Abstract: A semiconductor light emitting device (100;200;300;400,400B,400C;500;600;700) may have a reflective side coating (120;220;320;420;520;620;720) disposed on a sidewall (118;215;315;415,435;515) of a semiconductor light emitting device structure. Such a device may be fabricated by dicing a semiconductor structure to separate a semiconductor light emitting device structure and then forming a reflective side coating (120;220;320;420;520;620;720) on a sidewall (118;215;315;415,435;515) of the separated semiconductor light emitting device structure.

Abstract: Described are light emitting diode (LED) devices comprising a plurality of mesas defining pixels, each of the plurality of mesas comprising semiconductor layers, an N-contact material in a space between each of the plurality of mesas, a dielectric material which insulates sidewalls of the P-type layer and the active region from the metal. The plurality of mesas defines a matrix of pixels, the matrix of pixels is surrounded by a common electrode comprising a plurality of semiconductor stacks surrounded by a conducting metal. Each of the semiconductor stacks is inactive, and in one or more embodiments, comprises at least one layer of GaN.

Abstract: Described are light emitting diode (LED) devices comprising a plurality of mesas defining pixels, each of the mesas comprising semiconductor layers, an N-contact material in a space between each of the plurality of mesas, a dielectric material which insulates sidewalls of the P-type layer and the active region from the metal. A multilayer composite film is on the P-type layer, the multilayer composite film comprising: a current spreading layer on the P-type layer, the current spreading layer having a first portion and a second portion; a dielectric layer on the second portion of the current spreading layer; a via opening defined by sidewalls in the dielectric layer and the first portion of the current spreading layer; and a P-contact layer in the via opening on the first portion of the current spreading layer, the sidewalls in the dielectric layer, and on at least a portion of the dielectric layer.

Abstract: Described are light emitting diode (LED) devices comprising a plurality of mesas defining pixels, each of the mesas comprising semiconductor layers, an N-contact material in a space between each of the plurality of mesas, a dielectric material which insulates sidewalls of the P-type layer and the active region from the metal. A hard mask layer is above the semiconductor layers, the hard mask layer having a plurality of openings therein, each partially filled with a liner layer and partially filled with a P-metal material plug, the P-metal material plug having a width; and a passivation film is on the hard mask layer, the passivation film having a plurality of passivation film openings therein defining a width, the width of each passivation film opening being less than the width of a combination of the P-metal material plug and the liner layer.

Abstract: A light-emitting device assembly includes a concave optical collector, a light-emitting device, and a light-escape surface. The collector redirects incident light by reflection, scattering, or reradiation. The light-emitting device emits device output light to propagate within the optical collector. The light-escape surface extends across an open end of the collector and exhibits (i) incidence-angle-dependent transmission of light that decreases with increasing incidence angle, or (ii) transmissive redirection of light to propagate at an angle less than a corresponding refracted angle, that are imparted by an array of nano-antennae, a partial photonic bandgap structure, a photonic crystal, an array of meta-atoms or meta-molecules, or a multi-layer dielectric thin film.

Abstract: One or more light sources, one or more detectors, a processor, and a controller are configured to provide spot illumination that follows a moving object, a moving occupant, or a portion of a moving occupant in the vehicle.

Abstract: A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.

Abstract: Described are light emitting diode (LED) devices comprising a plurality of mesas defining pixels, each of the mesas comprising semiconductor layers, an N-contact material in a space between each of the plurality of mesas, a dielectric material which insulates sidewalls of the P-type layer and the active region from the metal. A current spreading layer is on the P-type layer, the current spreading layer having a first portion and a second portion; a hard mask layer above the second portion of the current spreading layer, the hard mask layer comprising sidewalls defining a hard mask opening; a liner layer conformally-deposited in the hard mask opening above the first portion of the current spreading layer and on the sidewalls of the hard mask layer; a P-metal material plug on the liner layer; a passivation layer on the hard mask layer; and an under bump metallization layer on the passivation layer.

Abstract: A method for producing a flexible lighting strip comprising multitude of functional elements, which are light-emitting diodes, comprise light-emitting diodes, or are interposers with light-emitting diodes. The functional elements are in at least two groups, each comprising at least two functional elements in electrical series connection. The groups are in an electrical circuit having at least an anode and a cathode track as outer lines. The functional elements are in an electrical parallel connection to the anode and cathode tracks. The groups are in a longitudinal arrangement so a first group's last functional element is next to a second group's first functional element. Each of the outer lines has a wire line having substantially circular wires that are bent building zones capable of receiving compressive and tensile stress. The electrical circuit provides a third wire line having a substantially circular wire as a center line arranged between the outer lines.

Abstract: The present disclosure relates to a lighting device comprising light-emitting elements such as light-emitting diodes arranged on a substrate. The object to provide a lighting device comprising multiple light-emitting elements and light guides, wherein the thermal sensitivity of the lighting device is reduced in a particularly simple manner, is solved in that the lighting device comprises: a lens with a light entry side and a light exit side; light guides, each light guide being arranged in optical contact to at least one of the light-emitting elements and being configured to guide light emitted by the at least one of the light-emitting elements towards the light entry side of the lens; and a transparent stabilizer element being arranged in mechanical contact to the light exit side of the lens, wherein the transparent stabilizer element is configured to define the shape of the light exit side of the lens at least in regions. The invention further refers to a method for producing a lighting device.

