Abstract: Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

Abstract: A curable liquid polysiloxane/TiO2 composite for use as a light emitting diode encapsulant is provided, comprising: a polysiloxane with TiO2 domains having an average domain size of less than 5 nm, wherein the curable liquid polysiloxane/TiO2 composite contains 20 to 60 mol % TiO2 (based on total solids); wherein the curable liquid polysiloxane/TiO2 composite exhibits a refractive index of >1.61 to 1.7 and wherein the curable liquid polysiloxane/TiO2 composite is a liquid at room temperature and atmospheric pressure. Also provided is a light emitting diode manufacturing assembly.

Abstract: Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps.

Abstract: A photoresist composition comprises an acid-sensitive polymer, and a cyclic sulfonium compound having the formula: (Ra)1—(Ar)—S+(—CH2—)m·?O3S—(CRb2)n-(L)p-X wherein each Ra is independently a substituted or unsubstituted C1-30 alkyl group, C6-30 aryl group, C7-30 aralkyl group, or combination comprising at least one of the foregoing, Ar is a monocyclic, polycyclic, or fused polycyclic C6-30 aryl group, each Rb is independently H, F, a linear or branched C1-10 fluoroalkyl or a linear or branched heteroatom-containing C1-10 fluoroalkyl, L is a C1-30 linking group optionally comprising a heteroatom comprising O, S, N, F, or a combination comprising at least one of the foregoing heteroatoms, X is a substituted or unsubstituted, C5 or greater monocyclic, polycyclic or fused polycyclic cycloaliphatic group, optionally comprising a heteroatom comprising O, S, N, F, or a combination comprising at least one of the foregoing, and 1 is an integer of 0 to 4, m is an integer of 3 to 20, n is an integer of 0 to 4, and p

Abstract: A method of making a light emitting diode (LED) having an optical element is provided, comprising: providing a curable liquid polysiloxane/TiO2 composite, which exhibits a refractive index of >1.61 to 1.7 and which is a liquid at room temperature and atmospheric pressure; providing a semiconductor light emitting diode die having a face, wherein the semiconductor light emitting diode die emits light through the face; contacting the semiconductor light emitting diode die with the curable liquid polysiloxane/TiO2 composite; and, curing the curable liquid polysiloxane/TiO2 composite to form an optical element; wherein at least a portion of the optical element is adjacent to the face.

Abstract: Biocomposite compositions and compositions, which include dried distillers solubles, and which can be used in making biocomposite compositions are described. Methods for preparing the compositions are also described.

Abstract: A manufacturing method for making components includes: providing at least one of a prealloyed powder of a composition of Ni—Ti in the range of Ni-36Ti to Ni-45Ti or a mix of powders that forms a composition of Ni—Ti in the range of Ni-36Ti to Ni-45Ti; loading at least one of the prealloyed powder and the mix powders into a container; hot isostatically pressing (HIP) the container to full density to obtain a compact; rolling the compact in a mill with multiple passes to produce a sheet or other mill form material; and cutting blanks for the components from the sheet material to produce a component blank.

Abstract: Topcoat compositions are provided that can be used in immersion lithography to form photoresist patterns. The topcoat compositions include a polymer system that includes a matrix polymer and a surface active polymer. The matrix polymer is present in the composition in a larger proportion by weight than the surface active polymer, and the surface active polymer has a lower surface energy than a surface energy of the matrix polymer. A solvent system includes a first organic solvent chosen from gamma-butyrolactone and/or gamma-valerolactone, and a second organic solvent. The first organic solvent has a higher surface energy than a surface energy of the surface active polymer, and a higher boiling point than a boiling point of the second organic solvent.

Abstract: A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: The present invention is directed toward a process for making solid biodegradable articles from wheat gluten. Hydrated wheat gluten is provided in the form of a cohesive, elastic dough. The cohesive, elastic dough comprises at least 8% by weight wheat gluten and wherein the wheat gluten comprises a protein having a primary structure. The cohesive, elastic dough is formed into a shaped article and placed in an environment sufficient to remove excess water from the shaped article without modifying the primary structure of the wheat gluten protein, such that a solid biodegradable article results. The solid biodegradable articles of the present invention comprise at least 8% by weight wheat gluten.

Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, a polyamine fluxing agent represented by formula I: with the proviso that when the polyamine fluxing agent represented by formula I is according to formula Ia: then zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: A ballistic tile for use in an imbricated pattern of like ballistic tiles to achieve coverage of a protected area by the imbricated pattern, while having rounded corners to limit the potential for spalling on ballistic impact. The ballistic tile may include a strike face that is generally undulating to laterally deflect at least a portion of the impact force, and to induce turning of the ballistic projectile on impact to further distribute the impact force. The ballistic tile may also include one or more features on an obverse and reverse side thereof that, when arranged in an imbricated pattern, limit lateral motion of the tiles on ballistic impact, and/or laterally transmit the energy of the projectile for deflection and absorption thereof.

Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; and, an amine fluxing agent represented by formula I: and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: A curable flux composition is provided, comprising, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.

Abstract: A flux composition is provided, comprising, as initial components: a carboxylic acid; and, an amine fluxing agent represented by formula I: Also provided is a method of soldering an electrical contact using the flux composition.

Abstract: Self-aligned spacer multiple patterning method are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture.

Abstract: Tissue adhesives formed by reacting an oxidized polysaccharide with a water-dispersible multi-arm polyether amine, wherein at least three of the arms are terminated by primary amine groups, are disclosed. The use of the tissue adhesives for medical and veterinary applications such as topical wound closure; and surgical procedures, such as intestinal anastomosis, vascular anastomosis, tissue repair, and ophthalmic procedures; drug delivery; anti-adhesive applications; and as a bulking agent to treat urinary incontinence are described.

Abstract: Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

Abstract: A tissue adhesive formed by reacting an oxidized cationic polysaccharide containing aldehyde groups and amine groups with a multi-arm amine is described. The oxidized cationic polysaccharide-based polymer tissue adhesive may be useful for medical applications including wound closure, supplementing or replacing sutures or staples in internal surgical procedures such as intestinal anastomosis and vascular anastomosis, ophthalmic procedures, drug delivery, anti-adhesive applications and as a bulking agent to treat urinary incontinence. Additionally, due to the presence of the positively charged amine groups on the oxidized polysaccharide, the polymer tissue adhesive disclosed herein may promote wound healing and blood coagulation, and may possess antimicrobial properties.

Abstract: A copper interconnection structure includes an insulating layer, an interconnection body including copper and a barrier layer surrounding the interconnection body. The barrier layer includes a first barrier layer formed between a first portion of the interconnection body and the insulating layer. The first portion of the interconnection body is part of the interconnection body that faces the insulating layer. The barrier layer also includes a second barrier layer formed on a second portion of the interconnection body. The second portion of the interconnection body is part of the interconnection body not facing the insulating layer. Each of the first and the second barrier layers is formed of an oxide layer including manganese, and each of the first and the second barrier layers has a position where the atomic concentration of manganese is maximized in their thickness direction of the first and the second barrier layers.