Abstract: The present disclosure includes a semiconductor package including a redistribution layer (RDL) having a first surface in contact with input/output (I/O) contacts and a second surface opposite to the first surface. The semiconductor package also includes a staircase interconnect structure formed on the second surface of the RDL and electrically connected with the RDL. The staircase interconnect structure includes staircase layers including a first staircase layer and a second staircase layer stacked on a top surface of the first staircase layer. The second staircase layer covers a portion of the top surface of the first staircase layer such that a remaining portion of the top surface of the first staircase layer is exposed. Integrated circuit (IC) chips are electrically connected to the RDL via the staircase interconnect structure. A first IC chip of the IC chips is electrically connected to the RDL through the remaining portion of the top surface of the first staircase layer.

Abstract: Embodiments of this invention provide a measurement map configuration method and apparatus. A wafer to be inspected is provided. The wafer includes a plurality of inspection marks. A first inspection result is obtained based on a first set of inspection marks. A second set of inspection marks is selected based on a preset rule. The second set of inspection marks is less than the first set of inspection marks. A second inspection result is obtained based on the second set of inspection marks. If an overlay accuracy of the second inspection result matches an overlay accuracy the first inspection result, a measurement map for the wafer is set based on target inspection marks. The target inspection marks are the second set of inspection marks of the measurement map.

Abstract: In a semiconductor device, a stack of alternating gate layers and insulating layers is formed. Channel structures are formed in an array region of the stack. A first staircase is formed at a first section of the stack. A second staircase is formed at a second section of the stack. A dummy staircase is formed at the first section and disposed between the first staircase and the second staircase. The dummy staircase includes dummy group stair steps descending in a second direction parallel to a plane defined by any one of the gate layers and the insulating layers, and dummy division stair steps descending in a third direction and a fourth direction parallel to the plane and perpendicular to the second direction. The third direction and the fourth direction are opposite to each other.

Abstract: A semiconductor device is provided. The semiconductor device includes a first wafer having an array transistor formed therein, and a second wafer having a capacitor structure formed therein. The semiconductor device also includes a bonding interface formed between the first wafer and second wafer that includes a plurality of bonding structures. The bonding structures are configured to couple the array transistor to the capacitor structure to form a memory cell.

Abstract: A method for operating a memory device includes receiving an input that includes a command signal, an address signal, and a data signal, transmitting the command signal or the address signal to a low speed buffer, and transmitting the data signal to a high speed buffer.

Abstract: The present disclosure provides a method of data protection for a NAND memory. The method includes programming first and second pages of a NAND flash memory device according to programming data such that data stored in the first and second pages are redundant. The programming of the first and second pages includes a plurality of programming operations using a plurality of programming voltages and a plurality of verifying operations to determine whether programmed memory cells of the first page have threshold voltage levels according to the programming data. The method also includes determining a completion of the programming of the first and second pages based on each of the plurality of verification operations returning a pass result. The method also includes performing, after the determining, a read operation on the second page by the NAND flash memory device to self-verify the data stored at the second page.

Abstract: A semiconductor structure, a fabrication method thereof, a memory, and a memory system are provided. The method may include forming a plurality of capacitor holes extending through a stack of layers in the first region and the second region of the stack of layers. The method may include forming a first electrode layer over the inside walls of the respective capacitor holes. The method may include forming a dielectric layer over the stack of layers. The method may include removing at least part of the dielectric layer in the second region. The method may include forming a second electrode layer. The portion of the second electrode layer in the first region may be separated from the portion of the second electrode layer in the second region. In the second region, the first electrode layer may be connected with the second electrode layer.

Abstract: The present disclosure provides a method for controlling bit line voltages in a three-dimensional memory device. The method includes ramping up a bit line clamp regulation voltage and a control signal regulation voltage. The method also includes ramping up a bit line clamp enabling voltage and a control signal enabling voltage. The method also includes increasing a bit line clamp voltage in one stage, and increasing a control signal voltage in two stages. The method also includes decreasing the control signal voltage. The method also includes ramping down the bit line clamp enabling voltage, the bit line clamp regulation voltage, the control signal enabling voltage, and the control signal regulation voltage. The method further includes decreasing the bit line clamp voltage.

Abstract: A random data generation circuit includes: a first shift register and a second shift register. The first shift register includes n output ends Q1 to Qn, the second shift register includes n output ends Qn+1 to Q2n, and each of the output ends outputs 1-bit data in a clock cycle of a clock signal; and a parallel-to-serial circuit, coupled to the output ends Q1 to Q2n and configured to convert parallel data output from Q1 to Q2n in a clock cycle into serial data for output. An initial value of the first shift register is different from an initial value of the second shift register. Data may be generated in parallel by using two shift registers, and the parallel data generated by the two shift registers is converted into serial data by using the parallel-to-serial circuit to be output.

Abstract: In certain aspects, a memory device includes an array of memory cells and an input/output (V/O) circuit. The array of memory cells includes N main banks and M redundant banks. Each of N and M is a positive integer, and N is greater than M. The I/O circuit includes a set of write multiplexers (MUXs) respectively coupled to the N main banks and M redundant banks. Each of the N main banks and M redundant banks is coupled to an individual write MUX of the set of write MUXs.

