Abstract: Systems are described herein. A system includes a thermally conductive plate and multiple light-emitting devices (LEDs) on a surface of a substrate. The substrate is thermally coupled to the thermally conductive plate and includes first electrical power contacts on the surface. The system also includes an electronics board having second electrical power contacts. The electronics board is on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed.

Abstract: A LED controller for an LED pixel array includes a serial interface to an external data bus, along with an address generator connected to the serial interface and the LED pixel array. An image frame buffer is connected to the interface to receive image data and further connected to the address generator to receive an image frame buffer address. A command and control module is connected to the serial interface and configured to modify image frame buffer output signals. A calibration data storage module is connected to the command and control module to store calibration data related to pixel voltage response in the LED pixel array and enable modification of voltage provided by the dynamic power supply at least in part based on the image presented by the LED pixel array.

Abstract: Methods of manufacturing light-emitting devices are described herein. A method includes obtaining a packaging substrate. The packaging substrate includes an embedded metal inlay, vias in the packaging substrate and contacts on a bottom surface of the packaging substrate, each electrically coupled to a respective one of the vias. The method also includes forming a hybridized device, attaching a bottom surface of the hybridized device to a top surface of the metal inlay, and wirebonding a top surface of the hybridized device to a stop surface of the packaging substrate using a plurality of conductive connectors.

Abstract: Light-emitting devices are described herein. A device includes a packaging substrate having a top surface and a bottom surface and a hybridized device having a bottom surface on the top surface of the packaging substrate. The hybridized device includes a silicon backplane that includes input/output (I/O) pins and a light-emitting diode (LED) array having a bottom surface on a top surface of the silicon backplane. Passive components are disposed on the top surface of the packaging substrate. Conductive connectors are electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.

Abstract: Light-emitting devices are described herein. A light-emitting device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening in the packaging substrate and conductive vias. The metal inlay is thermally coupled to the bottom surface of the hybridized device. Conductive contacts are disposed on a bottom surface of the packaging substrate, each electrically coupled to one of the plurality of conductive vias. Conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate. Each of the conductive connectors is electrically coupled to a respective one of the conductive contacts on the bottom surface of the packaging substrate by a respective on of the conductive vias.

Abstract: A holder for a vehicle signaling light and a vehicle signaling light assembly are described. A holder for a vehicle signaling light includes a carrier rail with a hollow section. The carrier rail is coupled with at least two guiding structures. The guiding structures are arranged to guide a flexible light distribution fiber within the hollow section.

Abstract: A method according to embodiments of the invention includes, for a field of view comprising a plurality of portions, determining an amount of light for each portion. LEDs corresponding to each portion are selectively energized over a plurality of time periods, such that a sum of illumination generated by each LED during the plurality of time periods equals the determined amount of light. An image of the field of view is captured, for example by a camera.

Abstract: Systems for LED illumination products. Solutions to the problems attendant to delivering a white-appearing LED product without diminishing efficiency of white light generation are presented. Devices are designed and manufactured that include a specially-formulated off-state white-appearing layer to the LED apparatus. The composition of the specially-formulated off-state white-appearing layer is tuned for high-efficiency during the on-state.

Abstract: A LED controller for an LED pixel array includes an image frame buffer to receive image data and a standby image buffer connected to the image frame buffer to hold a standby image. A command and control module connected is configured to substitute the standby image in the standby image buffer for the image in the image frame buffer when image data is unavailable.

Abstract: A light emitting diode (LED) array may include a first pixel and a second pixel on a substrate. The first pixel and the second pixel may include one or more tunnel junctions on one or more LEDs. The LED array may include a first trench between the first pixel and the second pixel. The trench may extend to the substrate.

Abstract: A light emitting device comprising a coating layer is disclosed. A reflective layer is on a base. A structure on the reflective layer has a first opening there through. The first opening exposes a surface of the reflective layer. A light emitting diode (LED) is on the exposed surface of the reflective layer. A coating layer is on the exposed surface of the reflective layer, at least a portion of the structure inside the first opening, and at least a portion of the LED. A second opening is in the coating layer. The second opening exposes a portion of the reflective layer. A conductive element electrically couples the LED to the base through the portion of the reflective layer exposed by the second opening in the coating layer.

Abstract: An LED module includes a substrate having a high thermal conductivity and at least one LED die mounted on the substrate. A wavelength conversion material, such as phosphor or quantum dots in a binder, has a very low thermal conductivity and is formed to have a relatively high volume and low concentration over the LED die so that the phosphor or quantum dots conduct little heat from the LED die. A transparent top plate, having a high thermal conductivity, is positioned over the wavelength conversion material, and a hermetic seal is formed between the top plate and the substrate surrounding the wavelength conversion material. The LED die is located in a cavity in either the substrate or the top plate. In this way, the temperature of the wavelength conversion material is kept well below the temperature of the LED die. The sealing is done in a wafer level process.

