Patents Assigned to Materious, LLC
  • Precursor compositions and methods
    Patent number: 8142847
    Abstract: Compositions including an amido-group-containing vapor deposition precursor and a stabilizing additive are provided. Such compositions have improved thermal stability and increased volatility as compared to the amido-group-containing vapor deposition precursor itself. These compositions are useful in the deposition of thin films, such as by atomic layer deposition.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: March 27, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Deodatta Vinayak Shenai-Khatkhate, Stephen J. Manzik, Qin-Min Wang
  • CYANIDE-FREE SILVER ELECTROPLATING SOLUTIONS
    Publication number: 20120067735
    Abstract: A cyanide-free silver electroplating solution may be used to electroplate mirror bright silver layers at high current density ranges and at high temperatures such as in reel-to-reel electroplating. The cyanide-free silver electroplating solution is environmentally friendly.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 22, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Margit Clauss, Wan Zhang-Berlinger
  • METHOD OF ELECTROPLATING SILVER STRIKE OVER NICKEL
    Publication number: 20120067733
    Abstract: A silver electroplating solution is used to electroplate a mirror bright silver layer on a nickel or nickel alloy substrate. The silver electroplating solution is cyanide-free and environmentally friendly.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 22, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Wan ZHANG-BEGLINGER, Edit SZÖCS, Margit CLAUSS
  • METHOD OF STRIPPING HOT MELT ETCH RESISTS FROM SEMICONDUCTORS
    Publication number: 20120070992
    Abstract: Hot melt etch resist is selectively applied to an anti-reflective coating or a selective emitter on a semiconductor wafer. The exposed portions of the anti-reflective coating or selective emitter are etched away using an inorganic acid containing etch to expose the semiconductor surface. The hot melt etch resist is then stripped from the semiconductor with an alkaline stripper which does not compromise the electrical integrity of the semiconductor. The exposed semiconductor is then metalized to form current tracks.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 22, 2012
    Applicant: Rohm and Haas Electronics Materials LLC
    Inventors: Hua DONG, Robert K. Barr
  • PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PHOTOLITHOGRAPHIC PATTERNS
    Publication number: 20120064456
    Abstract: Provided are photoresist compositions useful in forming photolithographic patterns by a negative tone development process. Also provided are methods of forming photolithographic patterns by a negative tone development process and substrates coated with the photoresist compositions. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices.
    Type: Application
    Filed: September 10, 2011
    Publication date: March 15, 2012
    Applicants: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Young Cheol BAE, Thomas Cardolaccia, Jibin Sun, Daniel J. Arriola, Kevin A. Frazier
  • ACIDIC GOLD ALLOY PLATING SOLUTION
    Publication number: 20120055802
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Application
    Filed: November 9, 2011
    Publication date: March 8, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka MORII, Masanori Orihashi
  • ACIDIC GOLD ALLOY PLATING SOLUTION
    Publication number: 20120048740
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Application
    Filed: November 9, 2011
    Publication date: March 1, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka MORII, Masanori Orihashi
  • Group 6a/group 3a ink and methods of making and using same
    Patent number: 8119506
    Abstract: A selenium/Group 3a ink, comprising (a) a selenium/Group 3a complex which comprises a combination of, as initial components: a selenium component comprising selenium; an organic chalcogenide component having a formula selected from RZ—Z?R? and R2—SH; wherein Z and Z? are each independently selected from sulfur, selenium and tellurium; wherein R is selected from H, C1-20 alkyl group, a C6-20 aryl group, a C1-20 hydroxyalkyl group, an arylether group and an alkylether group; wherein R? and R2 are selected from a C1-20 alkyl group, a C6-20 aryl group, a C1-20 hydroxyalkyl group, an arylether group and an alkylether group; and, a Group 3a complex, comprising at least one Group 3a material selected from aluminum, indium, gallium and thallium complexed with a multidentate ligand; and, (b) a liquid carrier; wherein the selenium/Group 3a complex is stably dispersed in the liquid carrier.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: February 21, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Kevin Calzia, David Mosley, Charles Szmanda, David L. Thorsen
