Abstract: A solid state light-emitting device (LED) lighting apparatus comprising a leadframe assembly comprising leadframes spaced apart at a pitch, each leadframe comprising at least one pad, interconnects each linking two adjacent leadframes, LEDs mounted on the leadframes, and bidirectional spreading lenses disposed about the LEDs, each bidirectional spreading lens having a spreading axis and a null axis perpendicular to the spreading axis, each bidirectional spreading lens directing more light in opposite directions along the spreading axis than the null axis, the spreading axis being aligned along the length of the stretched leadframe assembly.

Abstract: The invention provides a lighting unit comprising a light source, configured to generate light source light and a luminescent material, configured to convert at least part of the light source light into luminescent material light, wherein the light source comprises a light emitting diode (LED) and wherein the luminescent material comprises a phosphor comprising M2AX6 doped with tetravalent manganese, wherein M comprises monovalent cations, at least comprising potassium and rubidium, wherein A comprises a tetravalent cation, at least comprising silicon, wherein X comprises a monovalent anion, at least comprising fluorine, and wherein M2AX6 has the hexagonal phase.

Abstract: In one embodiment, a solid cylindrical tablet is pre-formed for a reflective cup containing an LED die, such as a blue LED die. The tablet comprises uniformly-mixed phosphor particles and transparent/translucent particles of a high TC material, such as quartz, in a hardened silicone binder, where the index of refraction of the high TC material is matched to that of the silicone to minimize internal reflection. Tablets can be made virtually identical in composition and size. The bulk of the tablet will be the high TC material. After the tablet is placed in the cup, the LED module is heated, preferably in a vacuum, to melt the silicone so that the mixture flows around the LED die and fills the voids to encapsulate the LED die. The silicone is then cooled to harden.

Abstract: A method, apparatus, and system are disclosed for increasing light extraction efficiency in a light guide optical system. The light guide optical system may comprise a light emitting source. The light emitting source may be, for example, a light-emitting diode (LED) or plurality of LEDS. The light guide optical system may also comprise a light guide plate (LGP). The LGP may include light extraction features located on surfaces of the LGP. The LGP may also include a shaped injection surface on an input surface of the LGP. The shaped injection surface may be angled to deviate near-parallel light emitted from the LED to enable the near-parallel light emitted from the LED to be extracted from the LGP via the light extraction features. The shaped injection surface may be a split edge (i.e. a V-groove) or a curved edge.

Abstract: The present invention relates to an optical lens package, said lens package (1) having a lens body comprising a base (7), a central surface section (4) opposite to the base (7) and a peripheral surface section extending between the central surface section (4) and the base (7). The central surface section (4) is centered with respect to the optical axis (5) of the lens package (1) and has a convex shape in at least a first cross-sectional plane including the optical axis (5). At least a portion (6) of the peripheral surface section has a concave shape in said first cross-sectional plane. With such a design of the optical lens package (1) in addition to a central collimated light bundle with high luminous flux also side visibility is achieved by means of the concave portion (6) up to a high angle with respect to the optical axis (5). This side visibility is achieved without additional optics thus lowering the production costs of such an optical system compared to a solution using additional optics.

Abstract: Embodiments of the invention include an n-type region, a p-type region, and a light emitting layer disposed between the n-type region and the p-type region. The light emitting layer is a III-V material comprising nitrogen and phosphorus. The device also includes a graded region disposed between the light emitting layer and one of the p-type region and the n-type region. The composition of materials in the graded region is graded.

Abstract: A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. The semiconductor structure is disposed between a window layer and a light-directing structure. The light-directing structure is configured to direct light toward the window layer; examples of suitable light-directing structures include a porous semiconductor layer and a photonic crystal. An n-contact is electrically connected to the n-type region and a p-contact is electrically connected to the p-type region. The p-contact is disposed in an opening formed in the semiconductor structure.

Abstract: A light-emitting device is disclosed. The light emitting device includes an electron blocking layer, a hole blocking layer, wherein at least a portion of the hole blocking layer is arranged to have a compressive strain, and an active layer disposed between the hole blocking layer and the electron blocking layer.

