Abstract: An LED light source is described herein, which comprises: a hollow heat sink having a top wall, a bottom opening, and a sidewall, the top wall including an upper surface and a lower surface, the upper surface having a central area and a peripheral area, and the top wall having at least one first hole in the peripheral area; an interposer being overmolded on the peripheral area and the lower surface, and extending through the at least one first hole; an LED package comprising at least one LED chip and mounted in the central area; an LED driver located within the hollow heat sink and positioned on a side of the interposer facing the bottom opening.

Abstract: A system, method and device for use as a reflector for a light emitting diode (LED) are disclosed. The system, method and device include a first layer designed to reflect transverse-electric (TE) radiation emitted by the LED, a second layer designed to block transverse-magnetic (TM) radiation emitted from the LED, and a plurality of ITO layers designed to operate as a transparent conducting oxide layer. The first layer may be a one-dimension (1D) distributed Bragg reflective (DBR) layer. The second layer may be a two-dimension (2D) photonic crystal (PhC), a three-dimension (3D) PhC, and/or a hyperbolic metamaterial (HMM). The 2D PhC may include horizontal cylinder bars, vertical cylinder bars, or both. The system, method and device may include a bottom metal reflector that may be Ag free and may act as a bonding layer.

Abstract: A device including a phosphor layer having a plurality of holes or pockets arranged within the phosphor layer to reduce lateral light transmission. The phosphor layer can be sized and positioned to extend over a plurality of LED emitter pixels.

Abstract: A light emitting diode (LED) array may include a first pixel and a second pixel on a substrate. The first pixel and the second pixel may include one or more tunnel junctions on one or more LEDs. The LED array may include a first trench between the first pixel and the second pixel. The trench may extend to the substrate.

Abstract: Devices and techniques are disclosed herein which include a die including side surfaces such that light emitted from the die can exit through the side surfaces. The die includes a first surface and a second surface opposite the first surface such that the distance between the first surface and the second surface is at least 100 micro meters. The die also include a wavelength converting material deposited external to the die such that the wavelength converting material covers the side surfaces. The wavelength converting material includes phosphor particles, a transparent risen carrier, and transparent particles configured to increase the volume of the wavelength converting material, the transparent particles having a refractive index (RI) that is similar to the RI of the transparent risen carrier.

Abstract: Embodiments of the invention include a III-nitride light emitting layer disposed between an n-type region and a p-type region, a III-nitride layer including a nanopipe defect, and a nanopipe terminating layer disposed between the III-nitride light emitting layer and the III-nitride layer comprising a nanopipe defect. The nanopipe terminates in the nanopipe terminating layer.

Abstract: A thin plastic light guide is formed to have cavities on one surface and TIR (total internal reflection) structures directly above the cavities. LEDs mounted on a printed circuit board are positioned in the cavities. The cavity walls are shaped to refract the LED light and direct the LED light toward the TIR structures to most efficiently make use of the TIR structures. The TIR structures may have a cusp or cone shape. The top ceiling of the cavities may be shaped to direct light at the TIR structure so as to leak through the TIR structure and blend the light with light leaking through surrounding portions of the light guide. The LEDs may be distributed only near the edges of the light guide or over the entire back surface of the light guide. A diffuser sheet may be laminated over the light guide to further mix the light.

Abstract: A distance measurement system includes two or more line pattern generators (LPGs), a camera, and a processor. Each LPG emits a line pattern having a first set of dark portions separated by a respective first set of bright portions. A first line pattern has a first angular distance between adjacent bright portions, and a second line pattern has a second angular distance between adjacent bright portions. The camera captures at least one image of the first line pattern and the second line pattern. The camera is a first distance from the first LPG and a second distance from the second LPG. The processor identifies a target object illuminated by the first and second line patterns and determines a distance to the target object based on the appearance of the target object as illuminated by the first and second line patterns.

Abstract: A flash light module (1) can include a housing (30) carrying at least a visible flash light emitter (10) to emit a flash light beam along an optical axis (OA) and at least one additional emitter (20) emitting non-visible light arranged at a second distance (D2) perpendicular to the optical axis (OA), where position and orientation of the additional emitter (20) and at least the second distances (D2) are suitably adapted as well as the housing (30) is suitably shaped in order to enable the additional emitter (20) to emit non-visible light (22) along a non-visible light emitting direction (IRD), wherein the additional emitter (20) is adapted to emit the non-visible light (22) to the environment suitable to remote communicate to, preferably to remote control, external electronic devices (5) comprising corresponding receivers for the non-visible light (22). A mobile device (100) can include the flash light module (1) and a method to operate the mobile device (100).

