Abstract: The present disclosure provides a memory device that includes a memory array and a page buffer. The memory array includes a plurality of memory cells coupled to a bit line of the memory array. The page buffer is coupled to the plurality of memory cells via the bit line to sense stored data in the memory cells. The page buffer includes first, second, and third transistors coupled to the bit line, first and second nodes, a capacitance structure coupled to the first node, and a latch circuit coupled to the bit line via the first transistor. First terminals of the first, second, and third transistors are coupled to the first node. A second terminal of the second transistor is coupled to the second node. The third transistor amplifies a read margin voltage at the second node. The page buffer shortens a time of a read operation or verify operation.

Abstract: Aspects of the disclosure are directed to a memory system that can include a controller and a memory coupled thereto, each memory cell of the memory is configured to store m-bit information, and the controller includes at least one of an exclusive OR circuit, an inverter and an access circuit. The controller is configured to receive n groups of logic page data, and generate, at different values of m and n, at least one group of logic page data selectively by at least one of the exclusive OR circuit, the inverter and the access circuit. The controller is further configured to transmit the m groups of logic page data to the memory to generate 2n different data states in the memory.

Abstract: The disclosure provides a power supply circuit, a memory, a testing device, a memory system and an electronic device, relates to the memory technologies, and may reduce the testing time of the memory and the footprint occupation of the memory. The power supply circuit can include a voltage adjusting circuit and an oscillation circuit. A first voltage output terminal of the voltage adjusting circuit is coupled with a power supply input terminal of a delay chain circuit in the memory and coupled with a power supply input terminal of the oscillation circuit. The voltage adjusting circuit is configured to output a first voltage to the delay chain circuit and the oscillation circuit via the first voltage output terminal. The oscillation circuit is configured to generate a clock signal corresponding to the first voltage. The voltage adjusting circuit is also configured to receive an adjusting signal for adjust the first voltage.

Abstract: Embodiments of a three-dimensional (3D) memory device and fabrication methods are disclosed. In some embodiments, the 3D memory device includes a peripheral circuitry formed on a first substrate. The peripheral circuitry includes a plurality of peripheral devices on a first side of the first substrate, a first interconnect layer, and a deep-trench-isolation on a second side of the first substrate, wherein the first and second sides are opposite sides of the first substrate and the deep-trench-isolation is configured to provide electrical isolation between at least two neighboring peripheral devices. The 3D memory device also includes a memory array formed on a second substrate. The memory array includes at least one memory cell and a second interconnect layer, wherein the second interconnect layer of the memory array is bonded with the first interconnect layer of the peripheral circuitry, and the peripheral devices are electrically connected with the memory cells.

Abstract: Methods, systems, and apparatus for management of operations in a memory system are described. An example system includes a memory device and a memory controller. The memory device includes a first buffer, a second buffer, and a third buffer including a plurality of data buffers. The memory device receives a first portion of first data of a first request from the memory controller, and stores the first portion of the first data in the first buffer or a first data buffer of the third buffer. The memory controller sends a second request to the memory device. The memory device, in response to the second request, moves the first portion of the first data from the first buffer or the first data buffer to the second buffer. The memory device performs an operation in response to the second request without using the second buffer.

Abstract: A semiconductor device and a method of manufacturing the same, and an electronic apparatus including the semiconductor device are provided. The semiconductor device includes: an active region, on a substrate, extending substantially in a vertical direction; a gate stack formed around at least a part of a periphery of the active region, the active region including a channel region opposite to the gate stack, and a first source/drain region and a second source/drain region, and the gate stack including a gate dielectric layer, a work function tuning layer and a gate electrode material layer, and the work function tuning layer being between the gate electrode material layer and the channel region; and a first low-k dielectric layer extending from a first end of the work function tuning layer to surround a first corner of an end portion, on a side facing the channel region, of the gate electrode material layer.

