Abstract: A method for manufacturing light emitting devices, comprising: providing a package body including: (i) a reflector cup defining a cavity and (ii) a plurality of metal pads disposed at a bottom surface of the cavity; performing reservoir stencil printing to deposit a respective solder pattern on each of the metal pads, the reservoir stencil printing being performed using a 3D electroform stencil that is placed over the reflector cup, the 3D electroform stencil including a lip configured to engage one or more sidewalls of the reflector cup, and a reservoir extending away from the lip and into the cavity; placing an LED die on the solder patterns that are formed on the metal pads and performing reflow soldering to attach the LED die to the metal pads.

Abstract: A system including an image capture system with a sensing efficiency that varies over a field of view of the image capture system may employ shaped illumination to compensate for the variation in the sensing efficiency. An illuminator may be configured to illuminate the field of view of the image capture system with illumination shaped to have higher intensity where the sensing efficiency is lower, e.g., at the periphery of the field over view. The imaging system may thus provide image data with more uniform signal-to-noise ratios. Image data from an illuminated scene may be manipulated using data from a non-illuminated scene to produce improved image data.

Abstract: Light emitting diodes (LEDs) having a sensor segment for operational feedback are described. A semiconductor stack is grown on a sapphire substrate. The semiconductor stack is segmented to form at least two segments, where one segment senses light emissions (photosensor segment) from the other segment (emitter segment). The segmentation is achieved by etching a trench or forming a segmentation layer between the segments. One segment can alternate on a predetermined basis between functioning as a photosensor segment or as an emitter segment. The photosensor segment can detect either a side light ray emitting from the emitter segment or a reflected light ray from a substrate. The photosensor segment generates a current based on the detected light ray. A detector circuit can provide operational feedback based on the sensed current.

Abstract: LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.

Abstract: An elongated lens (300) is formed with a trough (310) along the long axis on the light emitting surface of the lens. The elongated lens (300) may include a curved wall (325) about its perimeter, and a smooth transition (317) between the curved wall (325) and the trough (310). The trough (310) may include a concave shape along both the long axis and the short axis, although the radius of curvature of the concave shape may differ between the long and short axes. The eccentricity of the illumination pattern may be controlled by the size of the trough (310) and these radii of curvature.

Abstract: Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, the light emitting elements of a particular color are encapsulated with a transparent encapsulant, while the light emitting elements of a different color are encapsulated with a wavelength conversion encapsulant. In another embodiment of this invention, a particular set of light emitting elements of different colors is encapsulated with a different encapsulant than another set of light emitting elements.

Abstract: A semiconductor light-emitting device includes a semiconductor structure having a light-emitting region. A surface of the semiconductor structure has flattened peaks.

Abstract: An LED module includes a substrate having a high thermal conductivity and at least one LED die mounted on the substrate. A wavelength conversion material, such as phosphor or quantum dots in a binder, has a very low thermal conductivity and is formed to have a relatively high volume and low concentration over the LED die so that the phosphor or quantum dots conduct little heat from the LED die. A transparent top plate, having a high thermal conductivity, is positioned over the wavelength conversion material, and a hermetic seal is formed between the top plate and the substrate surrounding the wavelength conversion material. The LED die is located in a cavity in either the substrate or the top plate. In this way, the temperature of the wavelength conversion material is kept well below the temperature of the LED die. The sealing is done in a wafer level process.

Abstract: An illumination system is disclosed that is arranged to compensate for variations in brightness between different LEDs in the system. The system may include an array of LEDs coupled to a light guide that is provided with a plurality of light extraction patterns. Each light extraction pattern may include a plurality of light extraction features. The light extraction patterns may differ from one another in the density of the features. Light extraction patterns having a greater density may be combined with LEDs in the array that are less bright, whereas light extraction patterns having a lower feature density may be combined with LEDs in the array that are brighter.

Abstract: A light-emitting device comprising: a light source; and a light guide that is optically coupled to the light source, the light guide including a plurality of first non-fluorescent light extraction elements and a plurality of second non-fluorescent light extraction elements that are printed on the light guide, each of the first light extraction elements having a reflectance that is higher than a reflectance of any of the second light extraction elements, each of the first light extraction elements having a light transmittance that is lower than a light transmittance of any the second light extraction elements, each of the first light extraction elements having the same shape and size as any other one of the plurality first light extraction elements, and each of the second light extraction elements having the same shape and size as any other one of the plurality of second light extraction elements.

