Abstract: An integrated circuit device with reduced noise is described. In traditional simultaneous output switching integrated circuits the noise is proportional to the number of concurrently switching outputs. This excessive supply noise can cause the integrated circuit to malfunction through the loss of data. In the present invention, switching supply noise is reduced in the device without increasing the number of input-output pins by synchronously skewing the output driver. In a preferred embodiment, flip-flops are used to control the phase of the switching outputs in order to reduce the noise and instantaneous power by the number of phase assignments.

Abstract: A structure for receiving electrical signals near a central portion of the structure and distributing the electrical signals to a peripheral portion of the structure. The structure has a first set of contacts arranged in an array near the central portion of the structure. Electrically conductive traces connect the first set of contacts to a second set of contacts, where each of the electrically conductive traces has at least a first segment, a second segment, and a third segment. The first segment of each of the electrically conductive traces has relatively narrow width and spacing. The first segment of each of the electrically conductive traces is connected on a first end of the first segment to one of the first set of contacts and on a second end of the first segment to the second segment of each of the electrically conductive traces. The second segment of each of the electrically conductive traces has relatively intermediate width and spacing.

Abstract: Increased resolution is available from acid-catalyzed photoresist used in fabricating integrated circuits by inhibiting chemically-basic contaminants from contacting the photoresist placed above an IC structure which emits those chemically-basic contaminants. The inhibition can result from physical barrier characteristics of a barrier layer placed between the contaminant-emitting surface and the overlying layer of photoresist, or the layer of barrier material may contain acid moieties which chemically neutralize the emitted chemically-basic contaminants before the contaminants reach the photoresist.

Abstract: An ADSL central office transmission system for transmitting downstream DMT signals to a plurality of remote ADSL transceiver is disclosed. The system includes a DMT digital signal transceiver that generates a time division multiplexed digital signal that includes a plurality of DMT signals to be sent on a plurality of ADSL lines. A digital to analog converter converts the time division multiplexed digital signal into a time division multiplexed analog signal that includes a plurality of analog DMT signals. The analog to digital converter has an output that outputs the time division multiplexed analog signal. A switch selectively connects the output of the digital to analog converter to each of a plurality of transmitters. The transmitters are configured to drive the plurality of ADSL lines. Thus, the plurality ADSL lines are driven by the plurality of analog DMT signals.

Abstract: Presented in this invention is a fabricating method and its array organization for a high-density twin MONOS memory device integrating a twin MONOS memory cell array and CMOS logic device circuit.

Abstract: A low-profile fluorescent luminaire for attachment to a suspended ceiling and methods for retrofitting the luminaire to an existing lighting system. The low-profile fluorescent luminaire has lightweight “I”-shaped framework comprising a pair of transversely-extending end plates attached adjacent to opposed longitudinal ends of a longitudinally-extending spine. The spine and the end plates have a substantially coplanar arrangement to provide a low-profile structure that closely conforms to the ceiling. The “I”-shaped framework supports a reflector positioned below the spine and end plates when the luminaire is in a supported functional position. The low-profile luminaire can be retrofitted to a suspended ceiling to replace the existing light fixtures or to supplement the light output of an existing lighting system without modifying or removing the existing lighting fixtures.

Abstract: A thermally stable inter-metal dielectric for interlayer dielectric material has enhanced adhesiveness by introduction of an adhesive material. The adhesive material may reside only at the interface of the inter-metal dielectric or interlayer dielectric with adjacent metalization and polysilicon layers. A disclosed thermally stable intermetal dielectric is a fluorinated polymer such as polyfluoropyreline. A disclosed adhesive material is a highly polar material such as a thiofluorocarbon. These materials may be deposited by chemical vapor deposition by first activating fluoropyreline monomer and di(thiodifluoromethane) in a heated activation chamber to convert them to a form suitably reactive to form a polymeric dielectric on a wafer surface.

Abstract: Provided is a technique for circuit delay prediction in which blocks (preferably, non-overlapping blocks) are specified, each of the blocks including a portion of the circuit. Delay calculation collars (DCCs) are then defined for the blocks, the DCCs including complete dependency information required to calculate delay within the blocks. Next, delay is calculated for the blocks based on the DCCs and delay is calculated for the circuit based on the DCCs. The DCCs are then modified as necessary based on results of either or both of the delay calculation for the blocks or the circuit. The delay calculation and DCC modification steps are then repeated.

Abstract: A method for laying out input/output (I/O) pairs, each including an I/O cell and a pad, on an integrated circuit die. Size information is obtained for each of a first I/O pair and a second I/O pair. A minimum pad spacing criterion is obtained which specifies a minimum distance between the pad in the first I/O pair and an element of the second I/O pair, and the first I/O pair and the second I/O pair are laid out so as to satisfy the minimum pad spacing criterion. Also provided is a method for laying out pads for input/output (I/O) cells on an integrated circuit die in which size information is obtained for each of a first I/O cell pad and a second I/O cell pad. A minimum pad spacing criterion is obtained, and the first I/O cell pad and the second I/O cell pad are laid out so as to satisfy the minimum pad spacing criterion.

Abstract: Methods and associated apparatus for performing concurrent I/O operations on a common shared subset of disk drives (LUNs) by a plurality of RAID controllers. The methods of the present invention are operable in all of a plurality of RAID controllers to coordinate concurrent access to a shared set of disk drives. The plurality of RAID controllers operable enhance the performance of a RAID subsystem by better utilizing available processing power among the plurality of RAID controllers. Each of a plurality of RAID controllers may actively process different I/O requests on a common shared subset of disk drives. One of the plurality of controllers is designated as primary with respect to a particular shared subset of disk drives. The plurality of RAID controllers then exchange messages over a communication medium to coordinate concurrent access to the shared subset of disk drives through the primary controller.

