Patents Assigned to Littelfuse, Inc.
  • Integrated Fuse Module
    Publication number: 20200273655
    Abstract: A fuse module including a mounting block formed of an electrically insulating material, a fuse plate including a fusible element disposed on a bottom surface of the mounting block, an input terminal electrically connected to the fusible element and extending along rear and top surfaces of the mounting block, and a fuse terminal electrically connected to the fusible element and extending from a front surface of the mounting block, the fuse module further including an electrically conductive terminal post extending from the top surface of the mounting block through the fuse terminal for facilitating connection to an electrical component.
    Type: Application
    Filed: September 24, 2018
    Publication date: August 27, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Michael Beck, Alfred Sadrinna, Julio Urrea, Gary Bold
  • System and method for single wire ground check measurement
    Patent number: 10746807
    Abstract: Embodiments herein are directed to systems and methods for single wire precision measurement of a ground termination circuit. In some embodiments, a ground check monitoring apparatus includes a voltage source connected to a single insulated ground check wire, a pilot conductor, and a ground conductor, wherein the pilot conductor has a first resistance, and the ground conductor has a second resistance. The apparatus further includes a termination device connected between the pilot conductor and the ground conductor, and a ground conductor terminal connectable to a cable pilot wire. The apparatus may further include a ground terminal connectable with a cable ground wire, wherein voltage and current measured at the ground check terminal and the ground terminal are used to determine a ground check resistance.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: August 18, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Daryl Warkentin, George Fenty, Kim Haluik
  • Die stack assembly using an edge separation structure for connectivity through a die of the stack
    Patent number: 10734362
    Abstract: A die stack assembly includes first and second power semiconductor device dice. The first die has a P type peripheral edge separation structure that extends from the top planar semiconductor surface of the first die all the way to the bottom planar semiconductor surface of the die, and that is doped at least in part with aluminum. The backside of the first die is mounted to the backside of the second die. A metal feature that is not covered with passivation, and that can serve as a bonding pad, is disposed on part of the peripheral edge separation structure. A metal member (for example, a bond wire or metal clip) contacts the metal feature such that an electrical connection is established from the metal member, through the metal feature, through the peripheral edge separation structure of the first die, and to an electrode of the second die.
    Type: Grant
    Filed: June 11, 2017
    Date of Patent: August 4, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Elmar Wisotzki, Frank Ettingshausen
  • FUSES AND METHODS OF FORMING FUSES
    Publication number: 20200234906
    Abstract: Exemplary embodiments of the present disclosure of a fuse may include a fuse body having a first portion and a second portion. The first and second portions may be configured to mate together thereby forming an internal cavity. A first inner termination and a second inner termination may be at least partially attachable to the first and second portions of the fuse body at respective first and second ends. A fusible element may be disposed in the cavity of the fuse body and extendable from the first inner termination at the first end of the fuse body to the second inner termination at the second end of the fuse body. The fusible element may be attachable to the first inner termination at a first connection and the second inner termination at a second connection. The first and second connections may be inspectable when the fuse is in an assembled state.
    Type: Application
    Filed: December 9, 2019
    Publication date: July 23, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Maria Lily E. Rosios, Albert V. Enriquez, Victor Oliver L. Tabell, Gordon T. Dietsch, Keon Mayson A. Brosas
  • Discrete power transistor package having solderless DBC to leadframe attach
    Patent number: 10720376
    Abstract: A packaged power transistor device includes a Direct-Bonded Copper (“DBC”) substrate. Contact pads of a first lead are attached with solderless welds to a metal layer of the DBC substrate. In a first example, the solderless welds are ultrasonic welds. In a second example, the solderless welds are laser welds. A single power transistor realized on a single semiconductor die is attached to the DBC substrate. In one example, a first bond pad of the die is wire bonded to a second lead, and a second bond pad of the die is wire bonded to a third lead. The die, the wire bonds, and the metal layer of the DBC substrate are covered with an amount of plastic encapsulant. Lead trimming is performed to separate the first, second and third leads from the remainder of a leadframe, the result being the packaged power transistor device.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: July 21, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Gi-Young Jeun, Kang Rim Choi
  • PVDF PIEZOELECTRIC RELIABILITY AND ELECTRODE ADHESION IMPROVEMENT
    Publication number: 20200227622
    Abstract: A device may include an inner layer comprising a polyvinylidene fluoride (PVDF) material. The device may also include a first interface layer, disposed on a first side of the inner layer, and a second interface layer, disposed on a second side of the inner layer. The first interface layer and the second interface layer may comprise a mixture of PVDF material and a scavenger component.