Abstract: The present disclosure provides a method of erase and erase verification for a memory device. The method includes applying a first erase voltage to erase memory cells of the memory device. The first erase voltage is incrementally increased by a first erase step voltage until the memory cells pass an initial erase verification. The method also includes determining whether the memory cells pass or fail sub-erase verifications by applying sub-erase verification voltages. The method further includes applying a second erase voltage to erase the memory cells after the sub-erase verifications. The second erase voltage is increased from the first erase voltage by a second erase step voltage, which is smaller than the first erase step voltage and is determined according to whether the memory cells pass or fail the sub-erase verifications.

Abstract: Aspects of the disclosure provide a semiconductor device. The semiconductor device includes a first stack of layers including a source connection layer and a second stack of layers including gate layers and insulating layers. The gate layers and the insulating layers are stacked alternatively upon the first stack of layers. Further, the semiconductor device includes channel structures that are formed along the first direction in the first stack of layers and the second stack of layers, and a gate line cut structure having a trench that cuts through the first stack of layers and the second stack of layers. The trench is filled with at least an insulating layer. The semiconductor device includes a support structure having a first portion that is disposed at a side of the gate line cut structure and extended from the side of the gate line cut structure and underneath the second stack of layers.

Abstract: Embodiments of three-dimensional (3D) memory devices and methods for controlling a photoresist (PR) trimming rate in the formation of the 3D memory devices are disclosed. In an example, a method includes forming a dielectric stack over a substrate, measuring a first distance between the first trimming mark and the PR layer along a first direction, and trimming the PR layer along the first direction. The method also includes etching the dielectric stack using the trimmed PR layer as an etch mask to form a staircase, forming a second trimming mark using the first trimming mark as an etch mask, measuring a second distance between the second trimming mark and the trimmed PR layer, comparing the first distance with the second distance to determine a difference between an actual PR trimming rate and an estimated PR trimming rate, and adjusting PR trimming parameters based on the difference.

Abstract: A circuit assembly includes an IC die and a stack of capacitor dies. The IC die has a first hybrid bonding layer. The stack of capacitor dies includes a first capacitor die and a second capacitor die. The first capacitor die has a second hybrid bonding layer in contact with the first hybrid bonding layer. The second capacitor die is stacked over the first capacitor die. The first capacitor die has a third hybrid bonding layer. The second capacitor die has a fourth hybrid bonding layer coupled to the third hybrid bonding layer. The second capacitor die has a first side and a second side, the fourth hybrid bonding layer is formed on the second side, a plurality of conductive vias is formed on the first side, and the second capacitor die further comprises a plurality of interface bumps electrically connecting to the conductive vias.

Abstract: Embodiments of interconnect structures of a three-dimensional (3D) memory device and method for forming the interconnect structures are disclosed. In an example, a 3D NAND memory device includes a substrate, an alternating layer stack including a staircase structure on the substrate, and a barrier structure extending vertically through the alternating layer stack. The alternating layer stack includes an alternating dielectric stack and an alternating conductor/dielectric stack. The alternating dielectric stack includes dielectric layer pairs enclosed by at least the barrier structure. The alternating conductor/dielectric stack includes conductor/dielectric layer pairs. The memory device further includes a channel structure and a slit structure each extending vertically through the alternating conductor/dielectric stack, an etch stop layer on an end of the channel structure, and first contacts.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a staircase structure disposed over a substrate. The staircase structure includes a plurality of layer stacks, where each layer stack is made of a first material layer over a portion of a second material layer. The staircase structure further includes a plurality of landing pads, where each landing pad is disposed over another portion of the second material layer of a respective layer stack.

Abstract: The present disclosure provides systems, methods and media of optimization of temporary read errors (TRE) in three-dimensional (3D) NAND memory devices. The (3D) NAND memory devices comprises a plurality of memory cells arranged as an array of NAND memory strings, a plurality of word lines couple to the memory cells, and a controller. The controller is configured to determine whether a next read operation is a first read operation of the memory device after recovering from an idle state, and in response to a positive result of the determination, control the memory device to perform an extended pre-phase of the first read operation before a read-phase of the first read operation.

Abstract: Disclosed are three-dimensional (3D) memory devices and fabricating methods thereof. In some embodiments, a disclosed memory device comprises a wafer structure having a sealing region and a chip region. The wafer structure comprises a substrate, a memory string array on a first side of the substrate in the chip region, a first protection structure and a second protection structure on the first side of the substrate in the sealing region, and a first contact and a second contact extending through the substrate in the sealing region. The first contact is in contact with the first protection structure, and the second contact is in contact with the second protection structure.

Abstract: A three-dimensional (3D) memory device and a fabricating method for forming the same are disclosed. The 3D memory device can include an alternating conductor/dielectric layer stack disposed on a substrate, a first staircase structure and a second staircase structure formed in the alternating conductor/dielectric layer stack, a staircase bridge extending in a first direction and electrically connecting the first staircase structure and the second staircase structure, and a first bottom select gate segment covered or partially covered by the staircase bridge. The first bottom select gate segment can include an extended portion extending in a second direction different from the first direction.

Abstract: Three-dimensional (3D) NAND memory devices and methods are provided. In one aspect, a fabrication method for a 3D NAND memory device includes providing a substrate, forming at least one contact pad over a first portion of a face side of the substrate, forming memory cells over a second portion of the face side of the substrate, depositing a first dielectric layer to cover the at least one contact pad and the memory cells of, forming a first connecting pads over the first dielectric layer and connected to the at least one contact pad and the memory cells, bonding the first connecting pads with second connecting pads of a peripheral structure, and exposing the at least one contact pad from a back side of the substrate.