Abstract: Embodiments of the present disclosure provide a memory system, and a method for garbage collection of the memory system. The method can include reading N valid data sets in a to-be-collected virtual block (VB) of a memory out to a copy buffer sequentially, where N is an integer greater than or equal to 2, transferring a valid data set in the copy buffer to a corresponding cache, and reading a next valid data set out to the copy buffer, and programming the valid data set in the cache to a corresponding target die group of a target VB. A time period in which a current valid data set is programmed from the cache to the target die group corresponding to the cache overlaps at least partially with a time period in which a next valid data set is read from the to-be-collected VB to the copy buffer.

Abstract: A method for conducting a read-verification operation on a target memory cell in a three-dimensional (3D) memory device includes removing fast charges of the target memory cell at a read-prepare step and measuring a threshold voltage of the target memory cell at a sensing step. Removing the fast charges of the target memory cell includes applying a prepare voltage (Vprepare) on an unselected top select gate (Unsel_TSG) of an unselected memory string, applying a first off voltage (Voff) on a selected word line (Sel_WL) associated with the target memory cell, and applying a pass voltage (Vpass) on an unselected word line (Unsel_WL).

Abstract: Embodiments of this invention provide a voltage output test circuit, a voltage divider output circuit, and a memory. The voltage output test circuit includes: a first voltage divider unit, including a first terminal and a second terminal, where the first terminal of the first voltage divider unit is connected to a test power supply, and the second terminal of the first voltage divider unit is connected to an output terminal; a second voltage divider unit, including a first terminal and a second terminal, where the first terminal of the second voltage divider unit is connected to a ground, and the second terminal of the second voltage divider unit is electrically connected to the output terminal; and a third voltage divider unit, configured to adjust a resistance between the output terminal and the ground.

Abstract: Examples provide for error correction. The error correction includes: obtaining first soft data according to first hard read data and cached second hard read data after hard decision decoding for the first hard read data fails, wherein the first hard read data is read according to a first hard read voltage, and the second hard read data is read according to a second hard read voltage before reading the first hard read data; and performing first soft decision decoding according to the first soft data and the first hard read data, or according to the first soft data and the second hard read data, wherein the first hard read voltage is one of a plurality of re-read voltages corresponding to a read command; and the second hard read voltage is an initial read voltage or a re-read voltage of the plurality of re-read voltages except the first hard read voltage.

Abstract: The present disclosure is directed to an operating method of a memory controller, a memory controller, a memory system, and an electronic device. Herein, the operating method can include determining a backup region to be used in an idle state from a memory array, when detecting that remaining capacity of a currently used backup region for storing redundancy parity data in the memory array is less than a required capacity of redundancy parity data to be written, determining the quantity of all backup regions for storing redundancy parity data including the backup region to be used in the memory array, deciding whether the quantity is larger than a preset threshold, and erasing backup regions having stored redundancy parity data in the memory array when the quantity is larger than the preset threshold.

Abstract: The present disclosure provides an electronic device and a driving method. The electronic device comprises: a sensitivity amplifier and a voltage adjustment circuit. The sensitivity amplifier includes: a first P-type transistor, a second P-type transistor, a first N-type transistor, a second N-type transistor, and a control circuit. The control circuit is connected to the third node, the fourth node, and a preset voltage terminal. A first control signal terminal responds to the signal of the first control signal terminal to connect the preset voltage terminal and the third node and the fourth node. The preset voltage terminal inputs a preset voltage signal. The electronic device write a preset voltage signal of a suitable size to the sensitivity amplifier through the voltage adjustment circuit, so that the sensitivity amplifier has an appropriate voltage difference between the bit line and the complementary bit line during offset elimination.

Abstract: An address signal transmission circuit includes a transmission control circuit, connected to an address bus, configured to receive address signals from the address bus, acquire a first address signal and a second address signal, and generate and output an inversion flag signal based on the first address signal and the second address signal, where the first address signal is an address signal received in a previous time and the second address signal is a currently received address signal; and a selection circuit, connected to the address bus, configured to receive the address signals from the address bus, determine, in response to the inversion flag signal, whether the second address signal is to be inverted, and correspondingly output one of the second address signal or an address inverted signal, where the selection circuit inverts the second address signal to obtain the address inverted signal.

