Abstract: Apparatuses, systems, and methods for memory initiated calibration. The memory includes a termination circuit with a tunable resistor and a calibration detection circuit with a replica tunable resistor. The calibration detection circuit measures a resistance of the replica tunable resistor and provides a calibration request signal if the resistance is outside a tolerance. Responsive to the calibration request signal, a controller of the memory schedules the memory for a calibration operation.

Abstract: Semiconductor devices are described that have a metal interconnect extending vertically through a portion of the device to the back side of a semiconductor substrate. A top region of the metal interconnect is located vertically below a horizontal plane containing a metal routing layer. Method of fabricating the semiconductor device can include etching a via into a semiconductor substrate, filling the via with a metal material, forming a metal routing layer subsequent to filling the via, and removing a portion of a bottom of the semiconductor substrate to expose a bottom region of the metal filled via.

Abstract: Techniques are described to form a liner to protect a material, such as a storage element material, from damage during subsequent operations or phases of a manufacturing process. The liner may be bonded to the material (e.g., a chalcogenide material) using a strong bond or a weak bond. In some cases, a sealant material may be deposited during an etching phase of the manufacturing process to prevent subsequent etching operations from damaging a material that has just been etched.

Abstract: An apparatus that includes a semiconductor substrate having first and second gate trenches arranged in parallel and extending in a first direction, and first and second gate electrodes embedded in the first and second gate trenches, respectively, via a gate insulating film. Each of the first and second gate electrodes includes a first conductive film located at a bottom of the respective first and second gate trenches and a second conductive film stacked on the first conductive film. The second conductive film included in a first portion of the second gate electrode is thinner than the second conductive film included in a first portion of the first gate electrode which is arranged adjacently to the first portion of the second gate electrode in a second direction crossing to the first direction. The second conductive film is lower in work function than the first conductive film.

Abstract: An apparatus that includes a first conductive pattern positioned at a first wiring layer and extending in a first direction, a second conductive pattern positioned at a second wiring layer located above the first wiring layer and extending in a second direction, and a contact plug connecting the first conductive pattern with the second conductive pattern. The contact plug includes a lower conductive section contacting the first conductive pattern and an upper conductive section contacting the second conductive pattern. The width of the lower conductive section on a first boundary between the lower and upper conductive sections in the first direction is greater than the width of the upper conductive section on the first boundary in the first direction and the width of the second conductive pattern on a second boundary between the contact plug and the second conductive pattern in the first direction.

Abstract: Memory devices might include an array of memory cells and a controller configured to access the array of memory cells. The controller might be further configured to receive a command to perform an erase operation and in response to the command to perform the erase operation, begin execution of the erase operation. The controller might be further configured to while executing the erase operation, receive a command to perform a program operation; in response to the command to perform the program operation, suspend the execution of the erase operation; and with the execution of the erase operation suspended, execute the program operation.

Abstract: Methods and apparatuses associated with surface cleaning are described. Examples can include detecting at a processing resource of a robot and via a temperature sensor of the robot, a temperature of a surface on which the robot is located. Examples can include the processing resource shutting down the robot in response to the temperature being at or above a particular threshold temperature, and the processing resource instructing the robot to clean the surface following a particular cleaning path using a vacuum, a scrubber, or both in response to the temperature being below a particular threshold temperature.

Abstract: A method includes determining that a ratio of valid data portions of a block of memory cells is greater than or less than a valid data portion threshold and performing a first media management operation on the block of memory cells in response to determining that the ratio of valid data portions is greater than the valid data portion threshold. The method further includes performing a second media management operation on the block of memory cells in response to determining that the ratio of valid data portions is less than the valid data portion threshold.

Abstract: A method includes receiving a request for an allocation of memory resources based on quality of service (QoS) parameters. The method further includes provisioning, via a QoS manager component, a plurality of physical functions to provide the requested allocation of resources. At least two of the plurality of physical functions can be provided to meet a QoS criteria.

Abstract: Various embodiments enable sending a notification to a host system based on an address mapping entry miss (or mismatch) on a memory sub-system, which can facilitate an update of one or more address mapping entries stored on the host system.

Abstract: A memory system includes multiple dice having multiple planes. A processing device is coupled to the dice and performs controller operations including receiving a status indicator signal comprising a pulse that is asserted by one or more planes of the multiple dice. In response to receiving the pulse, the processing device performs at least one of: a first status check of dice operations being performed by the multiple dice at an expiration of a polling delay period; or a second status check of the dice operations in response to detecting the pulse being deasserted. The processing device terminates performances of status checks while the status indicator signal remains deasserted.

