Abstract: A method is described for low temperature curing of silicone structures, including the steps of providing patterning photoresist structures on a substrate. The photoresist structures define at least one open region that can be at least partially filled with a condensation cure silicone system. Vapor phase catalyst deposition is used to accelerate the cure of the condensation cure silicone, and the photoresist structure is removed to leave free standing or layered silicone structures. Phosphor containing silicone structures that are coatable with a reflective metal or other material are enabled by the method.

Abstract: The escape surface of a light emitting element includes features that include sloped surfaces that have angles of inclination that are based on the direction of peak light output from the light emitting element. If the light output exhibits a number of lobes at different directions, the sloped surfaces may have a corresponding number of different angles of inclination. To minimize the re-injection of light into adjacent features, adjacent features may be positioned to avoid having surfaces that directly face each other. The features may be shaped or positioned to provide a pseudo-random distribution of inclined surfaces across the escape surface, and multiple roughening processes may be used.

Abstract: A device includes a light-emitting device (LED) having at least two vertical light-emitting sides, and a ring-shaped light guide having a bottom side, a top side comprising a light-emitting surface, an inner sidewall, and an outer sidewall defining an indentation having at least two vertical in-coupling surfaces mated to the at least two vertical light-emitting sides of the LED.

Abstract: An LED lamp includes a lamp base for insertion into a reflector of an automotive front lighting assembly; a panel extending from the lamp base with a first vertical side facing into one half of the reflector and a second vertical side facing into the other half of the reflector; a primary light source including a set of LED dies on each vertical side of the panel; a two-part shield including a first shield half shielding the LED dies on the first vertical side of the panel and a second shield half shielding the LED dies on the second vertical side of the panel. The two-part shield essentially has the form of a shield in a functionally equivalent filament lamp for providing a low beam. A lighting arrangement includes such an LED lamp; a reflector to receive the lamp; and an electrical interface for connecting to a controller.

Abstract: An LED circuit board, system, and method of using an LED configuration tool are described. The LED circuit board contains a microprocessor that wakes up when power is supplied from the LED configuration tool. The microprocessor determines that the LED configuration tool is present by sending a signal from one pin and detecting whether the same signal is received at another pin. When analog or digital programming information received from the LED configuration tool matches information in a table of the microprocessor, the programming information is stored to change the lighting parameters used by the LEDs. Feedback from the microprocessor to the LED configuration tool provides information regarding the status of programming the microprocessor.

Abstract: Systems, devices, and methods are disclosed in which one or more light sources, a detector, a processor and a controller are configured such that light from the one or more light sources improves the ability of a human or automated motor vehicle driver to identify and avoid pedestrians. The one or more light sources may provide spot illumination to moving objects or pedestrians on a road surface, with the spot illumination following the moving object or pedestrians along the portion of the road surface. The one or more light sources may project images on the ground or on other surfaces. The light source may be carried by a pedestrian or on personal transport used by a pedestrian. The light sources may be stationary and provide lighting for a pedestrian street crossing.

Abstract: Support structures and lighting systems including the support structure and a lighting device are described. A support structure includes an inner housing portion, an outer housing portion and connection members. The inner housing portion is transparent and has at least one portion shaped to conform to the lighting device. The outer housing portion includes at least a bottom wall, a first side wall and a second side wall, each having reflective inner surfaces, to form a container. The connection members are transparent and mechanically connected between the inner housing portion and the outer housing portion to support the inner housing portion and divide a region of the container between the inner housing portion and the outer housing portion into first cavities, each enclosed by at least one of the bottom wall, the first side wall or the second side wall and at least one of the connection members.

Abstract: A light emitting device is provided comprising: a body; a base portion configured for mounting the light emitting device to a reflector of a headlight or taillight, the base portion being arranged at a first end portion of the body; at least one light-emitting diode arranged at or inside of the body; at least one infrared light source provided at the body and configured to emit infrared light; and a thermal barrier arranged in between the at least one infrared light source and the at least one LED and configured to block at least part of radiation emitted from the at least one infrared light source towards the at least one LED.

Abstract: A light source includes a plurality of light emitting diodes, with at least some light emitting diodes sized between 30 microns and 500 microns. A plurality of micro-optics are associated with a light guide plate and sized less than 1 millimeter, with each micro-optic positioned over at least one of the plurality of light emitting diodes. At least some of the combinations of light emitting diode and micro-optics associated with the light guide plate are positioned within a distance to each other sufficient to provide a substantially uniform light beam.

Abstract: A lighting module and a lighting assembly provide high irradiance at long working distances. The lighting module includes at least two rows of multiple LEDs separated from each other by an intermediate area between the rows and one integral optical element on top of the at least two rows of multiple LEDs. The one integral optical element includes one collimator lens portion per row of LEDs extending along the row of LEDs. The collimator lens portions of different rows are merged together above the intermediate area. The collimator lens portions, seen in a direction perpendicular to the at least two rows, provide an off-axis focus for the one collimator lens portion, and focus light emitted from the at least two rows of multiple LEDs in a focus line extending parallel to the rows of LEDs at a focus distance above the optical element.

