Abstract: A storage product manufactured as a component to be installed in a computing device to provide network storage services. The storage product has a network interface to receive storage access messages from a remote host system, a bus connector connectable via an external computer bus to an external local host system, a local storage device, and a computational storage processor. The storage product is configured to: separate the storage access messages into first messages, second messages, and third messages; provide the first messages to an external local host system to generate fourth messages; and provide the second messages to the computational storage processor to generate fifth messages. To implement network storage services provided via the network interface, the local storage device executes commands in the third messages, the fourth messages from the local host system, and the fifth messages from the computational storage processor.

Abstract: Methods, systems, and devices for an interactive environmental control system are described. In some examples, operating temperatures for individual zones of an environment may be determined based on inputs received from occupants of the respective zones. For example, a building may be separated into zones, and environmental conditions at each zone may be monitored and adjusted independently. Each occupant of a zone may update their environmental preference and the system may utilize the user inputs to set and adjust an operating temperature for the respective zone based on the occupants' preferences. In some examples, the system may implement machine learning techniques to predict and set operating conditions for the zones based on inputs, such as a history of inputs, from building occupants (e.g., from occupants of a respective zone).

Abstract: A computer storage device having a host interface, a controller, non-volatile storage media, and firmware. The firmware instructs the controller to: allocate a named portion of the non-volatile storage device; generate, according to a first block size, first block-wise mapping data; translate, using the first block-wise mapping data, logical addresses defined in the named portion to logical addresses defined for the entire non-volatile storage media, which can then be further translated to physical addresses in a same way for all named portions; determine a second block size; generate, according to the second block size, second block-wise mapping data; translate, using the second block-wise mapping data, the logical addresses defined in the named portion to the logical addresses defined for the entire non-volatile storage media.

Abstract: An apparatus includes a semiconductor substrate; a line-shaped trench in the semiconductor substrate, an inner wall of the line-shaped trench being covered with an insulating film; a first conductive member including first and second line-shaped portions, the first line-shaped portion filling a lower portion of the line-shaped trench; and line-shaped second and third conductive members extending along the inner wall of the line-shaped trench and facing each other, the line-shaped second and third conductive members having a void therebetween; wherein the second line-shaped portion of the first conductive member protrudes from a central portion of the first line-shaped portion to fill the void.

Abstract: Apparatuses and methods can be related to implementing a transformer neural network in a memory. A transformer neural network can be implemented utilizing a resistive memory array. The memory array can comprise programmable memory cells that can be programed and used to store weights of the transformer neural network and perform operations consistent with the transformer neural network.

Abstract: A processing device in a memory sub-system identifies a first memory device and a second memory device and configures the second memory device with a zone namespace. The processing device identifies a first portion and a second portion of the first memory device, the first portion storing zone namespace metadata corresponding to the zone namespace on the second memory device. The processing device further exposes the second portion of the first memory device to a host system as a non-zoned addressable memory region.

Abstract: The present disclosure includes apparatuses, methods, and systems for data relocation in memory. An embodiment includes a controller, and a memory having a plurality of physical units of memory cells. Each of the physical units has a different sequential physical address associated therewith, a first number of the physical units have data stored therein, a second number of the physical units do not have data stored therein, and the physical address associated with each respective one of the second number of physical units is a different consecutive physical address in the sequence. The controller can relocate the data stored in the physical unit of the first number of physical units, whose physical address in the sequence is immediately before the first of the consecutive physical addresses associated with the second number of physical units, to the last of the consecutive physical addresses associated with the second number of physical units.

Abstract: An electronic device, such as a memory device, may include various circuit components. The electronic device may also include one or more voltage testing circuits to determine whether signals of one or more of the circuit components are within acceptable voltage ranges of the respective circuit components. Systems and methods are described to improve correct voltage measurement of the received signals by a voltage testing circuit. In particular, multiple supply voltage levels are provided to different components of the voltage testing circuit to provide a sufficient headroom voltage gap between received signals and the supply voltages. For example, some active circuits (e.g., operational amplifiers) of the voltage testing circuit may receive a higher supply voltage of the electronic device compared to one or more other circuits of the voltage testing circuit.

Abstract: Methods, systems, and devices for techniques for detecting a state of a bus are described. A memory device may receive an access command transmitted to the memory device via a bus. The memory device may transmit data requested by the access command over data lines and a control signal that indicates the bus is in an active state over a control line. The control signal may be transmitted during a first unit interval of a read operation. The control signal may be configured to have a first voltage when the bus is in an idle state and a second voltage when the bus is in the active state. The control line may be configured to have or trend toward the first voltage when the bus is in the idle state.

Abstract: Methods, systems, and devices for host recovery for a stuck condition of a memory system are described. The host system may transmit a first command for the memory system to transition from a first power mode to a second power mode (e.g., low-power mode). In some cases, the host system may transmit a second command for the memory system to exit the second power mode shortly after transmitting the first command. The host system may activate a timer associated with a time-out condition for exiting the second power mode and may determine that a duration indicated by the timer expires. In some examples, the host system may transmit a third command for the memory system to perform a hardware reset operation based on determining that the duration of the timer expires.

