Patents Assigned to LSI Logic Corporation
  • Patent number: 7529968
    Abstract: A system, apparatus and method for storing and maintaining drive configuration data related to disk drives within a RAID. In one embodiment of the invention, configuration data is stored external to the disk drives within the RAID. A scan(s) is performed of the RAID disk drive configuration and/or configuration data on the disk drives. Mismatches or errors within the RAID disk drive configuration may be corrected using the configuration data stored external to the RAID disk drives.
    Type: Grant
    Filed: November 7, 2005
    Date of Patent: May 5, 2009
    Assignee: LSI Logic Corporation
    Inventor: Rajesh Prabhakaran
  • Publication number: 20090104735
    Abstract: Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.
    Type: Application
    Filed: December 17, 2008
    Publication date: April 23, 2009
    Applicant: LSI Logic Corporation
    Inventors: Choshu Ito, William M. Loh, Rajagopalan Parthasarathy
  • Patent number: 7499146
    Abstract: The tilt and position of individually controllable element are simultaneously adjusted to allow a greater range of contrasts to be achieved. This can also be used to compensate for cupping of individually controllable elements. Simultaneous adjustment of both the position and tilt of the individually controllable elements can be achieved by two electrodes operable over a range of values.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: March 3, 2009
    Assignees: ASML Netherlands B.V., ASML Holding N.V., LSI Logic Corporation
    Inventors: Kars Zeger Troost, Johannes Jacobus Matheus Baselmans, Arno Jan Bleeker, Louis Markoya, Neal Callan, Nicholas K. Eib
  • Patent number: 7496694
    Abstract: Circuits, systems and methods for improved monitoring of status of a storage controller in a storage system. A monitoring circuit external to the storage controller is adapted to couple to the internal bus structure within the storage controller. The monitoring circuit is adapted to sense status of the storage controller by monitoring bus transactions within the storage controller that indicate status of the control and/or of the storage system. In one aspect the monitoring circuit saves sensed status in a memory associated with the circuit. In another aspect, the monitoring circuit includes a network interface to transmit sensed/saved status to an external data processing system.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: February 24, 2009
    Assignee: LSI Logic Corporation
    Inventors: Sridhar Balasubramanian, Kenneth A. Hass
  • Patent number: 7489609
    Abstract: A method of writing a mark to an optical disc includes receiving data to be written and generating a control signal for a laser pulse having a melt period that transitions to a growth period wherein the melt period is characterized by a melt power and the growth period is characterized by a growth power.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: February 10, 2009
    Assignee: LSI Logic Corporation
    Inventors: Kunjithapatham Balasubramanian, Hans Henry Hieslmair, Raghuram Narayan, Judith C. Powelson, Jason M. Stinebaugh, David K. Warland, Ting Zhou
  • Publication number: 20090030660
    Abstract: A process is provided, which includes receiving geometrical information for a plurality of layers of an electronic structure within at least one output data file from an electronic structure design tool. At least one numerical analysis data file is created from the output data file, which contains the geometrical information and has a file structure compatible with a numerical analysis tool for characterizing the electronic structure. The numerical analysis tool is used to read the numerical analysis data file and generate a three-dimensional meshed geometric model of the electronic structure from the numerical analysis data file, wherein the model includes three-dimensional geometric models of each layer. The model can then be used, for example, to solve numerical thermal, mechanical or electrical equations that are applied to the model.
    Type: Application
    Filed: July 24, 2007
    Publication date: January 29, 2009
    Applicant: LSI Logic Corporation
    Inventors: Zeki Celik, Atila Mertol
  • Patent number: 7479703
    Abstract: An integrated circuit package includes an integrated circuit die having a circuit surface and a back surface opposite the circuit surface. A layer of ductile material is deposited on the back surface of the integrated circuit die.