    Type: Application
    Filed: January 13, 2019
    Publication date: July 16, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Yuriy B. Matus, Martin Pineda, Edward W. Rutter, JR.
  • Self-powered electronic fuse with storage capacitor that charges with minimal disturbance of load current through the fuse
    Patent number: 10714925
    Abstract: A two-terminal electronic fuse device involves two switches, four diodes, switch control circuitry, and a storage capacitor, connected in a particular topology. When AC current flows through the fuse, a charging current charges the storage capacitor. Energy stored in the storage capacitor is then used to power the switch control circuitry. If the voltage on the storage capacitor drops, then the switches are opened briefly and at the correct time. Opening the switches allows the charging current to flow. By opening the switches and charging the storage capacitor only at times of low current flow through the fuse, the disturbance of load current flowing through the fuse is minimized. If an overload current condition is detected, then the fuse has tripped and first and second switches are opened. If the capacitor does not need charging and there is no overload condition, then the switches remain closed.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: July 14, 2020
    Assignee: Littelfuse, Inc.
    Inventor: Leonid A. Neyman
  • PPTC composition and device having thermal degradation resistance
    Patent number: 10711114
    Abstract: A polymer positive temperature coefficient (PPTC) material. The PPTC material may include a polymer matrix, a conductive filler, and a thermal stabilizer.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: July 14, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Jianhua Chen, Chun-Kwan Tsang
  • Magnetically activated switch having magnetostrictive material
    Patent number: 10714286
    Abstract: Switch assemblies and a switching method are disclosed. In some embodiments, a switch assembly may include a first contact element, and a second contact element operable with the first contact element. The first and second contact elements form an open circuit in a first configuration and form a closed circuit in a second configuration. At least one of the first contact element and the second contact element includes a magnetostrictive material. During operation, a magnetic field from a magnet causes the magnetostrictive material to deform or change shape/dimensions, thus causing the first and second contact elements to open or close. In some embodiments, the switch assembly is a micro-electro-mechanical-system (MEMS) switch.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: July 14, 2020
    Assignee: Littelfuse, Inc.
    Inventor: Brian Johnson
  • CONTACT SWITCH COATING
    Publication number: 20200219670
    Abstract: Switch assemblies and switching methods are disclosed. In some embodiments, a switch assembly may include a first blade having a first contact within an enclosed cavity, and a second blade having a second contact within the enclosed cavity. The first and second contacts are operable to make or break contact with one another in response to a magnetic field. The switch assembly may further include a coating formed over each of the first and second contacts, the coating including a titanium layer, a second layer formed over the titanium layer, and a tungsten-copper layer formed over the second layer. In some embodiments, the second layer is copper or molybdenum.
    Type: Application
    Filed: January 4, 2019
    Publication date: July 9, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Philip Warner Lees, Joshua James Koeppel, J. Anthony Spies, Eric James Hafenstein
  • TEMPERATURE SENSING TAPE, ASSEMBLY, AND METHOD OF TEMPERATURE CONTROL
    Publication number: 20200217724
    Abstract: A temperature sensing tape including a flexible, electrically insulating substrate, a plurality of temperature sensing elements disposed on the substrate, each temperature sensing element including a first electrode and a second electrode arranged in a confronting, spaced-apart relationship to define a gap therebetween, and a variable resistance material disposed within the gap and connecting the first electrode to the second electrode, wherein the first electrode of at least one of the temperature sensing elements is connected to the second electrode of an adjacent temperature sensing element by a flexible electrical conductor.