Abstract: An LED die conformally coated with phosphor is mounted at the base of a shallow, square reflector cup. The cup has flat reflective walls that slope upward from its base to its rim at a shallow angle. The reflective walls are in contact with the phosphor. A clear encapsulant completely fills the cup to form a smooth flat top surface. Emissions from the LED die or phosphor at a low angle are totally internally reflected at the flat air-encapsulant interface toward the cup walls. This combined LED/phosphor light is then reflected upward by the walls and out of the package. Since a large percentage of the light emitted by the LED and phosphor is mixed by the TIR and the walls prior to exiting the package, the color and brightness of the reflected light is fairly uniform. The encapsulant is intentionally designed to enhance TIR to help mix the light.

Abstract: In a method according to embodiments of the invention, a light emitting structure comprising a plurality of light emitting diodes (LEDs) is provided. Each LED includes a p-contact and n-contact. A first mount and a second mount are provided. Each mount includes anode pads and cathode pads. The anode pads are aligned with the p-contacts and the cathode pads are aligned with the n-contacts. The method further includes mounting the light emitting structure on one of the first and second mounts. An electrical connection on the first mount between the plurality of LEDs differs from an electrical connection on the second mount between the plurality of LEDs. The first mount is operated at a different voltage than the second mount.

Abstract: In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure.

Abstract: In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure.

Abstract: A tunable illumination system is disclosed which splits a single channel output into three by means of current steering and/or time division and multiplexing techniques. More particularly, the tunable light system may split the input current into three pulse-width modulated (PWM) channels. The individual duty cycles of the PWM channels may be adjusted based on a control signal that is received via a control signal interface. The control signal interface may include a switch and/or other circuitry that is manipulated by the user when the user wants to change the color of light that is output by the illumination system.

Abstract: Embodiments of the invention include a semiconductor light emitting device including a semiconductor structure. The semiconductor structure includes a light emitting layer disposed between an n-type region and a p-type region. A wavelength converting structure is disposed in a path of light emitted by the light emitting layer. A diffuse reflector is disposed along a sidewall of the semiconductor light emitting device and the wavelength converting structure. The diffuse reflector includes a pigment. A reflective layer is disposed between the diffuse reflector and the semiconductor structure. The reflective layer is a different material from the diffuse reflector.

Abstract: Embodiments of the invention include a luminescent structure including an lnxZnyP core, wherein 0<y/x<10, and wherein the core comprises an alloy including both In and Zn, and a shell disposed on a surface of the core, wherein a difference between a lattice constant of the shell and a lattice constant of the core relative to the lattice constant of the shell is less than 1%.

Abstract: A method and apparatus are described herein for capturing images of plants using a broad spectrum camera while illuminating the plants with specific light wavelengths from light sources such as light emitting diodes (LEDs). A first light source may be activated, wherein the first light source emits light having a first spectrum toward a bed of a plurality of plants. On a condition that the first light source is activated, a first image of the bed of the plurality of plants may be captured with a broad spectrum camera. A second light source may be activated, wherein the second light source emits light having a second spectrum toward the bed of the plurality of plants. On a condition that the second light source is activated, a second image of the bed of the plurality of plants may be captured with the broad spectrum camera.

Abstract: A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.

Abstract: A method of manufacturing of a Light Emitting Device that has increased reliability and efficiency. Specifically, the disclosed methods uses Atomic Layer Deposition to improve the thermal conductivity between the ceramic plate and the LED, decrease the amount of organic contamination, and increase the efficiency of the optical output of the Light Emitting Device.

Abstract: A light-emitting device is described herein. The device includes a semiconductor structure comprising a III-nitride light emitting layer disposed between an n-type region and a p-type region. The device also includes a metal layer with openings formed therein and filled with an insulating material. The openings separate the metal layer into a first portion that is electrically isolated from a second portion. The first portion is coupled to the n-type region and the second portion coupled to the p-type region. The device also includes conductive stacks. A first surface of each of the conductive stacks contacts a surface of the metal layer opposite the semiconductor structure. A respective gap is positioned between each of the conductive stacks. A body is in direct contact with a second surface of each of the conductive stacks that is opposite the first surface.

Abstract: A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is mounted on the flex circuit. The LED die has a thick transparent substrate forming a “top” exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens is affixed to the top of the reflector. The lens has a generally rectangular convex surface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.