  • Method for forming copper interconnection structures
    Patent number: 8112885
    Abstract: A method for forming a copper interconnection structure includes the steps of forming an opening in an insulating layer, forming a copper alloy layer including a metal element on an inner surface of the opening, and conducting a heat treatment on the copper alloy layer so as to form a barrier layer. An enthalpy of oxide formation for the metal element is lower than the enthalpy of oxide formation for copper. The heat treatment is conducted at temperatures ranging from 327° C. to 427° C. and for a time period ranging from 1 minute to 80 minutes.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: February 14, 2012
    Assignee: Advanced Interconnect Materials, LLC
    Inventors: Junichi Koike, Akihiro Shibatomi
  • METAL PLATING COMPOSITIONS
    Publication number: 20120034371
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Application
    Filed: August 15, 2011
    Publication date: February 9, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • POLYGLYCEROL ALDEHYDES
    Publication number: 20120029149
    Abstract: Novel polyglycerol aldehyde polymers are described. The polymers comprise glycerol monomers connected by ether linkages and have 3 to about 170 aldehyde groups per molecule. The polyglycerol aldehydes may be reacted with various amine-containing polymers to form hydrogel tissue adhesives and sealants that may be useful for medical applications such as wound closure, supplementing or replacing sutures or staples in internal surgical procedures such as intestinal anastomosis and vascular anastomosis, tissue repair, preventing leakage of fluids such as blood, bile, gastrointestinal fluid and cerebrospinal fluid, ophthalmic procedures, drug delivery, and preventing post-surgical adhesions.
    Type: Application
    Filed: March 26, 2010
    Publication date: February 2, 2012
    Applicant: Actamax Surgical Materials, LLC
    Inventor: Henry Keith Chenault
  • METHOD FOR FORMING COPPER INTERCONNECTION STRUCTURES
    Publication number: 20120021603
    Abstract: A method for forming a copper interconnection structure includes the steps of forming an opening in an insulating layer, forming a copper alloy layer including a metal element on an inner surface of the opening, and conducting a heat treatment on the copper alloy layer so as to form a barrier layer. An enthalpy of oxide formation for the metal element is lower than the enthalpy of oxide formation for copper. The heat treatment is conducted at temperatures ranging from 327° C. to 427° C. and for a time period ranging from 1 minute to 80 minutes.
    Type: Application
    Filed: October 3, 2011
    Publication date: January 26, 2012
    Applicant: Advanced Interconnect Materials, LLC
    Inventors: Junichi KOIKE, Akihiro Shibatomi
  • TISSUE ADHESIVE AND SEALANT COMPRISING POLYGLYCEROL ALDEHYDE
    Publication number: 20120014909
    Abstract: A tissue adhesives and sealant formed by reacting a polyglycerol aldehyde with a water-dispersible, multi-arm amine is described. The tissue adhesive and sealant may be useful for medical and veterinary applications, including, but not limited to, wound closure, supplementing or replacing sutures or staples in internal surgical procedures such as intestinal anastomosis and vascular anastomosis, tissue repair, preventing leakage of fluids such as blood, bile, gastrointestinal fluid and cerebrospinal fluid, ophthalmic procedures, drug delivery, and to prevent post-surgical adhesions.
    Type: Application
    Filed: March 26, 2010
    Publication date: January 19, 2012
    Applicant: Actamax Surgical Materials, LLC
    Inventor: Henry Keith Chenault
  • SODIUM / MOLYBDENUM METAL ARTICLES AND POWDER COMPACTS
    Publication number: 20120012460
    Abstract: A metal article formed by compacting a sodium/molybdenum composite metal powder under sufficient pressure to form a preformed article; placing the preformed article in a sealed container; raising the temperature of the sealed container to a temperature that is lower than a sintering temperature of molybdenum; and subjecting the sealed container to an isostatic pressure for a time sufficient to increase the density of the metal article to at least about 90% of theoretical density.