    Type: Application
    Filed: March 20, 2020
    Publication date: July 9, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Boris Golubovic, Martin G. Pineda, Yuriy Borisovich Matus, Jianhua Chen
  • SEALED BATTERY FUSE MODULE WITH ENERGY DISSIPATING CAP
    Publication number: 20200203110
    Abstract: A fuse module including a mounting block having a through-hole extending therethrough, a fuse including an upper portion disposed on a top of the mounting block and having a through-hole, a lower portion disposed on a bottom of the mounting block and having a through-hole, and a fusible element disposed adjacent a sidewall of the mounting block and connecting the upper portion to the lower portion, the fuse module further including a housing having a main body portion encasing the mounting block and the fuse, the main body portion having apertures in top and bottom surfaces thereof aligned with the through-hole of the mounting block, and a cap portion connected to the main body portion and disposed over the fusible element, the cap portion having surface features extending from an interior surface thereof for absorbing energy upon occurrence of an overcurrent condition in the fuse.
    Type: Application
    Filed: November 21, 2019
    Publication date: June 25, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Davide Mantoan, Massimiliano Tinto
  • FUSE DEVICE HAVING PHASE CHANGE MATERIAL
    Publication number: 20200194208
    Abstract: A fuse device including a fuse component, a first electrode, disposed on a first side of the fuse component, a second electrode, disposed on a second side of the fuse component, and a phase change component, disposed in thermal contact with the fuse component. The fuse component may comprise a fuse temperature, wherein the phase change component exhibits a phase change temperature, the phase change temperature marking a phase transition of the phase change component, and wherein the phase change temperature is less than the fuse temperature.
    Type: Application
    Filed: December 30, 2019
    Publication date: June 18, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Chun-Kwan Tsang, Jianhua Chen
  • Manufacturing method for foam fuse filler and cartridge fuse
    Patent number: 10685804
    Abstract: A method of making a fuse including inserting a fuse element into a cavity in a hollow fuse body, attaching a first end cap to the hollow fuse body and electrically connecting a first end of the fuse element to the first end cap, adding a mixture of particles including a melamine compound and a steatite of at least 2 times the melamine compound by weight—to the cavity such that the mixture of particles are disposed around the fuse element, and attaching a second end cap to the hollow fuse body and electrically connecting a second end of the fuse element to the second end cap.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: June 16, 2020
    Assignee: Littelfuse, Inc.
    Inventors: Roel Retardo, Albert Enriquez
  • LOW PROFILE INTEGRATED FUSE MODULE
    Publication number: 20200185180
    Abstract: A fuse module including a mounting block formed of an electrically insulating material, the mounting block having a rear wall extending from a base, a fuse plate including an electrically conductive bus bar disposed adjacent a rear surface of the rear wall, a fusible element electrically connected to the bus bar and disposed adjacent a front surface of the rear wall, and a fuse terminal electrically connected to the fusible element and extending onto a top of the base. The fuse module may further include an electrically conductive terminal post extending from the top of the base through the fuse terminal for facilitating connection to an electrical component.
    Type: Application
    Filed: February 13, 2020
    Publication date: June 11, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Julio Urrea, Gary Bold, Hector Perez, Matt Yurkanin, Alexander Conrad
  • STEERING POSITION ROTARY SENSOR ASSEMBLY
    Publication number: 20200182655
    Abstract: Embodiments herein are directed to steering position rotary sensors including a housing defining an internal cavity, a center shaft extending through the housing, and a gear coupled to the center shaft, wherein the gear is positioned off-center relative to a central rotational axis extending through the center shaft. The steering position rotary sensor may further include a magnet coupled to the gear, a first Hall effect sensor positioned adjacent the gear and concentric with the magnet, and a second Hall effect sensor positioned adjacent the center shaft and concentric with the central rotational axis, wherein the first Hall effect sensor and the second Hall effect sensor are separated by a magnetic shield.