Abstract: Embodiments of the invention include a semiconductor light emitting diode attached to a substrate. A first region of wavelength converting material is disposed on the substrate. The wavelength converting material is configured to absorb light emitted by the semiconductor light emitting diode and emit light at a different wavelength. In the first region, the wavelength converting material coats an entire surface of the substrate. The substrate is disposed proximate a bottom surface of an optical cavity. A second region of wavelength converting material is disposed proximate a top surface of the optical cavity.

Abstract: A low-cost conductive carrier element provides structural support to a light emitting device (LED) die, as well as electrical and thermal coupling to the LED die. A lead-frame is provided that includes at least one carrier element, the carrier element being partitioned to form distinguishable conductive regions to which the LED die is attached. When the carrier element is separated from the frame, the conductive regions are electrically isolated from each other. A dielectric may be placed between the conductive regions of the carrier element.

Abstract: A method for manufacturing a solid state light-emitting device (LED) lighting apparatus includes forming a leadframe assembly with a group of leadframes connected in series by folded interconnects, mounting LEDs on the leadframes, disposing optical elements about the LEDs, and stretching the leadframe assembly so the interconnects unfold to space apart the LEDs. Disposing the optical elements includes orienting the optical elements so the optical elements provide a predetermined light pattern after stretching the leadframe assembly.

Abstract: A lighting device, or LED lamp is described with a base element for electrical contacting and mechanical mounting and an LED arrangement with at least one LED element. The LED arrangement is spaced from the base element along a longitudinal axis. In order to provide a lighting device and a lighting arrangement with a matched optical and thermal design, i.e. where both effective heat dissipation and an advantageous light intensity distribution are achieved, a lower heat dissipating structure is arranged between the base element and the LED arrangement. The lower heat dissipating structure includes a plurality of planar heat dissipation elements made out of a heat conducting material, shaped to have at a first longitudinal position along the longitudinal axis a first extension in cross-section, and at a second longitudinal position a second extension in cross-section.

Abstract: Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication.

Abstract: A device according to embodiments of the invention includes a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A surface of the p-type region perpendicular to a growth direction of the semiconductor structure includes a first portion and a second portion. The first portion is less conductive than the second portion. The device further includes a p-contact formed on the p-type region. The p-contact includes a reflector and a blocking material. The blocking material is disposed over the first portion and no blocking material is disposed over the second portion.

Abstract: In a method according to embodiments of the invention, a III-nitride layer is grown on a growth substrate. The III-nitride layer is connected to a host substrate. The growth substrate is removed. The growth substrate is a non-III-nitride material. The growth substrate has an in-plane lattice constant asubstrate. The III-nitride layer has a bulk lattice constant alayer. In some embodiments, [(|asubstrate?alayer|)/asubstrate]*100% is no more than 1%.

Abstract: Embodiments of the invention include a semiconductor light emitting device for emitting a first light at a first wavelength and a wavelength conversion medium arranged to convert at least part of the first light into a second light at a second wavelength. The wavelength conversion medium is disposed between a periodic antenna array and the semiconductor light emitting device. The periodic antenna array includes a plurality of antennas. The periodic antenna array supports surface lattice resonances arising from diffractive coupling of localized surface plasmon resonances in at least one of the antennas.

Abstract: A method for laminating a film over a light emitting diode (LED), where the thickness of a portion of the film disposed over the top surface of the LED is reduced by pressing a flattening element against the top surface of the LED. The resulting form of the phosphor encapsulation allows for an improved color homogeneity.

Abstract: An apparatus is disclosed that includes a segmented light-emitting diode (LED) chip having a plurality of LEDs that are separated by trenches formed on the segmented LED chip and arranged in a plurality of sections, each section including at least one first LED and at least one second LED; and a controller configured to: apply a forward bias to each of the first LEDs; apply a reverse bias to each of the second LEDs; and change a brightness of the first LEDs in any section based on a signal generated by the second LED in that section.