Patents Assigned to MCNC
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Publication number: 20020089254Abstract: A miniature electrical relay including a piezoelectric actuating element where the piezoelectric actuating element includes a piezoelectric thin-film material sandwiched in between two metal electrode layers that function as piezoelectric electrodes. The metal electrode layers are connected to a positive and negative terminal, respectively, of a power source, which results in actuation of the piezoelectric actuating element. The piezoelectric actuating element is affixed to a deformable metal contact through an insulating layer, such that when actuated, the piezoelectric actuating element selectively deforms the deformable metal contact to cause the contact to move into or out of electrical and mechanical connection with a fixed metal contact.Type: ApplicationFiled: January 16, 2002Publication date: July 11, 2002Applicant: MCNCInventors: David E. Dausch, Gary E. McGuire
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Publication number: 20020064033Abstract: An electronic memory module, on the order of 1 Gigabyte or more, which is compact, results in minimum transmission delay, and which may be incorporated into existing computer systems. The electronic module for use in memory arrays includes a module substrate, a plurality of daughter boards edge-mounted to the module substrate, wherein each daughter board of the plurality of daughter boards includes a front face and a back face opposite the front face, and at least one memory chip mounted to the front face of each daughter board of the plurality of daughter boards, such that the at least one memory chip is in electrical communication with the module substrate.Type: ApplicationFiled: November 29, 2000Publication date: May 30, 2002Applicant: MCNCInventors: Phillip A. Deane, Mark Windsor Roberson
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Patent number: 6396620Abstract: An electromagnetic radiation shutter device driven by electrostatic forces comprises a stationary membrane capable of allowing electromagnetic radiation transmission therethrough, and a first and second flexible membrane comprising an electrode element and at least one biasing element. The first flexible membrane has a fixed portion attached to the underside of the stationary membrane and a distal portion adjacent to the fixed portion and released from the underside of the stationary membrane. The second flexible membrane has a fixed portion attached to the topside of the stationary membrane and a distal portion adjacent to the fixed portion and released from the topside of the stationary membrane. In operation, a voltage differential is established between the electrode element of the first flexible membrane and the electrode element of the second flexible membrane thereby moving the first and second flexible membranes relative to the stationary membrane. In a closed state (i.e.Type: GrantFiled: October 30, 2000Date of Patent: May 28, 2002Assignee: MCNCInventor: Scott H. Goodwin-Johansson
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Patent number: 6392355Abstract: A current regulator controls the electron emission from a cold cathode using closed-loop feedback from a current sensor in the cathode connection. The regulator circuit includes a cold cathode, a current-sensing element, a current-limiting element, and current-control element. Additionally, the closed-loop current regulator may comprise a reference element for generating the reference level, a circuit power supply and a cathode bias supply. The regulator and cathode may be assembled from separate components, or the entire circuit may be integrated onto a single substrate. In one embodiment, the current level is set by adjusting the reference element directly. In a second embodiment, the current level is set by adjusting the circuit power supply, so that the current level can be set remotely without the need to adjust the reference element directly. The second embodiment is preferably suited for the regulation of beam current in analytical instrumentation.Type: GrantFiled: April 25, 2000Date of Patent: May 21, 2002Assignee: MCNCInventors: William Devereux Palmer, Dorota Temple
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Patent number: 6377438Abstract: A microelectromechanical system (MEMS) tunable capacitor having low loss and a corresponding high Q is provided. The tunable capacitor includes a first substrate having a first capacitor plate disposed thereon. A fixed pivot structure is disposed on the first surface of the first substrate, proximate the first capacitor plate. The fixed pivot structure as a point of attachment for a flexible membrane that extends outward from the fixed pivot and generally overlies the first capacitor plate. A second substrate is attached to the underside of the flexible membrane and a second capacitor plate is disposed thereon such that the first and second capacitor plates face one another in a spaced apart relationship. A MEMS actuator is operably in contact with the flexible membrane for the purpose of providing an actuation force to the flexible membrane, thereby varying the capacitance between the first and second capacitor plates.Type: GrantFiled: October 23, 2000Date of Patent: April 23, 2002Assignee: MCNCInventors: Philip A. Deane, Joseph Mancusi, Mark W. Roberson