    Type: Application
    Filed: December 10, 2018
    Publication date: June 11, 2020
    Applicant: Littelfuse, Inc.
    Inventor: Jay KRUGER
  • Wide operating range relay controller system
    Patent number: 10679811
    Abstract: Provided herein is an improved bi-stable relay operable with a relay control circuit including a boost converter and an energy storage device, which is used to switch the bi-stable relay. In some embodiments, the bi-stable relay includes a solenoid wound with multiple coil windings. A conductive plate (e.g., a bus bar) may be coupled to a plunger of the solenoid, and is provided with contacts on each end of the conductive plate. The conductive plate is configured to electrically engage and disengage the solenoid upon respective application of power to the solenoid. The control circuit causes the solenoid to remain in an open position when selectively energized by a pulse for moving and retaining the conductive plate of the plunger against the solenoid for allowing wide operating voltage and reduced operating power.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: June 9, 2020
    Assignee: Littelfuse, Inc.
    Inventor: James Riley
  • THIN PROFILE POWER SEMICONDUCTOR DEVICE PACKAGE HAVING FACE-TO-FACE MOUNTED DICE AND NO INTERNAL BONDWIRES
    Publication number: 20200176367
    Abstract: A packaged semiconductor device has a thin profile, two face-to-face mounted power semiconductor device dice, and no internal bond wires. A first semiconductor device die is mounted so that a gate pad is bonded to the bottom of a first lead, and so that a source pad is bonded to the bottom of a second lead. A second semiconductor device die identical to the first is mounted so that a gate pad is bonded to the top of the first lead, and so that a source pad is bonded to the top of the second lead. The backside drain electrodes of both dice are electrically coupled to a third lead. The third lead in one example has a forked-shape, and the two dice are disposed entirely between the two tines of the fork. After encapsulation, the three leads extend parallel to each other from a body portion of the package.
    Type: Application
    Filed: February 6, 2020
    Publication date: June 4, 2020
    Applicant: Littelfuse, Inc.
    Inventor: Nathan Zommer
  • Thin profile power semiconductor device package having face-to-face mounted dice and no internal bondwires
    Patent number: 10672691
    Abstract: A packaged semiconductor device has a thin profile, two face-to-face mounted power semiconductor device dice, and no internal bond wires. A first semiconductor device die is mounted so that a gate pad is bonded to the bottom of a first lead, and so that a source pad is bonded to the bottom of a second lead. A second semiconductor device die identical to the first is mounted so that a gate pad is bonded to the top of the first lead, and so that a source pad is bonded to the top of the second lead. The backside drain electrodes of both dice are electrically coupled to a third lead. The third lead in one example has a forked-shape, and the two dice are disposed entirely between the two tines of the fork. After encapsulation, the three leads extend parallel to each other from a body portion of the package.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: June 2, 2020
    Assignee: Littelfuse, Inc.
    Inventor: Nathan Zommer
  • METHOD OF MANUFACTURING AN OPEN-CAVITY FUSE USING A SACRIFICIAL MEMBER
    Publication number: 20200161068
    Abstract: A method of assembly of an open-cavity, wire-in-air fuse which provides improved manufacturing yield and fuse reliability, involving coiling, braiding or twisting a fusible element around a sacrificial member during the manufacturing process to provide support for the fusible element to prevent mechanical breakages and necking problems commonly encountered during manufacture.
    Type: Application
    Filed: November 21, 2018
    Publication date: May 21, 2020
    Applicant: Littelfuse, Inc.
    Inventors: Albert Enriquez, Victor Oliver Tabell, Lily Rosios