Abstract: Light Emitting Devices (LEDs) are fabricated on a wafer substrate with one or more thick metal layers that provide structural support to each LED. The streets, or lanes, between individual LEDs do not include this metal, and the wafer can be easily sliced/diced into singulated self-supporting LEDs. Because these devices are self-supporting, a separate support submount is not required. Before singulation, further processes may be applied at the wafer-level; after singulation, these self-supporting LEDs may be picked and placed upon an intermediate substrate for further processing as required. In an embodiment of this invention, protective optical domes are formed over the light emitting devices at the wafer-level or while the light emitting devices are situated on the intermediate substrate.

Abstract: This specification discloses lighting device the includes a combination of a royal-blue and blue pump LEDs with a mixture of phosphors to provide light with a high melanopic content and maximize an m/p ratio while maintaining high color fidelity, and a tunable lighting system including the lighting device.

Abstract: Systems, methods and devices are for optical imaging are described. A system includes a light source and a light detection unit. The light source includes a light-emitting device and a first spectral filter opposite the light emitting device. The first spectral filter includes at least one dielectric filter and has a first angular dependence of a transmission passband. The light source further includes at least one reflector adjacent side surfaces of the light emitting device. The light detection unit includes an optical sensor and a second spectral filter opposite the optical sensor. The second spatial filter has a second angular dependence of a transmission passband that is matched to the first angular dependence.

Abstract: A device includes an analog current division circuit configured to divide an input current into a first current and a second current, and a multiplexer array including a plurality of switches to provide the first current to a first of three colors of LEDs and the second current to a second of three colors of LEDs simultaneously during a first portion of a period, the first current to the second of three colors of LEDs and the second current to a third of three colors of LEDs simultaneously during a second portion of the period, and the first current to the first of three colors of LEDs and the second current to the third of three colors of LEDs simultaneously during a third portion of the period.

Abstract: A device includes a light-emitting device (LED) having at least two vertical light-emitting sides, and a ring-shaped light guide having a bottom side, a top side comprising a light-emitting surface, an inner sidewall, and an outer sidewall defining an indentation having at least two vertical in-coupling surfaces mated to the at least two vertical light-emitting sides of the LED.

Abstract: A projector-type vehicle headlamp not having a physical shade is disclosed. The vehicle headlamp comprises a first light source for emitting light, a lens through which the light exits the headlamp, and a first optics for receiving light from the first light source and directing the received light towards the lens, with the lens having a focal surface between the first optics and the lens, and with the lens having an optical axis. The first optics is configured to generate multiple images of the first light source on the focal surface above an intersection line of the focal surface with a reference plane, with the reference plane containing the optical axis of the lens, and with the reference plane enclosing an angle in the range of 0-45 degree with a horizontal plane when the headlamp is installed in a vehicle. The first optics is a curved reflector with an elliptical side edge.

Abstract: A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.

Abstract: A light emitting device includes an LED having a light emitting top surface and sidewalls. A phosphor structure is attached to the light emitting surface of the LED. The phosphor structure has a light emitting top surface facing away from the LED light emitting surface, and sidewalls. A light reflective material is arranged to cover the sidewalls of the LED and the phosphor structure. A light absorptive region is defined in the light reflective material around a perimeter of the light emitting surface of the phosphor structure. The light absorptive region may be spaced apart from the perimeter of the phosphor structure by a gap. The light absorptive region may be formed by ultraviolet laser illumination of the light reflecting material.

Abstract: A device, system and method for producing enhanced external quantum efficiency (EQE) LED emission are disclosed. The device, system and method include a patterned layer configured to transform surface modes into directional radiation, a semiconductor layer formed as a III/V direct bandgap semiconductor to produce radiation, and a metal back reflector layer configured to reflect incident radiation. The patterned layer may be one-dimensional, two-dimensional or three-dimensional. The patterned layer may be submerged within the semiconductor layer or within the dielectric layer. The semiconductor layer is p-type gallium nitride (GaN). The patterned layer may be a hyperbolic metamaterials (HMM) layer and may include Photonic Hypercrystal (PhHc), or may be a low or high refractive index material or may be a metal.

Abstract: LED lighting systems and vehicle headlamp systems are described. An LED lighting system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane, the substrate having a top surface, a bottom surface and side surfaces. First redistribution layers are provided on the top surface of the silicon backplane and the top surface of the substrate. Second redistribution layers are provided on the bottom surface of the silicon backplane and the bottom surface of the substrate. At least one via extends through the substrate between the first redistribution layers and the second redistribution layers and is filled with a metal material.

Abstract: A method for allowing a reflective layer to abut against an edge of a metal contact while preventing contamination of a metal contact for an LED die is provided. The method includes encapsulating an electrical contact (i.e. metal contact) via with a barrier layer prior to deposition of a reflective film layer. The barrier layer encapsulates the metal contact by defining a mask pattern with a larger size than the metal contact via, which prevents the metal contact from becoming contaminated by the reflective film. This encapsulation reduces contamination of the metal contact and also reduces the voltage drop during operation of the LED die.