Abstract: Aspects of the disclosure provide a semiconductor device. For example, the semiconductor device can include a first deserializer, a second deserializer, and a write data converter coupled to the first deserializer and the second deserializer. The first deserializer can be configured to convert serial data to parallel data based on a set of write clock signals, thus the parallel data has a first timing alignment with regard to the set of write clock signals. The second deserializer can be configured to generate a mask pattern based on the set of write clock signals, thus the mask pattern has a second timing alignment with regard to the set of write clock signals. The write data converter can be configured to generate valid data based on the parallel data and the mask pattern.

Abstract: The present disclosure provides a three-dimensional NAND memory device, comprising a memory array comprising blocks, each block includes first memory cells and second memory cells connected in series to a bit line, a word line driver, and a controller configured to control the word line driver to: performing a programming operation on a memory cell in the first memory cells, the memory cell is controlled by a selected word line of first word lines corresponding to the first memory cells, the first word lines comprising first unselected word lines adjacent to the selected word line, and the performing the programming operation comprises: applying a programming voltage signal to the selected word line to program the memory cell into a target state; applying a first pass voltage to the first unselected word lines; and applying a second pass voltage to second word lines corresponding to the second memory cells.

Abstract: Embodiments of 3D memory devices and fabricating methods thereof are disclosed. The method comprises forming an array device semiconductor structure comprising an alternating conductor/dielectric stack disposed on a semiconductor layer, and an array interconnect layer disposed on the alternating conductor/dielectric stack and including a first interconnect structure. The method further comprises a peripheral device disposed on a substrate, and a peripheral interconnect layer disposed on the peripheral device and including a second interconnect structure and a pad. The pad is electrically connected with the peripheral device through the second interconnect structure. The method further comprises bonding the array interconnect layer to the peripheral interconnect layer, such that the first interconnect structure is joined with the second interconnect structure. The method further comprises forming a pad opening exposing a surface of the pad.

Abstract: A method of programming a ferroelectric memory device is disclosed. The method includes applying a first voltage to a first word line; applying a second voltage to the first word line; and applying a pass voltage to a second word line during a period of applying the first voltage to the first word line and during a period of applying the second voltage to the first word line. The pass voltage is between the first threshold voltage and the second threshold voltage.

Abstract: A method can include performing a single-read operation at a read reference voltage to detect bits from memory cells. Dummy data is previously programmed into the memory cells. Original bits of the memory cells can be determined based on a default read reference voltage and known values of the dummy data. The detected bits and the original bits are compared to determine an upper-state failed bit count (FBC) corresponding to the memory cells having threshold voltages shifted from above the read reference voltage to below the read reference voltage and a lower-state FBC corresponding to the memory cells having threshold voltages shifted from below the read reference voltage to above the read reference voltage. When a difference between the upper-state FBC and the lower-state FBC being smaller than a threshold, the read reference voltage can be determined to be a best read reference voltage.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a staircase structure disposed over a substrate. The staircase structure includes a plurality of layer stacks, where each layer stack is made of a first material layer over a portion of a second material layer. The staircase structure further includes a plurality of landing pads, where each landing pad is disposed over another portion of the second material layer of a respective layer stack.

Abstract: In a method for fabricating a semiconductor device, an initial stack of alternatingly sacrificial word line layers and insulating layers is formed over a substrate of the semiconductor device. A connection region, a first staircase region, and a second staircase region are patterned in the initial stack. The first staircase region is shaped in the initial stack to form a first staircase, and the second staircase region is shaped in the initial stack to form a second staircase. The first staircase is formed in a first block of the initial stack and extends between first array regions of the first block. The second staircase is formed in a second block of the initial stack and extends between second array regions of the second block. The connection region is formed in the initial stack between the first staircase and the second staircase.