Abstract: A mounting substrate has a patterned metal layer defining a plurality of top metal bond pads for bonding to bottom metal bond pads of LED dies. A solder mask layer is formed over the mounting substrate, where the mask has openings that expose the top metal bond pads and protects metal traces on the substrate. The mask layer is a highly reflective white paint. The exposed top metal bond pads are then wetted with solder. The LED dies' bottom metal bond pads are then soldered to the exposed top metal bond pads, such that the mask layer surrounds each LED die to reflect light. A reflective ring is affixed to the substrate to surround the LED dies. A viscous phosphor material then partially fills the ring and is cured. All downward light by the LED dies and phosphor is reflected upward by the ring and solder mask layer.

Abstract: A method of separating a wafer including rows of light emitting devices is described. Dicing streets are provided on the wafer such that a respective one of the dicing streets is provided between each of the rows of light emitting devices on the wafer. The wafer is broken along a first one of the dicing streets to separate a first portion of the wafer from a remaining portion of the wafer. The first portion of the wafer includes more than one of the rows of light emitting devices. The first portion of the wafer is broken along a second one of the dicing streets to separate a second portion of the wafer from the first portion of the wafer.

Abstract: A light-emitting device is disclosed that includes a substrate; a semiconductor structure on the substrate, a wavelength conversion element on the substrate, opposite the semiconductor structure; an insulating side coating around the semiconductor structure; and a reflective side coating around the wavelength conversion element and the substrate, the reflective layer being stacked over the insulating side coating, the reflective side coating having a first surface that is over a second surface of the insulating side coating.

Abstract: Sidewall reflectors disposed on the sidewalls of an LED or pcLED comprise porous (for example, hollow) high refractive index light scattering particles dispersed in a transparent binder. The porous particles exhibit a high refractive index contrast and corresponding strong scattering at the interfaces between the porous particle material and one or more air-filled voids in each particle. These sidewall reflectors can provide light confinement with thin reflector structures, allowing close spacing between LEDs and pcLEDs, and may be advantageously employed in microLED arrays.

Abstract: A light-emitting apparatus can reduce a number of undriven or underdriven uLEDs in a uLED die. A method can include providing, by a power supply and during a first time, electrical power with a first voltage sufficient to operate a majority of micro light emitting diodes (uLEDs) of a uLED die to respective uLED drivers of the uLED die, driving the majority of uLEDs of the uLED die using the uLED drivers during the first time, providing, by the power supply and during a second time after the first time, electrical power with a second voltage, the second voltage higher than the first voltage and sufficient to operate uLEDs of the uLED die that are not operable by the first voltage, and driving the majority of the uLEDs and the uLEDs of the uLED die that are not operable by the first voltage during the second time.

Abstract: A method includes capturing a first image of a scene, detecting a face in a section of the scene from the first image, and activating an infrared (IR) light source to selectively illuminate the section of the scene with IR light. The IR light source includes an array of IR light emitting diodes (LEDs). The method includes capturing a second image of the scene under selective IR lighting from the IR light source, detecting the face in the second image, and identifying a person based on the face in the second image.

Abstract: A thin plastic light guide is formed to have cavities on one surface and TIR (total internal reflection) structures directly above the cavities. LEDs mounted on a printed circuit board are positioned in the cavities. The cavity walls are shaped to refract the LED light and direct the LED light toward the TIR structures to most efficiently make use of the TIR structures. The TIR structures may have a cusp or cone shape. The top ceiling of the cavities may be shaped to direct light at the TIR structure so as to leak through the TIR structure and blend the light with light leaking through surrounding portions of the light guide. The LEDs may be distributed only near the edges of the light guide or over the entire back surface of the light guide. A diffuser sheet may be laminated over the light guide to further mix the light.

Abstract: An LED backlight system having a plurality of backlight segments including an integral light waveguide, each backlight segment supporting a sidelight emitting LED. A light guide having a rectangular shape, a flat top surface, and a curved lower surface defines a cavity having a top and sidewalls, with the sidelight emitting LED positioned in the cavity. At least one of a reflective layer and a top out-coupling structure can be positioned between the top of the cavity and the sidelight emitting LED.

Abstract: The invention describes an imaging device (1) comprising an image sensor (2), an imaging lens (3), an infrared light source (5) to illuminate a scene (SC), and an infrared autofocus system (6) for providing an autofocus function, wherein the image sensor (2) comprises an array (21) of sensor pixels each arranged as dual pixel (22) comprising two separate pixel sensors (22a, 22b) per dual pixel (22) to record the image data (D1) as a sum signal from both pixel sensors (22a, 22b) and providing infrared data (D2) as individual signals from each of the two pixel sensors (22a, 22b) for phase contrast (PC) autofocusing, wherein an infrared filter (7) arranged between an aperture (4) of the imaging device (1) and an imaging sensor (2) and is adapted to locally transmit only a portion of the infrared light (IR) to the imaging sensor (2) by comprising at least one first area (71) arranged as infrared blocking area and at least one second area (72) arranged as infrared bandpass area.

Abstract: Light emitting devices (LEDs) and methods of manufacturing LEDs are described. A method includes providing a layer of a wavelength converting material on a temporary tape. The wavelength converting material includes at least a binder or matrix material, particles of a non-luminescent material, and phosphor particles and has a concentration of 60%-90% by volume particles of the non-luminescent material and phosphor particles. The layer of the wavelength converting material is separated on the temporary tape to form multiple wavelength converting structures, which are provided on an array type frame. Heat and pressure are applied to the wavelength converting structures on the array type frame.