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Patent number: 6373682Abstract: A MEMS (Micro Electro Mechanical System) electrostatically operated high voltage variable controlled capacitor device is provided. This device can store high energy over a wide range while using relatively low electrostatic operating voltages. The MEMS device comprises a microelectronic substrate, a substrate signal electrode, and one or more substrate control electrodes. The MEMS device also includes a moveable composite overlying the substrate, having a composite signal electrode, one or more composite control electrodes, and a biasing element. In cross-section, the moveable composite comprises at least one electrode layer and, in most instances, a biasing layer. In length, the moveable composite comprises a fixed portion attached to the underlying substrate and a distal portion moveable with respect to the substrate electrode. The distal and/or medial portions of the moveable composite are biased in position when no electrostatic force is applied.Type: GrantFiled: December 15, 1999Date of Patent: April 16, 2002Assignee: MCNCInventor: Scott Halden Goodwin-Johansson
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Patent number: 6359374Abstract: A miniature electrical relay including a piezoelectric actuating element where the piezoelectric actuating element includes a piezoelectric thin-film material sandwiched in between two metal electrode layers that function as piezoelectric electrodes. The metal electrode layers are connected to a positive and negative terminal, respectively, of a power source, which results in actuation of the piezoelectric actuating element. The piezoelectric actuating element is affixed to a deformable metal contact through an insulating layer, such that when actuated, the piezoelectric actuating element selectively deforms the deformable metal contact to cause the contact to move into or out of electrical and mechanical connection with a fixed metal contact.Type: GrantFiled: November 23, 1999Date of Patent: March 19, 2002Assignee: MCNCInventors: David E. Dausch, Gary E. McGuire
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Publication number: 20020020551Abstract: A controlled-shaped solder reservoir provides additional solder to a bump in the flow step for increasing the volume of solder forming the solder bump. The controlled shaped reservoirs can be shaped and sized to provide predetermined amounts of solder to the solder bump. Thus, the height of the resulting solder bump can be predetermined. The solder reservoirs can be shaped to take a minimum amount of space, such as by at least partially wrapping around the solder bump. Consequently, the solder bumps may have increased height without adding to the space requirements of the solder bump, or without increasing the fabrication cost. In addition, due to the finite time required for solder flow, a means of sequencing events during soldering is provided.Type: ApplicationFiled: February 22, 2001Publication date: February 21, 2002Applicant: MCNCInventors: Glenn A. Rinne, Paul A. Magill
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Patent number: 6271150Abstract: A layer of doped or undoped germanosilicate glass is formed on a substrate and the layer of germanosilicate glass is thermally treated in steam to remove germanium from the germanosilicate glass, and thereby raise the reflow temperature of the germanosilicate glass so treated. The layer of germanosilicate glass on the substrate may be a nonplanar layer of germanosilicate glass. When thermally treating the nonplanar layer of germanosilicate glass in steam, the layer of germanosilicate glass may be planarized simultaneously with the removal of germanium from the planarized germanosilicate glass. This process may be repeated to create a hierarchy of reflowed glass where each underlying layer reflows at a higher temperature than the next deposited glass layer. The steam thermal treatment step may be preceded by a thermal pretreatment of the layer of germanosilicate glass in at least one of a noble gas and nitrogen gas, to reflow the layer of germanosilicate glass.Type: GrantFiled: November 30, 1998Date of Patent: August 7, 2001Assignees: North Carolina State University, MCNCInventors: Robert T. Croswell, Arnold Reisman, Darrell L. Simpson, Dorota Temple, C. Kenneth Williams
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Patent number: 6256134Abstract: An electromechanical device includes a first frame having a first aperture therein, a second frame suspended in the first frame wherein the second frame has a second aperture therein, and a plate suspended in the second aperture. A first pair of beams support the second frame along a first axis relative to the first frame so that the second frame rotates about the first axis. A second pair of beams supports the plate along a second axis relative to the second frame so that the plate rotates about the second axis relative to the frame. The first and second axes preferably intersect at a 90° angle. A first actuator provides mechanical force for rotating the second frame relative to the first frame about the first axis. A second actuator provides mechanical force for rotating the plate relative to the second frame about the second axis. Accordingly, the plate can be independently rotated relative to the first axis and the second axis. Related methods are also disclosed.Type: GrantFiled: July 28, 2000Date of Patent: July 3, 2001Assignee: MCNCInventors: Vijayakumar R. Dhuler, David A. Koester, Mark D. Walters, Karen W. Markus