    Type: Grant
    Filed: July 2, 2007
    Date of Patent: January 20, 2009
    Assignee: LSI Logic Corporation
    Inventor: Zafer Kutlu
  • Patent number: 7480881
    Abstract: A method and computer program for static timing analysis includes receiving as input minimum and maximum stage delays for two corners of an integrated circuit design. A path slack for a setup timing check is calculated from the minimum and maximum stage delays as a function of net clock cycle interval T_clk, launch path delay T_LP, capture path delay T_CP, data path delay T_DP, and a first delay de-rating factor Y1. A path slack for a hold timing check is calculated from the minimum and maximum stage delays as a function of the launch path delay T_LP, the capture path delay T_CP, the data path delay T_DP, and a second delay de-rating factor Y2. The path slack calculated for the setup timing check and for the hold timing check is generated as output.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: January 20, 2009
    Assignee: LSI Logic Corporation
    Inventors: Alexander Tetelbaum, Ruben Molina, Subodh Bhike
  • Publication number: 20080320066
    Abstract: An apparatus and method are provided in various illustrative embodiments for an integrated circuit chip that provides a fast, compact, and cryptographically strong random number generator. In one illustrative embodiment, an apparatus includes an initial random source, and a post-processing block in communicative connection with the initial random source. The post-processing block is configured to receive signals from the initial random source, to apply one or more finite field operations to the signals to generate an output, and to provide an output signal based on the output via an output channel, in this illustrative embodiment.
    Type: Application
    Filed: June 22, 2007
    Publication date: December 25, 2008
    Applicant: LSI Logic Corporation
    Inventors: Sergey Gribok, Alexander Andreev
  • Publication number: 20080294799
    Abstract: Methods and apparatus to provide a high throughput pipelined data path are described. In one embodiment, an apparatus may include three stages to process inbound data packets, e.g., to align one or more bits of data. Other embodiments are also described.
    Type: Application
    Filed: May 27, 2007
    Publication date: November 27, 2008
    Applicant: LSI LOGIC CORPORATION
    Inventor: Robert E. Ward
  • Patent number: 7456498
    Abstract: A method for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low frequencies. The wall of the fissure can be implemented with a heat spreader layer and can be connected to any AC ground such as VSS or VDD package planes. The fissures can also accommodate the ingress of an optical fiber, which allows for a direct interface with the transceivers. The direct optical fiber interface permits the removal of solder balls for high speed signal traces, with their respective vias. On-chip integrated LEDs or other similar light source transceivers can drive the high speed signal media. Selective deposition of low dielectric material can also improve the frequency response of high speed signal package traces.
    Type: Grant
    Filed: August 18, 2006
    Date of Patent: November 25, 2008
    Assignee: LSI Logic Corporation
    Inventors: Frantisek Gasparik, Steve Callicott
  • Patent number: 7458060
    Abstract: A method and system are provided for analyzing process window compliance of an integrated circuit design. Aspects of the present invention include identifying layout pattern configurations that have process windows that fail to meet respective local performance specifications; searching for any layout pattern configurations in a design that substantially match any of the identified layout pattern configurations; and modifying any matching layout pattern configurations found in the design to make the layout pattern configurations compliant with their respective process windows.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: November 25, 2008
    Assignee: LSI Logic Corporation
    Inventors: Ebo H. Croffie, Nicolas K. Eib
  • Patent number: 7454303
    Abstract: The present invention is directed to a method for compensating for process, voltage, and temperature variation without complex online/offline swapping of data paths requiring a dedicated FIFO(First-in First-out) buffer design. Delay cells are trained for each clock path (namely a Functional delay) and a spare delay cell is trained. A ratio is calculated for each Functional delay cell by dividing the Functional delay cells' setting into the spare delay cells' one-fourth cycle setting. These ratios reflect any process variation. Functional mode is then entered and a Master-Slave approach switched to, during which the spare delay cell repeats the training sequence continuously while the Functional delay cells delay the clocks from the RAM(Random Access Memory). Each Functional delay cell is updated at the end of each training sequence of the spare delay cell, compensating for voltage and temperature change, by dividing the ratio into the new spare delay cell one-fourth cycle setting.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: November 18, 2008
    Assignee: LSI Logic Corporation
    Inventors: Terence Magee, Thomas Hughes, Cheng-Gang Kong
  • Publication number: 20080272863
    Abstract: The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The package is implemented with a minimal redesign of the original design and not requiring any redesign of the signal trace pattern. The invention involves replacing top and bottom bond pads with via straps and then covering the top and bottom reference planes with a dielectric layer having conductive vias that electrically connect with the underlying via straps. Planes having the opposite polarity of the underlying reference plane are then formed on the dielectric layer. These planes include an array of bonding pads in registry with the vias. Decoupling capacitors are mounted to the top of the package and electrically connected with the plane on top of the package and the immediately underlying reference plane without the electrical connections to the capacitors passing through the signal planes of the package.
