Abstract: Copper electroplating methods provide low internal stress copper deposits. Concentrations of accelerators in the copper electroplating bath vary as a function of the plating current density and the low internal stress copper deposit is observed as a matt copper deposit.
Type:
Application
Filed:
September 9, 2012
Publication date:
September 19, 2013
Applicant:
Rohm and Haas Electronic Material LLC
Inventors:
George R. Allardyce, Gary Hamm, Narsmoul Karaya
Abstract: Methods of forming metal contacts with metal inks in the manufacture of photovoltaic devices are disclosed. The metal inks are selectively deposited on semiconductor coatings by inkjet and aerosol apparatus. The composite is heated to selective temperatures where the metal inks burn through the coating to form an electrical contact with the semiconductor. Metal layers are then deposited on the electrical contacts by light induced or light assisted plating.
Type:
Grant
Filed:
October 14, 2011
Date of Patent:
September 17, 2013
Assignees:
Rohm and Haas Electronic Materials LLC, Alliance for Sustainable Energy, LLC
Inventors:
Erik Reddington, Thomas C. Sutter, Lujia Bu, Alexandra Cannon, Susan E. Habas, Calvin J. Curtis, Alexander Miedaner, David S. Ginley, Marinus Franciscus Antonius Maria Van Hest
Abstract: A process for making biodegradable articles is presented. The process comprises providing a biodegradable material. A molding assembly comprising a mold and a carrier for affixing the mold to a centrifuge is provided. The biodegradable material is inserted into the mold and the mold subjected to a centrifugal force wherein solvent is separated from the biodegradable material and the shaped article is formed.
Type:
Grant
Filed:
November 2, 2007
Date of Patent:
September 17, 2013
Assignee:
Green Materials, LLC
Inventors:
Dara L. Woerdeman, Peter J. Joyce, John E. Joyce
Abstract: White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals.
Type:
Application
Filed:
August 30, 2012
Publication date:
September 12, 2013
Applicant:
Rohm and Haas Electronic Materials LLC
Inventors:
Katharina WEITERSHAUS, Wan ZHANG-BEGLINGER, Jonas GUEBEY
Abstract: A contact plug structure formed on a contact hole of an insulating layer of a semiconductor device includes a metal silicide layer formed on a bottom part of the contact hole of the insulating layer, a manganese oxide layer formed on the metal silicide layer in the contact hole, and a buried copper formed on the manganese oxide layer which substantially fills the contact hole.
Abstract: Catalysts include nanoparticles of catalytic metal and gallic acid or gallic acid derivatives or salts thereof. The catalysts are used in electroless metal plating. The catalysts are free of tin.
Type:
Application
Filed:
August 17, 2012
Publication date:
September 5, 2013
Applicant:
Rohm and Haas Electronic Materials LLC
Inventors:
Kristen M. Milum, Donald E. Cleary, Maria Anna Rzeznik
Abstract: Optical articles of zinc sulfide and zinc selenide with thick coatings of alumina are disclosed. The alumina coatings are deposited on the zinc sulfide and zinc selenide by a microwave assisted magnetron sputtering. In addition to alumina coatings, the optical articles may also include various polymer coatings.
Abstract: A method of reducing tin whisker formation including steps of a) providing a tin or tin-alloy bath containing one or more sources of tin and one or more crystal plane orientation enhancing compounds selected from imides, imines, amides, polyamides, amines, polyamines, polyols, dibutyl thiourea, allyl thiourea, amino thiazole, rhodanine, sulfosalicylic acid and sulfamides; and b) electrodepositing a layer of tin or tin-alloy on a substrate, the tin or tin-alloy layer is free of crystal planes or equivalent planes thereof forming an angle of 5° to 22° with an adjacent crystal plane or an equivalent plane.
Abstract: Catalysts which include nanoparticles of palladium metal and cellulose derivatives are used in electroless metal plating. The palladium catalysts are free of tin.
Abstract: Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin.
Abstract: A method for preparing a Group 1a-1b-3a-6a material using a selenium ink comprising a chemical compound having a formula RZ—Sex—Z?R? stably dispersed in a liquid carrier is provided, wherein the selenium ink is hydrazine free and hydrazinium free.
