Abstract: A copper-carbon composition including copper and carbon, wherein the copper and the carbon form a single phase material, and wherein the carbon does not phase separate from the copper when the material is heated to a melting temperature.
Abstract: A process for manufacturing silver nanowires is provided, comprising: providing a silver ink core component containing ?60 wt % silver nanoparticles dispersed in a silver carrier; providing a shell component containing a film forming polymer dispersed in a shell carrier; providing a substrate; coelectrospinning the silver ink core component and the shell component depositing on the substrate a core shell fiber having a core and a shell surrounding the core, wherein the silver nanoparticles are in the core; and, treating the silver nanoparticles to form a population of silver nanowires, wherein the population of silver nanowires exhibit an average length, L, of ?60 ?m.
Type:
Application
Filed:
July 22, 2013
Publication date:
January 30, 2014
Applicant:
Rohm and Haas Electronic Materials LLC
Inventors:
Jerome Claracq, Garo Khanarian, Lujia Bu, Jaebum Joo, Peter Trefonas
Abstract: Provided are polymers and photoresist compositions useful in forming photolithographic patterns. Also provided are substrates coated with the photoresist compositions and methods of forming photolithographic patterns. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices.
Type:
Grant
Filed:
December 2, 2011
Date of Patent:
January 14, 2014
Assignees:
Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
Inventors:
Young Cheol Bae, David Richard Wilson, Jibin Sun
Abstract: A metal underlayer is selectively plated on semiconductor wafers immediately followed by plating copper on the metal underlayer using a low internal stress copper plating bath. Additional metallization may be done to build up the metal layers using conventional metal plating baths and methods to form current tracks. Formation of metal silicides is avoided. Good adhesion of the metals to the semiconductors is achieved. The metalized semiconductors may be used in the manufacture of photovoltaic devices.
Type:
Application
Filed:
July 9, 2012
Publication date:
January 9, 2014
Applicant:
Rohm and Haas Electronic Materials LLC
Inventors:
Lingyun WEI, Gary HAMM, Narsmoul KARAYA, JR.
Abstract: Monocrystalline semiconductor substrates are textured with alkaline solutions to form pyramid structures on their surfaces to reduce incident light reflectance and improve light absorption of the wafers. The alkaline baths include compounds which inhibit the formation of flat areas between pyramid structures to improve the light adsorption.
Type:
Application
Filed:
June 27, 2012
Publication date:
January 2, 2014
Applicant:
Rohm and Haas Electronic Materials LLC
Inventors:
Robert K. Barr, Corey O'Connor, Peter W. Hinkley, George R. Allardyce
Abstract: The present invention relates to hetero-coagulated silica-alumina mixed oxide compositions that have a sharp refractive index and narrow refractive index dispersion between about 1.46 and 1.60.
Abstract: Polymers include a unit comprising a particular acetal moiety and a unit comprising a lactone moiety, photoresist compositions containing such a polymer, substrates coated with the photoresist compositions and methods of forming photolithographic patterns. The polymers, compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices.
Type:
Grant
Filed:
December 31, 2011
Date of Patent:
December 24, 2013
Assignees:
Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
Inventors:
Young Cheol Bae, Thomas H. Peterson, Yi Liu, Jong Keun Park, Seung-Hyun Lee, Thomas Cardolaccia
Abstract: An apparatus includes a manifold with a chamber for mixing multiple reactants. Gases are jetted into the manifold by a plurality of inlet injectors. The inlet injectors are arranged such that the gases passing into the manifold impinge on each other at a common point to form a mixture. The mixture passes through a plurality of holes in one side of the manifold into a deposition chamber where the mixture of gases impinges on additional gases at a common point to provide a reaction resulting in deposition of solid materials in the deposition chamber. The solid materials are free-standing.