Abstract: A system may include a memory configured to store instructions and a processor. The processor may be configured to execute the instructions to cause the system to determine a PWM frequency of the input PWM signal and generate a first PWM signal to power a first light emitting diode (LED), a second PWM signal to power a second LED, and a third PWM signal to power a third LED. Each of the first PWM signal, the second PWM signal, and the third PWM signal may have the PWM frequency of the input PWM signal and may be in phase with the input PWM signal.

Abstract: In various embodiments, a device and method of dividing current among LED arrays is described. Each array has a sense resistor to sense a voltage of a current channel associated with the array. An analog or digital computational circuit with an op-amp and parallel RC circuit or microprocessor compares the voltages of the sense resistors and controls switches of the arrays accordingly. The analog circuit charges or discharges the capacitor to alter the output voltage used to control the switches. The microprocessor determines a ratio of the sensed voltages to generate the output voltage, maps a control signal to the ratio, directs input current to one or the other channel dependent on the control signal voltage and otherwise scales the input current between the channels. Other apparatuses, devices, and methods are described as well.

Abstract: Systems, devices, and methods are disclosed in which one or more light sources, a detector, a processor and a controller are configured such that light from the one or more light sources improves the ability of a human or automated motor vehicle driver to identify and avoid pedestrians. The one or more light sources may provide spot illumination to moving objects or pedestrians on a road surface, with the spot illumination following the moving object or pedestrians along the portion of the road surface. The one or more light sources may project images on the ground or on other surfaces. The light source may be carried by a pedestrian or on personal transport used by a pedestrian. The light sources may be stationary and provide lighting for a pedestrian street crossing.

Abstract: The invention relates to a light emitting device (LED), especially a LED at least partly embedded in transparent or translucent silicone fill, whereby the embedded LED is housed in a white silicone housing. Here and in the following, the wording transparent silicone fill always means a transparent or translucent silicone material. The invention further relates to a method for embedding the LED partly in a white silicone housing on the one hand and partly in transparent silicone fill on the other hand. The invention finally relates to the transparent silicone fill. The inner part of the LED device is at least partly embedded in transparent silicone fill, wherein the at least partly embedded LED device is housed in a white silicone housing comprising a white box silicone. A part of the inner part of the LED device is embedded in the white box silicone.

Abstract: A light-emitting apparatus can reduce flicker and retain power efficiency. A method can include driving, by a light emitting element (LEE) driver circuit, first, second, and third LEEs using a pulse width modulation (PWM) driving scheme to generate light of a first color, the first, second, and third LEEs configured to emit different colors, alternating, by the LEE driver circuit, between driving the first, second, and third LEEs using a hybrid driving scheme and the PWM driving scheme, and after alternating between driving the first, second, and third LEEs in the hybrid and PWM driving schemes, driving, by the LEE driver circuit, the first, second, and third LEEs using the hybrid driving scheme.

Abstract: A LED controller includes an image buffer to hold image data. An LED pixel forming a part of a large pixel array is activatable in response to image data, LDO state, and pulse width modulation module state. A logic module including a pixel diagnostic mode using an LDO bypass is connected to modify LDO state and allow direct addressing of the LED pixel for diagnostic purposes without needing to use image data from the image buffer.

Abstract: A light-emitting diode (LED) strip is disclosed. The LED strip includes: an input terminal for receiving a first reference signal, a first LED coupled to an end of a power bus and driven by a first current signal, the first current signal being supplied to the first LED via the power bus; a current-copying circuit arranged to control a flow rate of the first current signal based on the first reference signal; and a first switching element arranged to re-couple the first LED to the power bus when the first LED is disconnected from the end of the power bus as a result of the LED strip being cut at a first location.

Abstract: A vehicle headlamp system includes a vehicle supported power and control system including a data bus. A sensor module can be connected to the data bus to provide information related to environmental conditions or information relating to presence and position of other vehicles and pedestrians. A separate headlamp controller can be connected to the vehicle supported power and control system and the sensor module through the bus. The headlamp controller can include an image frame buffer that can refresh held images at greater than 30 Hz speed. An active LED pixel array can be connected to the headlamp controller to project light according to a pattern and intensity defined by the image held in the image frame buffer and a standby image buffer can be connected to the image frame buffer to hold a default image.

Abstract: A light emitting device may comprise a cup having a wall extending from a first area of the cup to a second area of the cup. The wall is formed from or coated with a reflective material. The light emitting device may comprise a light extraction bridge extending beyond an outer diameter of at least a portion of the wall for directing light into the air. The light may be produced by an LED die mounted at the second area of the cup such that at least some of a light emitted from the LED die exits the cup, having been reflected from the wall and the light extraction bridge.

Abstract: A light emitting device comprises a detector circuit and a light emitting diode (LED) die. The LED die includes a semiconductor stack grown on a substrate. The LED includes an emitter segment formed from one segment of the semiconductor stack. The LED die includes a photosensor segment formed from another segment of the semiconductor stack. The LED die includes a segmentation layer formed between the emitter segment and the photosensor segment. The segmentation layer electrically isolates the emitter segment from the photosensor segment. The LED die includes first electrodes configured to provide power to energize the emitter segment. The LED die includes second electrodes configured to send the current to the detector circuit. The detector circuit is configured to convert the current to a signal which provides operational feedback with respect to the emitter segment.