    Type: Application
    Filed: September 26, 2011
    Publication date: January 19, 2012
    Applicant: Climax Engineered Materials, LLC
    Inventors: Dave Honecker, Christopher Michaluk, Carl Cox, James Cole
  • Method for preparing multi-arm poly(ethylene glycol) chlorides
    Patent number: 8097696
    Abstract: A method for preparing multi-arm poly(ethylene glycol) (PEG) chlorides from multi-arm PEG polyols is described. The method comprises a process, wherein the multi-arm PEG polyol is reacted with thionyl chloride to form the multi-arm PEG chloride.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: January 17, 2012
    Assignee: Actamax Surgical Materials, LLC
    Inventor: Henry Keith Chenault
  • LOW-FRICTION SURFACE COATINGS AND METHODS FOR PRODUCING SAME
    Publication number: 20120009432
    Abstract: A coated article system includes a substrate and a surface coating on the substrate. The surface coating is formed by depositing individual particles of a composite metal powder with sufficient energy to cause the composite metal powder to bond with the substrate and form the surface coating. The composite metal powder includes a substantially homogeneous dispersion of molybdenum and molybdenum disulfide sub-particles that are fused together to form the individual particles of the composite metal powder.
    Type: Application
    Filed: July 9, 2010
    Publication date: January 12, 2012
    Applicant: Climax Engineered Materials, LLC
    Inventors: Carl V. Cox, Matthew C. Shaw, Yakov Epshteyn
  • METHODS FOR PRODUCING MOLYBDENUM/MOLYBDENUM DISULFIDE METAL ARTICLES
    Publication number: 20120009080
    Abstract: A method for producing a metal article according to one embodiment may involve the steps of: Providing a composite metal powder including a substantially homogeneous dispersion of molybdenum and molybdenum disulfide sub-particles that are fused together to form individual particles of the composite metal powder; and compressing the molybdenum/molybdenum disulfide composite metal powder under sufficient pressure to cause the mixture to behave as a nearly solid mass.
    Type: Application
    Filed: July 11, 2011
    Publication date: January 12, 2012
    Applicant: Climax Engineered Materials, LLC
    Inventors: Matthew C. Shaw, Carl V. Cox, Yakov Epshteyn
  • POTASSIUM/MOLYBDENUM COMPOSITE METAL POWDERS, POWDER BLENDS, PRODUCTS THEREOF, AND METHODS FOR PRODUCING PHOTOVOLTAIC CELLS
    Publication number: 20120006676
    Abstract: A method for producing a composite metal powder according to one embodiment of the invention may comprise: Providing a supply of molybdenum metal powder; providing a supply of a potassium compound; combining the molybdenum metal powder and the potassium compound with a liquid to form a slurry; feeding the slurry into a stream of hot gas; and recovering the composite metal powder.
    Type: Application
    Filed: July 8, 2011
    Publication date: January 12, 2012
    Applicant: Climax Engineered Materials, LLC
    Inventors: David Honecker, Michael Carducci, Carl Cox, Christopher Michaluk
  • COPPER INTERCONNECTION STRUCTURE AND METHOD FOR FORMING COPPER INTERCONNECTIONS
    Publication number: 20120003390
    Abstract: A copper interconnection structure includes an insulating layer, an interconnection body including copper in an opening provided on the insulating layer, and a diffusion barrier layer formed between the insulating layer and the interconnection body. The diffusion barrier layer includes an oxide layer including manganese having a compositional ratio of oxygen to manganese (y/x) less than 2.
    Type: Application
    Filed: September 12, 2011
    Publication date: January 5, 2012
    Applicant: Advanced Interconnect Materials, LLC
    Inventors: Junichi Koike, Akihiro Shibatomi
  • Curable compositions
    Patent number: 8088467
    Abstract: Curable compositions are disclosed. Also disclosed are optical media comprising said curable compositions when cured and methods of making such optical media.
    Type: Grant
    Filed: March 5, 2008
    Date of Patent: January 3, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Lujia Bu, Edward C. Greer, Georg R. Kestler, Alan I. Nakatani, Charles R. Szmanda