Type:
Grant
Filed:
October 12, 2012
Date of Patent:
August 20, 2013
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Kevin Calzia, David Mosley, Charles R. Szmanda
Abstract: Tin-silver alloy electroplating baths having certain amine-oxide surfactants and methods of electrodepositing a tin-silver-containing layer using these baths are disclosed. Such electroplating baths are useful to provide tin-silver solder deposits having reduced void formation and improved within-die uniformity.
Type:
Application
Filed:
February 9, 2012
Publication date:
August 15, 2013
Applicant:
Rohm and Haas Electronic Materials LLC
Inventors:
Inho LEE, Elissei Iagodkine, Yi Qin, Yu Luo
Abstract: A method of continuously manufacturing organometallic compounds is provided where two or more reactants are conveyed to a reactor having a laminar flow contacting zone, a heat transfer zone, and a mixing zone having a turbulence-promoting device; and causing the reactants to form the organometallic compound.
Type:
Application
Filed:
August 15, 2012
Publication date:
August 15, 2013
Applicants:
Rohm and Haas Electronic Materials LLC, Dow Global Technologies Inc.
Inventors:
Ravindra S. Dixit, Hua Bai, Curtis D. Modtland, Robert A. Ware, John G. Pendergast, JR., Christopher P. Christenson, Deodatta Vinayak Shenai-Khatkhate, Artashes Amamchyan, Kenneth M. Crouch, Robert F. Polcari
Abstract: A copolymer comprising the polymerized product of an electron-sensitizing acid deprotectable monomer, such as the monomer having the formula (XX), and a comonomer: wherein Ra is H, F, —CN, C1-10 alkyl, or C1-10 fluoroalkyl; Rx and Ry are each independently a substituted or unsubstituted C1-10 alkyl group or C3-10 cycloalkyl group; Rz is a substituted or unsubstituted C6-20 aromatic-containing group or C6-20 cycloaliphatic-containing group; wherein Rx and Ry together optionally form a ring; and wherein at least one of Rx, Ry and Rz is halogenated. A photoresist and coated substrate comprising the copolymer, and a method of making an electronic device using the photoresist, are also disclosed.
Abstract: Molybdenum disulfide powders include substantially spherically-shaped particles of molybdenum disulfide that are formed from agglomerations of generally flake-like sub-particles. The molybdenum disulfide powders are flowable and exhibit uniform densities. Methods for producing a molybdenum disulfide powder may include the steps of: Providing a supply of molybdenum disulfide precursor material; providing a supply of a liquid; providing a supply of a binder; combining the molybdenum disulfide precursor material with the liquid and the binder to form a slurry; feeding the slurry into a stream of hot gas; and recovering the molybdenum disulfide powder, the molybdenum disulfide powder including substantially spherically-shaped particles of molybdenum disulfide formed from agglomerations of generally flake-like sub-particles.
Type:
Grant
Filed:
April 27, 2011
Date of Patent:
August 13, 2013
Assignee:
Climax Engineered Materials, LLC
Inventors:
Matthew C. Shaw, Carl V. Cox, Yakov Epshteyn
Abstract: Provided are radiation-sensitive polymers and compositions which may be used in photolithographic processes. The polymers and compositions provide enhanced sensitivity to activating radiation.
Abstract: Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.
Type:
Grant
Filed:
September 11, 2012
Date of Patent:
August 13, 2013
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Deyan Wang, Robert D. Mikkola, George G. Barclay
Abstract: Methods of forming electronic devices are provided. The methods involve alkaline treatment of photoresist patterns and allow for the formation of high density resist patterns. The methods find particular applicability in semiconductor device manufacture.
Type:
Grant
Filed:
June 28, 2010
Date of Patent:
August 13, 2013
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Young Cheol Bae, Thomas Cardolaccia, Yi Liu
Abstract: Cyanurate compositions are provided that are particularly useful as a reagent to form a resin component of a coating composition underlying an overcoated photoresist. Preferred isocyanurates compound comprise substitution of multiple cyanurate nitrogen ring atoms by at least two distinct carboxy and/or carboxy ester groups.