Patents Assigned to MEMC Electronic Materials, Inc.
  • Processes for purification of silicon tetrafluoride
    Patent number: 7943108
    Abstract: Processes for purifying silicon tetrafluoride source gas by subjecting the source gas to one or more purification processes including: contacting the silicon tetrafluoride source gas with an ion exchange resin to remove acidic contaminants, contacting the silicon tetrafluoride source gas with a catalyst to remove carbon monoxide, by removal of carbon dioxide by use of an absorption liquid, and by removal of inert compounds by cryogenic distillation; catalysts suitable for removal of carbon monoxide from silicon tetrafluoride source gas and processes for producing such catalysts.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: May 17, 2011
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Vithal Revankar, Jameel Ibrahim
  • Silicon wafer etching compositions
    Patent number: 7938982
    Abstract: A process for etching silicon wafers using a caustic etchant in the form of an aqueous solution comprising water, a hydroxide ion source, and a chelating agent. The process produces silicon wafers substantially free from diffused metal ions.
    Type: Grant
    Filed: January 2, 2008
    Date of Patent: May 10, 2011
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mark G. Stinson, Henry F. Erk, Guoqiang Zhang
  • Methods of Grinding Semiconductor Wafers Having Improved Nanotopology
    Publication number: 20110101504
    Abstract: Methods for holding a workpiece with a hydrostatic pad are disclosed herein. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer. The pockets are adapted for receiving fluid through the body and into the pockets to provide a barrier between the body face and the workpiece while still applying pressure to hold the workpiece during grinding. The hydrostatic pads allow the wafer to rotate relative to the pads about their common axis. The pockets are oriented to reduce hydrostatic bending moments that are produced in the wafer when the grinding wheels shift or tilt relative to the hydrostatic pads, helping prevent nanotopology degradation of surfaces of the wafer commonly caused by shift and tilt of the grinding wheels.
    Type: Application
    Filed: October 6, 2010
    Publication date: May 5, 2011
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Milind S. Bhagavat, Puneet Gupta, Roland R. Vandamme, Takuto Kazama, Noriyuki Tachi
  • Method for assessing workpiece nanotopology using a double side wafer grinder
    Patent number: 7927185
    Abstract: A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method includes measuring a distance between the wafer and at least one sensor and determining wafer nanotopology using the measured distance. The determining includes using a processor to perform a finite element structural analysis of the wafer based on the measured distance.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: April 19, 2011
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Roland R. Vandamme, Milind S. Bhagavat
  • Nanotopography control and optimization using feedback from warp data
    Patent number: 7930058
    Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: April 19, 2011
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura, Tomohiko Kaneko, Takuto Kazama
  • Method and device for feeding arsenic dopant into a silicon crystal growing apparatus
    Patent number: 7922817
    Abstract: A feed assembly and method of use thereof of the present invention is used for the addition of a high pressure dopant such as arsenic into a silicon melt for CZ growth of semiconductor silicon crystals. The feed assembly includes a vessel-and-valve assembly for holding dopant, and a feed tube assembly, attached to the vessel-and-valve assembly for delivering dopant to a silicon melt. An actuator is connected to the feed tube assembly and a receiving tube for advancing and retracting the feed tube assembly to and from the surface of the silicon melt. A brake assembly is attached to the actuator and the receiving tube for restricting movement of the feed tube assembly and locking the feed tube assembly at a selected position.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: April 12, 2011
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Massoud Javidi, Steve Garner
  • Methods and Systems For Adjusting Operation Of A Wafer Grinder Using Feedback from Warp Data
    Publication number: 20110045740
    Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.
    Type: Application
    Filed: September 27, 2010
    Publication date: February 24, 2011
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura, Tomohiko Kaneko, Takuto Kazama
  • High purity silicon carbide structures
    Patent number: 7888685
    Abstract: Processes for the purification of silicon carbide structures, including silicon carbide coated silicon carbide structures, are disclosed. The processes described can reduce the amount of iron contamination in a silicon carbide structure by 100 to 1000 times. After purification, the silicon carbide structures are suitable for use in high temperature silicon wafer processing.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: February 15, 2011
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Larry Wayne Shive, Brian Lawrence Gilmore
  • Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control
    Patent number: 7878883
    Abstract: A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: February 1, 2011
    Assignee: MEMC Electronics Materials, Inc.
    Inventors: Puneet Gupta, Milind S. Kulkarni, Carlo Zavattari, Roland R. Vandamme
  • Semiconductor wafer carrier blade
    Patent number: 7878562
    Abstract: A carrier blade for transferring a semiconductor wafers into and out of a deposition chamber may include transition surfaces sloping downward from ledge surfaces. The transition surfaces slope from the corresponding ledges at angles that are greater than about 90 degrees so that the edges between the ledge surfaces and the transition surfaces are not sharp. The carrier blade may include bevels extending from the ledge surface(s) to upper lateral edges of the carrier blade.
    Type: Grant
    Filed: December 31, 2007
    Date of Patent: February 1, 2011
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Manabu Hamano, John A. Pitney, Lance G. Hellwig
  • Processes for the purification of trichlorosilane and silicon tetrachloride
    Patent number: 7879198
    Abstract: The present disclosure relates to processes and systems for purifying technical grade trichlorosilane and/or technical grade silicon tetrachloride into electronic grade trichlorosilane and/or electronic grade silicon tetrachloride.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: February 1, 2011
    Assignee: MEMC Electronic Materials, Inc.
