload current condition is detected, then the fuse has tripped and first and second switches are opened. If the capacitor does not need charging and there is no overload condition, then the switches remain closed.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: September 1, 2020
    Assignee: Littelfuse, Inc.
    Inventor: Leonid A. Neyman
  • Patent number: 10763201
    Abstract: A power device includes a semiconductor chip provided over a substrate, and a patterned lead. The patterned lead includes a raised portion located between a main portion and an end portion. At least part of the raised portion is positioned over the semiconductor chip at a larger height than both the main portion and the end portion. A bonding pad may also be included. The end portion may include a raised portion, bonded portion, and connecting portion. At least part of the bonded portion is bonded to the bonding pad and at least part of the raised portion is positioned over the bonding pad at a larger height than the bonded portion and connecting portion. The end portion may also include a plurality of similarly raised portions.
    Type: Grant
    Filed: November 23, 2017
    Date of Patent: September 1, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Nathan Zommer, Kang Rim Choi