Abstract: Semiconductor devices and semiconductor device packages may include at least one first semiconductor die supported on a first side of a substrate. The at least one first semiconductor die may include a first active surface. A second semiconductor die may be supported on a second, opposite side of the substrate. The second semiconductor die may include a second active surface located on a side of the second semiconductor die facing the substrate. The second semiconductor die may be configured to have higher median power consumption than the at least one first semiconductor die during operation. An electronic system incorporating a semiconductor device package is disclosed, as are related methods.

Abstract: A memory device to perform a read disturb mitigation operation. For example, the memory device can measure signal and noise characteristics of a group of memory cells to determine an optimized read voltage of the group of memory cells and determine a margin of read disturb accumulated in the group of memory cells. Subsequently, the memory device can identify the group of memory cells for the read disturb mitigation operation based on the margin of read disturb and a predetermined threshold.

Abstract: A system having a processing device and a controller, operatively connected to a memory sub-system via a communication channel, to: store information identifying an amount of available capacity of a buffer of the memory sub-system; transmit, through the communication channel to the memory sub-system, one or more write commands to store data in memory components of the memory sub-system, where the memory sub-system queues the one or more write commands in the buffer; update the information by deducting, from the amount of available capacity, an amount of buffer capacity used by the one or more write commands to generate a current amount of available capacity of the buffer; and determine whether to generate an information request to the memory sub-system based at least in part on the current amount of available capacity.

Abstract: Methods and devices for dynamic allocation of a capacitive component in a memory device are described. A memory device may include one or more voltage rails for distributing supply voltages to a memory die. A memory device may include a capacitive component that may be dynamically coupled to a voltage rail based on an identification of an operating condition on the memory die, such as a voltage droop on the voltage rail. The capacitive component may be dynamically coupled with the voltage rail to maintain the supply voltage on the voltage rail during periods of high demand. The capacitive component may be dynamically switched between voltage rails during operation of the memory device based on operating conditions associated with the voltage rails.

Abstract: A memory system configured to dynamically adjust the amount of redundant information stored in memory cells of a wordline on an integrated circuit die based on a bit error rate. For example, in response to a determination that a bit error rate of the wordline is above a threshold, the memory system can store first data items as independent first codewords of an error correction code technique into a first portion of the memory cells of the wordline, generate second data items as redundant information from the first codewords, and store the second data items in a second portion of the memory cells of the wordline. If the bit error rate is below the threshold, third data items can be stored as independent second codewords of the same length as the first codewords in the memory cells of the wordline.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for soft post-package repair (SPPR). After packaging, it may be necessary to perform post-package repair operations on rows of the memory. During a scan mode of an SPPR operation, addresses provided by a fuse bank may be examined to determine if they are open addresses or if the bad row of memory is a redundant row of memory. The open addresses and the bad redundant addresses may be stored in volatile storage elements, such as in latch circuits. During a soft send mode of a SPPR operation, the address previously associated with the bad row of memory may be associated with the open address instead, and the address of the bad redundant row may be disabled.

Abstract: Apparatuses and methods for coupling semiconductor devices are disclosed. Terminals (e.g., die pads) of a plurality of semiconductor devices may be coupled in a daisy chain manner through conductive structures that couple one or more terminals of a semiconductor device to two conductive bond pads. The conductive structures may be included in a redistribution layer (RDL) structure. The RDL structure may have a “U” shape in some embodiments of the disclosure. Each end of the “U” shape may be coupled to a respective one of the two conductive bond pads, and the terminal of the semiconductor device may be coupled to the RDL structure. The conductive bond pads of a semiconductor device may be coupled to conductive bond pads of other semiconductor devices by conductors (e.g., bond wires). As a result, the terminals of the semiconductor devices may be coupled in a daisy chain manner through the RDL structures, conductive bond pads, and conductors.

Abstract: Methods, apparatuses, and systems for repairing defective memory cells in regions of a memory array associated with high or low priority levels are disclosed. A repair address generator may be configured to generate a memory address map for repair (e.g., blowing fuses at a fuse circuit), depending on whether certain applications may operate at a high priority level indicative of a low bit error rate or a low priority level indicative of a higher bit error rate. For example, a specified error rate associated with a low priority level may correspond to a threshold error rate for certain applications, such as a neural network application that stores trained weights. Such neural network applications may access trained weights being partially stored in defective memory cells, with the least significant bits of such trained weights being stored in defective memory cells that are not repaired according to the memory address map.

Abstract: A configuration setting manager of a memory device receives a request to perform an adjustment operation on a set of configuration setting values for the memory device, where each configuration setting value of the set of configuration setting values is stored in a corresponding configuration register of a set of configuration registers; determines a configuration adjustment definition associated with one or more configuration setting values of the set of configuration setting values; calculates an updated set of configuration setting values by applying a multiplier value to the configuration adjustment definition, wherein the multiplier value is associated with a number of programming operations performed on the memory device; and stores the updated set of configuration setting values in the corresponding configuration registers.

Abstract: Methods, systems, and devices for techniques for enhanced system performance after retention loss are described. A memory system may program a page of memory cells in response to receiving a power down notification. As part of the programming, the memory system may record an indication of a voltage threshold of the page and power down for a duration of time, during which the memory system may experience retention loss. Upon powering on, the memory device may compare the voltage threshold of the page to the indication stored prior to powering down and determine a voltage offset for one or more blocks of the memory system. In some cases, the memory system may use the voltage offset to determine a starting bin, and may initiate a bin scan to determine a final bin for the one or more blocks.