    Type: Application
    Filed: July 16, 2008
    Publication date: November 6, 2008
    Applicant: LSI LOGIC CORPORATION
    Inventors: LEAH MILLER, IVOR BARBER, ARITHARAN THURAIRAJARATNAM
  • Publication number: 20080270505
    Abstract: A combination of an infrequently-called tiny multiplication unit and a “differential” unit that quickly computes T (n+1) basing on known T n. The schedule (how often the multiplication unit is called) can be considered as a parameter of the algorithm. The proposed architecture of the “differential” unit is efficient both in terms of speed (delay) and area (gate count).
    Type: Application
    Filed: April 30, 2007
    Publication date: October 30, 2008
    Applicant: LSI LOGIC CORPORATION
    Inventors: Anatoli Bolotov, Mikhail I. Grinchuk
  • Patent number: 7444459
    Abstract: Methods and systems for generating storage related load factor information for load balancing of multiple virtual machines operable in a cluster of multiple physical processors (such as a blade center). Load factor information is generated within a storage system relating to operation of the storage system as a whole and relating to each of multiple storage controllers in the storage system. The information so generated in the storage system is communicated to a load balancing element associated with the multiple virtual machines. The load balancing element then utilizes the storage related load factor information, optionally in combination with other load factor information, to distribute or redistribute the operation of the multiple virtual machines over the plurality of physical processors.
    Type: Grant
    Filed: December 12, 2006
    Date of Patent: October 28, 2008
    Assignee: LSI Logic Corporation
    Inventor: Stephen B. Johnson
  • Publication number: 20080258700
    Abstract: An apparatus and method are provided for powering an integrated circuit chip with a supply voltage generated externally to the chip. An on-chip clock signal is generated with a ring oscillator fabricated on the integrated circuit chip. The supply voltage is altered as a function of a difference between a frequency of the on-chip clock signal and a reference clock frequency.
    Type: Application
    Filed: April 18, 2007
    Publication date: October 23, 2008
    Applicant: LSI Logic Corporation
    Inventors: Stefan G. Block, Stephan Habel
  • Patent number: 7440500
    Abstract: An apparatus generally having a first memory and a circuit is disclosed. The first memory may be used for a motion estimation of a current block. The circuit may be configured to (i) determine if a search window for the current block is at least partially outside a boundary of a picture stored in a second memory, (ii) copy a first plurality of reference samples in the search window from the second memory to the first memory and (iii) map a plurality of reads from the first memory for a plurality of pad samples to the reference samples in the first memory, where the pad samples are determined to be outside the boundary.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: October 21, 2008
    Assignee: LSI Logic Corporation
    Inventors: Eric C. Pearson, Harminder S. Banwait, Michael D. Gallant
  • Publication number: 20080250283
    Abstract: A scannable flip-flop and method are provided. The flip-flop includes a clock input, a normal data input, a test data input, a normal data output and a scan data output. The flip-flop has a normal operating mode during which the normal data output is enabled and the scan data output disabled and has a scan-shift mode during which the normal data output is disabled and the scan data output is enabled.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 9, 2008
    Applicant: LSI Logic Corporation
    Inventors: Stefan G. Block, Stephan Habel
  • Publication number: 20080250176
    Abstract: Methods and apparatus to enhance performance of Serial Advanced Technology Attachment (SATA) disk drives in Serial-Attached Small Computer System Interface (SAS) domains are described. In one embodiment, a data packets and/or commands communicated in accordance with SAS protocol may be converted into SATA protocol. Other embodiments are also described.
    Type: Application
    Filed: April 9, 2007
    Publication date: October 9, 2008
    Applicant: LSI LOGIC CORPORATION
    Inventors: Matthew John Pujol, Luke Everett McKay