Abstract: Methods, systems, and devices for two-stage buffer operations supporting write commands are described. If data is written to a memory device starting at a multi-plane page offset other than zero, the read performance for the data may decrease significantly due to die misalignment. To avoid die misalignment, a memory system may support two buffers for write data: a flush buffer and a temporary buffer. The memory system may determine whether to add received data to the flush buffer, the temporary buffer, or a combination thereof based on a data transfer size and a threshold size. If the data in the temporary buffer satisfies a copy condition, the data in the temporary buffer is copied into the flush buffer. If the data in the flush buffer satisfies a flush condition, the data in the flush buffer is written to the memory device starting at a multi-plane page offset of zero.

Abstract: Methods, systems, and devices for opportunistic data movement are described. A memory device may include a non-volatile memory and a volatile memory that operates as a cache for the non-volatile memory. The memory device may receive a write command from a host device. The write command may be associated with a row of a bank in a volatile memory. The memory device may write data associated with the write command to a buffer that is associated with the bank and that is coupled with the volatile memory. And the memory device may communicate the data from the buffer to the volatile memory based on the write command and before a pre-charge command for the row of the bank is received from the host device.

Abstract: A set of threshold voltage distribution width measurements are obtained for a block in a memory device. An endurance estimate is determined for the block based on the threshold voltage distribution width measurements. The endurance estimate comprises an indication of an estimated number of program/erase cycles during which data can be reliably stored by the block. One or more parameters of the block are managed based on the endurance estimate.

Abstract: A variety of applications can include systems and methods that control a memory size of a changelog in a storage device, where the changelog is implemented to correlate virtual page addresses to physical addresses in one or more memory devices. The memory size can be controlled by an allocation schema for a scalable memory area for the changelog in the storage device. The allocation schema can include using bitmaps, lists linked to the bitmaps, and a counter to count bits asserted in the bitmaps such that the allocation of memory space in the storage device can depend on usage rather than allocating a large memory space for all possible correlations of virtual page addresses to physical addresses.

Abstract: In various embodiments, techniques can be provided to address debug efficiency for failures found on an operational system. The techniques can utilize a real-time trigger to notify a memory device to dump an error log to timely capture all needed information. In response to detecting one or more error conditions associated with the memory device, a system that interfaces with the memory device can generate a trigger signal to the memory device. In response to identifying the trigger signal, the memory device can dump an error log of the memory device to a memory component in the memory device. The error log can later be retrieved from the memory component for failure analysis.

Abstract: A technique to control write operations in a logical partition. For example, a device can receive a user specified write threshold for the logical partition that is hosted on a pool of memory cells shared by a plurality of logical partitions in wear leveling. An accumulated amount of data written into the memory cells according to write requests addressing the logical partition is tracked. In response to the accumulated amount reaches the write threshold, further write requests addressing the logical partition can be blocked, rejected, and/or ignored. For example, the logical partition can be used to buffer data for time shift in playing back content streaming from a server. Write operations for time shift can be limited via the user specified threshold to prevent overuse of the total program erasure budget of the pool of memory cells shared with other logical partitions.

Abstract: Methods, systems, and devices for dynamic status registers array are described. An apparatus may include one or more memory dice coupled with a data bus. The apparatus may further include a controller coupled with each of the memory dice via the data bus that is configured to transmit a first command associated with a first operation to a first memory die. The first command may assign an associated operation (e.g., the first operation) to a queue slot of a status bank that is associated with at least the first memory die. The controller may further transmit second command to the first memory die to request a status of the first operation. The controller may receive a status of the first operation via a channel (e.g., a first channel) of the data bus that is based on the assigned queue slot of the status bank.

Abstract: Methods, systems, and devices for row address latching for multiple activate command protocol are described. A memory device may receive a first activate command that indicates a first set of bits of a row address and may store the first set of bits to obtain a first delayed signal of the first set of bits. The memory device may receive a second activate command that indicates a second set of bits of the row address and may store the second set of bits to obtain a first delayed signal of the second set of bits. The memory device may store the first delayed signal of the first set of bits to obtain a second delayed signal of the first set of bits and may activate a page of memory addressed according to the second delayed signal and the first delayed signal of the second set of bits.

Abstract: In some implementations, a memory device may detect a read command associated with reading data stored by the memory device. The memory device may determine whether the read command is from a host device in communication with the memory device. The memory device may select, based on whether the read command is from the host device, one of a first voltage pattern or a second voltage pattern to be applied to memory cells of the memory device to execute the read command, wherein the first voltage pattern is selected if the read command is from the host device and the second voltage pattern is selected if the read command is not from the host device, wherein the second voltage pattern is different from the first voltage pattern. The memory device may execute the read command using a selected one of the first voltage pattern or the second voltage pattern.