    Inventor: Gianfranco Ghetti
  • Method and System for Processing Abrasive Slurry
    Publication number: 20110017230
    Abstract: Systems and methods are provided for processing abrasive slurry used in cutting operations. The slurry is mixed with a first solvent in a tank. The slurry is vibrated and/or ultrasonically agitated such that abrasive grain contained in the slurry separates from the other components of the slurry and the first solvent. After the abrasive grain has settled to a bottom portion of the container, the other components of the slurry and the first solvent are removed from the tank. The abrasive grain may then be washed with a second solvent. The abrasive grain is then heated and is suitable for reuse in an abrasive slurry.
    Type: Application
    Filed: July 21, 2010
    Publication date: January 27, 2011
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Henry F. Erk, Vandan Tanna
  • Methods For Pulling A Multicrystalline Silicon Ingot From A Silicon Melt
    Publication number: 20110002835
    Abstract: Methods for producing muticrystalline silicon ingots by use of a Czochralski-type crystal puller and pulling assemblies that include a plurality of seed crystals for pulling multicrystalline silicon ingots.
    Type: Application
    Filed: December 23, 2009
    Publication date: January 6, 2011
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventor: Steven L. Kimbel
  • Pulling Assemblies For Pulling A Multicrystalline Silicon Ingot From A Silicon Melt
    Publication number: 20110002819
    Abstract: Methods for producing multicrystalline silicon ingots by use of a Czochralski-type crystal puller and pulling assemblies that include a plurality of seed crystals for pulling multicrystalline silicon ingots.
    Type: Application
    Filed: December 23, 2009
    Publication date: January 6, 2011
    Applicant: MEMC Electronic Materials, Inc.
    Inventor: Steven L. Kimbel
  • System and method for dressing a wafer polishing pad
    Patent number: 7846007
    Abstract: A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: December 7, 2010
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
  • Dressing a wafer polishing pad
    Patent number: 7846006
    Abstract: A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: December 7, 2010
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
  • Methods of Making Wafer Supports
    Publication number: 20100304022
    Abstract: A method is disclosed for sandblasting a wafer support platform to create a surface having a uniform roughness. Contaminants become embedded in the surface during the sandblasting procedure. A layer is applied over the surface to isolate the contaminants from a supported wafer while maintaining the uniform roughness.
    Type: Application
    Filed: July 29, 2010
    Publication date: December 2, 2010
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Larry W. Shive, Brian L. Gilmore
  • SYSTEMS FOR WEIGHING A PULLED OBJECT HAVING A CHANGING WEIGHT
    Publication number: 20100242625
    Abstract: A system for measuring the weight of an object while pulling the object upward includes a puller having a frame and a cable having a first end coupled to the object and a second end engaging a second cylinder. At least a portion of the cable engages the outer circumferential surface of a first cylinder and the second cylinder. The apparatus also includes an upper arm and an actuator. A force measurement device is coupled to the first cylinder and to the upper arm and measures the weight of the object. The actuator is operable to lower and raise the weight measurement device and the first cylinder. In some embodiments, the position of the cable with respect to the frame may be adjusted by a dampening system or a bushing.
    Type: Application
    Filed: March 18, 2010
    Publication date: September 30, 2010
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventor: Harold Korb
  • METHODS FOR WEIGHING A PULLED OBJECT HAVING A CHANGING WEIGHT
    Publication number: 20100242831
    Abstract: Methods are disclosed for pulling an object while measuring the weight of the object. The object is pulled upward using a cable extending over a first cylinder. The cable further extends over a second cylinder. The cable travels along a cable path between an uppermost portion of each of the outer circumferential portions of the first cylinder and the second cylinder. The first cylinder is restrained from movement parallel to the cable path with an arm having a first end and a second end. The first end is coupled to the first cylinder and the second end is coupled to either the second cylinder or a frame. The weight of the object is measured with a force measurement device. In some embodiments, the position of the cable with respect to the frame may be adjusted by a dampening system or a bushing.
    Type: Application
    Filed: March 18, 2010
    Publication date: September 30, 2010
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventor: Harold Korb
  • SYSTEMS FOR WEIGHING A PULLED OBJECT
    Publication number: 20100242836
    Abstract: Pulling systems are disclosed for measuring the weight of an object coupled to a first end of a cable. The cable is routed over a pulley suspended from a load cell. The force exerted by the cable on the pulley is used to calculate the weight of the object. The second end of the cable is coupled to a drum which when rotated pulls the object by wrapping the cable around the drum. An arm is coupled to the pulley at one end and to a frame at another end. A path traveled by the cable between the pulley and the drum is substantially parallel to a longitudinal axis of the arm. Horizontal force components are transmitted by the arm to the frame and do not affect a force component measured by the load cell, thus increasing the accuracy of the calculated weight of the object.
    Type: Application
    Filed: March 18, 2010
    Publication date: September 30, 2010
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Harold Korb, Richard J. Phillips