Type:
Grant
Filed:
April 17, 2012
Date of Patent:
December 24, 2013
Assignees:
Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
Inventors:
Heather A. G. Stern, Vincent DiFilippo, Jitendra S. Goela, Michael A. Pickering, Hua Bai, Debashis Chakraborty, Hangyao Wang
Abstract: Disclosed herein is a fibrous tissue sealant in the form of an anhydrous fibrous sheet comprising a first component which is a fibrous polymer containing electrophilic or nucleophilic groups and a second component capable of crosslinking the first component when the sheet is exposed to an aqueous medium, thereby forming a crosslinked hydrogel that is adhesive to biological tissue. The fibrous tissue sealant may be useful as a general tissue adhesive for medical and veterinary applications such as wound closure, supplementing or replacing sutures or staples in internal surgical procedures, tissue repair, and to prevent post-surgical adhesions. The fibrous tissue sealant may be particularly suitable for use as a hemostatic sealant to stanch bleeding from surgical or traumatic wounds.
Type:
Application
Filed:
August 16, 2013
Publication date:
December 19, 2013
Applicant:
Actamax Surgical Materials, LLC
Inventors:
Samuel David Arthur, Tao Huang, William Gerald Dimaio, JR., George K. Kodokian
Abstract: The invention provides a composition comprising at least the following A and B: A) a polymer comprising, in polymerized from, at least one “monomer that comprises at least one hydroxyl group;” and B) an organometal compound comprising at least one metal selected from Ti, Zr, Hf, Co, Mn, Zn, or combinations thereof, and wherein the organometal compound is present in an amount greater than 5 weight percent, based on the sum weight of A and B.
Abstract: Anti-displacement hard gold compositions are disclosed for inhibiting displacement of metal from substrates which are plated with the hard gold. The anti-displacement hard gold compositions may be used to spot plate substrates with hard gold.
Type:
Grant
Filed:
September 22, 2010
Date of Patent:
December 17, 2013
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Wan Zhang-Beglinger, Jonas Guebey, André Egli
Abstract: New photoacid generator compounds are provided that comprise a nitrogen-base functional component of the structure —C(?O)N<. Photoresist compositions also are provided that comprise one or more PAGs of the invention.
Type:
Grant
Filed:
April 27, 2011
Date of Patent:
December 17, 2013
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Young Cheol Bae, Thomas Cardolaccia, Yi Liu
Abstract: A cyanide-free silver electroplating solution may be used to electroplate mirror bright silver layers at high current density ranges and at high temperatures such as in reel-to-reel electroplating. The cyanide-free silver electroplating solution is environmentally friendly.
Abstract: A copolymer comprises the polymerized product of a base-soluble monomer of formula (I): wherein Ra is H, F, C1-10 alkyl, or C1-10 fluoroalkyl, L1 is an m valent C2-30 alkylene, C3-30 cycloalkylene, C6-30 arylene, C7-30 aralkylene group, X1 is independently a base-soluble organic group comprising ?-diketone, ?-ester-ketone, ?-di-ester, or a combination comprising at least one of the foregoing; and an additional monomer copolymerizable with the base-soluble monomer of formula (I).
Type:
Grant
Filed:
May 29, 2012
Date of Patent:
December 10, 2013
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Gregory P. Prokopowicz, Gerhard Polhers, Mingqi Li, Chunyi Wu, Cong Liu, Cheng-bai Xu
Abstract: Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.
Type:
Grant
Filed:
December 13, 2011
Date of Patent:
December 10, 2013
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Gary Hamm, Jason A. Reese, George R. Allardyce
Abstract: A chrome-free composition of an acidic suspension of manganese compounds and manganese ions are applied to an organic polymer surface to etch the surface. The etched surface is then plated with metal.
Type:
Grant
Filed:
October 25, 2012
Date of Patent:
December 10, 2013
Assignee:
Rohm and Haas Electroncis Materials LLC
Inventors:
Wan Zhang-Beglinger, Katharina Weitershaus, Andreas Scheybal, Christos Comninellis
Abstract: A monolithic, unitary, seamless and physically continuous ceramic armor plate having first regions of one mechanical property and one chemical composition and one microstructural composition isolated from one another by a network of second regions of another mechanical property different from the one mechanical property and another chemical composition different from the one chemical composition and another microstructural composition different from the one microstructural composition, the one mechanical property and the another mechanical property being the propensity to crack.
Abstract: A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components.
Abstract: Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.