Abstract: The disclosure relates to an optical element for a lighting device, the optical element comprising a body capable of conducting light, wherein the body comprises: a light incoupling surface; a light outcoupling surface; and side faces situated opposite to each other and extending from the light incoupling surface to the light outcoupling surface; wherein at least one of the side faces has an aspherical shape at least in sections. The at least one side face having the aspherical shape is capable of focussing light originating from a first point on the light incoupling surface to a second point on the light outcoupling surface by internal reflection at least in the sections. The optical element may serve in the lighting device as a precollimator with configurable intensity distribution of the precollimated light. The shape of the optical element may be easily determined for various dimensions of the optical element.

Abstract: A device comprising a light emitting diode (LED) substrate, and a meta-molecule wavelength converting layer positioned within an emitted light path from the LED substrate, the a meta-molecule wavelength converting layer including a plurality of nanoparticles, the plurality of nanoparticles configured to increase a light path length in the wavelength converting layer.

Abstract: An illumination module comprises a semiconductor light source and a light guide, which comprises a solid body with essentially parallel entry and exit faces and side faces extending between the entry and exit faces; and wherein the entry face receives light emitted by the semiconductor light source; the exit face is offset from the entry face and the area of the exit face exceeds the area of the entry face; a first side face comprises a uniform plane subtending an angle of inclination to the entry face; a second side face, opposite to the first side face, comprises a plurality of offset sub-faces, each sub-face subtends an angle of inclination relative to the entry face; and the inclined faces are formed so that the direction of light leaving the exit face is essentially the same as the direction of light entering the entry face.

Abstract: A flexible lighting strip comprises a multitude of light-emitting diodes (LEDs) and is arranged to bend around at least two, preferably three, linear independent axes. The LEDs are arranged in at least two groups, wherein each group comprises at least two LEDs arranged in an electrical series connection. The groups are arranged in an electrical parallel connection to an anode and cathode track. The groups are arranged in a longitudinal arrangement such that a last LED of a first group is arranged next to the first LED of a second group, and are mechanically coupled via an electrically isolated coupling structure such that a stiffness of the flexible lighting strip between the last LED of the first group and the first LED of the second group is matched to a mechanical stiffness between neighboring LEDs comprised by one of the first or second.

Abstract: The invention describes a depth map generator comprising an array comprising a plurality of individually addressable array elements, wherein an array element comprises a semiconductor emitter or a reflector arranged to reflect light emitted by a semiconductor emitter; a driver realised to switch an array element according to a predefined illumination pattern; a number of image sensors, wherein an image sensor is arranged to detect light reflected from a scene irradiated by the irradiation pattern; and a processing unit realised to compute a depth map of the scene on the basis of a light pattern detected by an image sensor. The invention further describes an irradiation arrangement for use in such a depth map generator; a method of generating a depth map of a scene; and a device comprising such a depth map generator.

Abstract: Light modules and methods of forming light modules are disclosed. A light module includes a first plurality and a second plurality of light emitting elements configured to emit, respectively, a first light and a second light, and both arranged on a substrate. An encapsulation layer is disposed over the first and second plurality of the light emitting elements, and a wavelength converting element is dispersed in the encapsulation layer. A concentration of the wavelength converting element in the encapsulation layer varies, is larger over the first plurality of light emitting elements and is smaller over the second plurality of light emitting elements.

Abstract: Multi-color flash with image post-processing that uses a camera device with a multi-color flash and implements post-processing to generate images is described. In one aspect, the multi-color flash with image post-processing may be implemented by a controller configured to control a camera and flashes of at least two different colors. The controller may be configured to cause the camera to acquire a first image of a scene while the scene is being illuminated with the first flash but not the second flash, then cause the camera to acquire a second image of the scene while the scene is being illuminated with the second flash but not the first flash, and generate a final image of the scene in post-processing based on a combination of the first image and the second image.

Abstract: A lighting engine, system, and method of fabrication are described. The system includes a chassis with a ridge extending from a bottom that defines inner and outer cavities. A flexible printed circuit (FPC) is disposed in contact with a wall of the inner and outer cavities and on the ridge top and is connected to wiring retained within bosses in the outer cavity. LEDs are mounted on the FPC to emit light toward a center of the cavity. A light guide disposed has an edge that opposes the LEDs and receives light emitted by the LEDs. The FPC has a polyimide insulator coupled with a pressure-sensitive adhesive (PSA), a copper layer on the polyimide insulator, and a high-reflectivity white coverlay on the copper layer. Other apparatuses, systems, and methods are also disclosed.