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Patent number: 6236491Abstract: A MEMS (Micro Electro Mechanical System) electrostatic device operated with lower and more predictable operating voltages is provided. An electrostatic actuator, an electrostatic attenuator of electromagnetic radiation, and a method for attenuating electromagnetic radiation are provided. Improved operating voltage characteristics are achieved by defining a non increasing air gap between the substrate electrode and flexible composite electrode within the electrostatic device. A medial portion of a multilayer flexible composite overlying the electromechanical substrate is held in position regardless of the application of electrostatic force, thereby sustaining the defined air gap. The air gap is relatively constant in separation from the underlying microelectronic surface when the medial portion is cantilevered in one embodiment. A further embodiment provides an air gap that decreases to zero when the medial portion approaches and contacts the underlying microelectronic surface.Type: GrantFiled: May 27, 1999Date of Patent: May 22, 2001Assignee: MCNCInventor: Scott Halden Goodwin-Johansson
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Patent number: 6233088Abstract: A reflector having a mechanically deformable portion of at least one reflective surface is disclosed. By deforming the portion of the reflective surface, discontinuity is introduced in that portion of the reflective surface. The discontinuity in the reflective surface scatters incident radiation signals so as to cause attenuation in the reflected signal. By selectively deforming the portion of the reflective surface, the reflected signal can be modulated to encode data thereon. The mechanically deformable portion of the reflective surface preferably comprises plates integrally formed therein.Type: GrantFiled: August 10, 2000Date of Patent: May 15, 2001Assignee: MCNCInventors: Mark W. Roberson, Glenn A. Rinne, Philip A. Deane, Karen W. Markus
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Patent number: 6229683Abstract: A MEMS (Micro Electro Mechanical System) electrostatically operated high voltage switch or relay device is provided. This device can switch high voltages while using relatively low electrostatic operating voltages. The MEMS device comprises a microelectronic substrate, a substrate electrode, and one or more substrate contacts. The MEMS device also includes a moveable composite overlying the substrate, one or more composite contacts, and at least one insulator. In cross section, the moveable composite comprises an electrode layer and a biasing layer. In length, the moveable composite comprises a fixed portion attached to the underlying substrate, a medial portion, and a distal portion moveable with respect to the substrate electrode. The distal and/or medial portions of the moveable composite are biased in position when no electrostatic force is applied.Type: GrantFiled: June 30, 1999Date of Patent: May 8, 2001Assignee: MCNCInventor: Scott Halden Goodwin-Johansson
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Patent number: 6222279Abstract: A method for fabricating solder bumps on a microelectronic device having contact pads includes the steps of depositing a titanium barrier layer on the device, forming an under bump metallurgy layer on the titanium barrier layer, and forming one or more solder bumps on the under bump metallurgy layer. The solder bump or bumps define exposed portions of the under bump metallurgy layer which are removed, and then the exposed portion of the titanium barrier layer is removed. The titanium barrier layer protects the underlying microelectronic device from the etchants used to remove the under bump metallurgy layer. The titanium layer also prevents the under bump metallurgy layer from forming a residue on the underlying microelectronic device. Accordingly, the titanium barrier layer allows the under bump metallurgy layer to be quickly removed without leaving residual matter thereby reducing the possibility of electrical shorts between solder bumps.Type: GrantFiled: April 20, 1998Date of Patent: April 24, 2001Assignee: MCNCInventors: Joseph Daniel Mis, Gretchen Maerker Adema, Mark D. Kellam, W. Boyd Rogers
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Patent number: 6218762Abstract: Microelectromechanical system (MEMS) structures and arrays that provide movement in one, two, and/or three dimensions in response to selective thermal actuation. Significant amounts of scalable displacement are provided. In one embodiment, pairs of thermal arched beams are operably interconnected and thermally actuated to create structures and arrays capable of moving in a plane parallel to the underlying substrate in one and/or two dimensions. One embodiment provides an arched beam operably connected to a crossbeam such that the medial portion arches and alters its separation from the crossbeam when thermally actuated. In another embodiment, at least one thermal arched beam is arched in a nonparallel direction with respect to the plane defined by the underlying substrate. In response to thermal actuation, the medial portion of the arched beam is arched to a greater degree than the end portions of the thermal arched beam, thereby altering the separation of the medial portion from the underlying substrate.Type: GrantFiled: May 3, 1999Date of Patent: April 17, 2001Assignee: MCNCInventors: Edward A. Hill, Vijayakumar R. Dhuler