Abstract: A method for fabricating an SRAM device having a standard well tub, where an additional well tub is deposited within the standard well tub. In this manner, the dopant concentration is increased in the well area of the SRAM device, which increases both the isolation punchthrough tolerance and the SER immunity of the device. The additional well tub is deposited to a depth that is shallower than the standard well tub. The additional well tub is deposited using an ion implantation process using the same mask set as that used for the threshold voltage adjustment deposition. Thus, no additional mask layer is required to deposit the additional well tub, and the all of the expenses normally associated with an additional mask layer are avoided.

Abstract: According to an embodiment of the invention, a DS-CDMA receiver receives an input signal which comprises a plurality of received signals that are received over a corresponding plurality of antennae. These signals are demodulated and sampled to create digital signals. The digital signals are decorrelated and each of the decorrelated signals are multiplied by a weight to derive weighted estimates. The weighted estimates are summed to generate an estimate of an information symbol. The weights are based upon a cross correlation between the decorrelated signals and a desired signal. According to the invention, this cross correlation may be derived by filtering a pilot signal.

Abstract: The present invention provides a method of memory cell selection and operation to obtain wide program bandwidth and EEPROM erase capability. Two storage sites within a memory cell can be simultaneously selected during read, program and erase. By proper biasing, each of the sites can be independently read and programmed. Also, during program, the source of energy to produce the current flow can be dynamically obtained from the stored charge on the selected bit line.

Abstract: A method and apparatus for switching clocks comprising a first circuit, a second circuit, and a third circuit. The first circuit may be configured to generate (i) a first signal in response to a select signal and a first clock signal, (ii) a second signal in response to said first signal and a second clock signal, (iii) a third signal in response to said select signal and said second clock signal, and (iv) a fourth signal in response to said third signal and said first clock signal. The second circuit may be configured to generate a first enable signal and a second enable signal in response to (i) said first signal, (ii) said second signal, (iii) said third signal, and (iv) said fourth signal. The third circuit may be configured to select (i) one or more first input signals, (ii) one or more second input signals, or (iii) a predetermined logic level as one or more output signals in response to said first enable signal and said second enable signal.

Abstract: A method of generating a back-annotated standard delay format file for designing integrated circuits with conditional/moded delays is disclosed that includes the steps of receiving as inputs a main input file, a conditional delay specifications file, and a selected option switch; inserting delay information from the conditional delay specifications file for each cell entry in the main input file according to the selected option switch into an output data structure; and generating the back-annotated standard delay format file from the output data structure.

Abstract: A linear assignment problem for an ordered system containing a plurality of boxes each containing an object having an associated penalty function is solved. A hierarchy contains a bottom level containing at least as many generalized boxes as there are boxes in the assignment problem, and top and intermediate levels. The objects of the assignment problem are placed in the generalized box of the top level. A first local task is executed to transition the contents of a generalized box of a higher level to at least two generalized boxes of the next lower level. A second local task is executed on the generalized boxes of the lower level to minimize a global penalty function. The first and second tasks are executed through successive iterations until all of the objects are placed in the generalized boxes in the bottom level in a layout having minimal penalty function.

Abstract: A method of planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom is described. The method includes the step of positioning a fluid flow surface relative to the wafer surface so that (i) a space is defined between the wafer surface and the fluid flow surface, and (ii) the elevated portion of the semiconductor wafer is positioned in the space. The method also includes the step of advancing a fluid within the space so that the fluid contacts and erodes the elevated portion of the semiconductor wafer. An associated apparatus for planarizing a wafer surface of a semiconductor wafer having an elevated portion extending therefrom is also described.

Abstract: A decoder for decoding convolutionally encoded precoding data is described. The precoding sequence consists of two subsequences t and b; the value of t corresponds to a convolutional encoder state at a particular time. The a priori probability Pr(ti) that the subsequence t has a particular value ti is generated. In the preferred embodiment, the metric function that is applied to a test sequence including ti is then biased by adding (&sgr;2/&agr;2) ln(Pr(ti)), where &agr;2 is the signal average energy per symbol of the transmitted data, &sgr;2 is the variance of the noise added by a channel through which the data is transmitted. The resulting metric is then used by an MLSE decoder such as a Viterbi decoder to decode the received data.

Abstract: A BGA package wherein power is provided to the die through power (Vdd) balls which are located in an inner most row of solder balls. By arranging the power balls in an inner most row, it is possible to reduce the distance the electrical signal has to travel to reach a power ring. Preferably, ground is provided to the die through ground (Vss) balls which are dispersed in a ball field around the periphery of the inner most row of power balls. Preferably, the ground balls are paired together, because by pairing the ground balls, it is possible to use only one via for two ground balls on the system board. This reduces the number of layers needed on the system board to route all of the pins and may make it possible, for example, to route more traces on the system board.

Abstract: A method for preparing at least one metal layer of an integrated circuit for visual analysis. The at least one metal layer to be visually analyzed is exposed, and a solution of nitric acid, acetic acid, and ammonium fluoride is applied to the at least one metal layer. The at least one metal layer is rinsed to substantially remove the solution, and the s integrated circuit is dried. The solution is made with one part nitric acid, three parts acetic acid, and two parts ammonium fluoride. The nitric acid is a solution of about seventy percent by weight in water, the acetic acid is glacial acetic acid, and the ammonium fluoride is a solution of about forty percent by weight in water. The solution is at a temperature of about seventy degrees Fahrenheit, and is applied to the at least one metal layer by swabbing the solution onto the layer for between about ten seconds and about fifteen seconds. The step of exposing the at least one metal layer includes sawing the integrated circuit along a desired cross section.