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Patent number: 6137623Abstract: A reflector having a mechanically deformable portion of at least one reflective surface is disclosed. By deforming the portion of the reflective surface, discontinuity is introduced in that portion of the reflective surface. The discontinuity in the reflective surface scatters incident radiation signals so as to cause attenuation in the reflected signal. By selectively deforming the portion of the reflective surface, the reflected signal can be modulated to encode data thereon. The mechanically deformable portion of the reflective surface preferably comprises plates integrally formed therein.Type: GrantFiled: March 17, 1998Date of Patent: October 24, 2000Assignee: MCNCInventors: Mark W. Roberson, Glenn A. Rinne, Philip A. Deane, Karen W. Markus
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Patent number: 6134042Abstract: An electromechanical device includes a first frame having a first aperture therein, a second frame suspended in the first frame wherein the second frame has a second aperture therein, and a plate suspended in the second aperture. A first pair of beams support the second frame along a first axis relative to the first frame so that the second frame rotates about the first axis. A second pair of beams supports the plate along a second axis relative to the second frame so that the plate rotates about the second axis relative to the frame. The first and second axes preferably intersect at a 90.degree. angle. A first actuator provides mechanical force for rotating the second frame relative to the first frame about the first axis. A second actuator provides mechanical force for rotating the plate relative to the second frame about the second axis. Accordingly, the plate can be independently rotated relative to the first axis and the second axis. Related methods are also disclosed.Type: GrantFiled: April 1, 1999Date of Patent: October 17, 2000Assignee: MCNCInventors: Vijayakumar R. Dhuler, David A. Koester, Mark D. Walters, Karen W. Markus
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Patent number: 6124663Abstract: A fiber optic connector is provided that is capable of precisely aligning an optical fiber with another optical element by using a MEMS positioning apparatus subsystem capable of being manufactured in an affordable, repeatable and reliable manner which can precisely microposition an optical fiber relative to another optical element in each of the X, Y and Z directions.Type: GrantFiled: August 25, 1999Date of Patent: September 26, 2000Assignees: The Boeing Company, MCNCInventors: John M. Haake, Vijayakumar R. Dhuler, Robert L. Wood
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Patent number: 6117299Abstract: Methods of electroplating solder bumps of uniform height on integrated circuit substrates include the steps of drawing plating current through an integrated circuit wafer by electrically shorting an integrated circuit's ground, power and signal pads together using an ultra-thin plating base layer (e.g., <0.075 .mu.m thick) and then using a backside wafer contact to draw electroplating current along parallel paths which extend through the ground and signal pads and into the substrate. The ground pads are preferably electrically coupled to the substrate at substrate contact regions (e.g., N + or P + diffusion regions) and the signal pads are preferably electrically coupled to the substrate through active semiconductor devices (e.g., FETs, BJTs, . . . ) to which the signal pads are attached. Plating current is preferably drawn in parallel through an integrated circuit's active semiconductor devices and substrate contact regions.Type: GrantFiled: May 9, 1997Date of Patent: September 12, 2000Assignee: MCNCInventors: Glenn A. Rinne, Christine Lizzul
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Patent number: 6087747Abstract: An electromechanical device includes a first frame having a first aperture therein, a second frame suspended in the first frame wherein the second frame has a second aperture therein, and a plate suspended in the second aperture. A first pair of beams support the second frame along a first axis relative to the first frame so that the second frame rotates about the first axis. A second pair of beams supports the plate along a second axis relative to the second frame so that the plate rotates about the second axis relative to the frame. The first and second axes preferably intersect at a 90.degree. angle. A first actuator provides mechanical force for rotating the second frame relative to the first frame about the first axis. A second actuator provides mechanical force for rotating the plate relative to the second frame about the second axis. Accordingly, the plate can be independently rotated relative to the first axis and the second axis. Related methods are also disclosed.Type: GrantFiled: April 1, 1999Date of Patent: July 11, 2000Assignee: MCNCInventors: Vijayakumar R. Dhuler, David A. Koester, Mark D. Walters, Karen W. Markus