Abstract: Disclosed is an apparatus for spinning a test tray and an in-line test handler including the above apparatus, wherein the apparatus may include a supporting unit for supporting a test tray transported between first and second chamber units facing in the different directions, wherein the first chamber unit is provided at a predetermined interval from the second chamber unit; a base unit to which the supporting unit is spinnably connected; and a spinning unit which spins the test tray so that semiconductor devices received in the test tray are tested at the same arrangement in each of the first chamber unit and the second chamber unit.

Abstract: Disclosed is an apparatus for spinning a test tray and an in-line test handler including the above apparatus, wherein the apparatus may include a supporting unit for supporting a test tray transported between first and second chamber units facing in the different directions, wherein the first chamber unit is provided at a predetermined interval from the second chamber unit; a base unit to which the supporting unit is spinnably connected; and a spinning unit which spins the test tray so that semiconductor devices received in the test tray are tested at the same arrangement in each of the first chamber unit and the second chamber unit.

Abstract: Provided is a carrier module for use in a handler for handling a packaged chip for a test, the carrier module including a body provided, a base plate where the packaged chips are placed, provided to the body, and at least one latch which holds the packaged chips in position in the base plate.

Abstract: A system and method is provided for transferring multiple test trays within a test handler. The system includes at least one moving member having a pushing member that pushes a first test tray and a pulling member that pulls on a projection on a second test tray to move the first and second test trays simultaneously with the moving member. The system also includes a second plate to which the at least one moving member is fixed, and a first plate to which the second plate is movably fixed. A handler may be equipped with this system so that two test trays may be moved at the same time to decrease overall processing time and improve efficiency and productivity of the handler.

Abstract: A test handler, a packaged chip loading method, a test tray transferring method, and a packaged chip manufacturing method are provided. The test handler may include a loading unit, a chamber system, an unloading unit, at least one rotating unit and a transferring unit. The loading unit may include a loading buffer disposed to be movable along a moving path formed over a loading position and a loading picker to perform a loading process on the test tray located at the loading position. The chamber system having the packaged chips connected to a hi-fix board and tested. The unloading unit may include an unloading picker to perform an unloading process on the test tray located at an unloading position. The at least one rotating unit may be disposed between the loading unit and the unloading unit to rotate the test tray transferred from the loading unit from a horizontal posture to a vertical posture, and to rotate the test tray transferred from the chamber system from a vertical posture to a horizontal posture.

Abstract: A test handler includes a loading unit including a loading picker and a loading ascending/descending unit, an unloading unit including an unloading picker and an unloading ascending/descending unit, and a chamber system. A passage site connects the loading unit and the chamber system, and also connects the chamber system and the unloading unit. The arrangement of the handler reduces the time for the loading and unloading processes by performing the loading and unloading processes on separate test trays located at separate loading and unloading positions.

Abstract: Provided are an apparatus and a method for manufacturing a flat fluorescent lamp. The fluorescent lamp includes a plurality of discharge channels, a gas inlet connecting to the discharge channels, and an exhaust pipe connecting to the gas inlet. The process for manufacturing the fluorescent lamp includes exhausting air from the discharge channels through the exhaust pipe, diffusing a mercury vapor within the discharge channels, blocking a passage between the gas inlet and the most outer channel, and removing the gas inlet and the exhaust pipe.

Abstract: A flat fluorescent lamp which can be used with an LCD display includes a plurality of discharge channels. Pairs of electrodes are formed on both ends of the discharge channels. Each of the plurality of channels has an emitting section at the middle, and electrode sections on both ends thereof. A width of the electrode sections is the same as that of the emitting section. However, a height of the electrode sections is greater than a height of the emitting section, resulting in the electrode section having a cross-sectional area that is larger than that of the emitting section.

Abstract: A feeder for the surface mounting device is disclosed. The feeder includes a feeding unit being installed at one side of a main frame, having a plurality of armature coils and a circular permanent magnetic unit facing the plurality of armature coils to generate a rotation/reverse rotation force and carry a tape at a pitch interval and having a position sensing unit and a position detecting disk capable of sensing the position of the circular permanent magnetic unit, a vinyl separation unit carrying the vinyl removed from the tape by the rotation force or re-carrying the vinyl by the reverse rotation force, and a vinyl recovery unit recovering the vinyl by winding the same by the rotation force or discharging the vinyl by the reverse rotation force.

Abstract: A semiconductor chip test handler includes a first chamber in which packaged chips contained in a test tray are heated to high temperature or cooled to low temperature, a second chamber in which the packaged chips contained in the test tray are tested, and a third chamber in which the packaged chips contained in the test tray are cooled or heated to room temperature. The test trays are horizontally and/or vertically moved in an upright position between the first, second, and third chambers. The chambers may be arranged in a row or in a column. The test trays include a frame and a plurality of carriers into which the packaged chips are loaded. Connecting member and or projections are detachably mounted on lateral sides of the frame. A moving apparatus for moving the test trays between the first, second, and third chambers uses the connecting members and projections to push or pull the test trays into and out of the chambers.

Abstract: A tray transferring apparatus for transferring a handling tray on which semiconductor devices are mounted prevents the semiconductor devices from being scattered or separated from the handling tray. The tray transferring apparatus includes a fixing means installed on a main frame for supporting a fixed tray, a correcting means installed on the main frame for correcting the position of the fixed tray, a gripping means installed on the main frame for gripping a handling tray, and at least one sensor for sensing gripper plates and the handling tray. A fixed tray is held by the fixing means, and right/left inclination of the fixed tray is corrected by the correcting means. An upper portion of a handling tray holding semiconductors is covered by the bottom of the fixed tray and is gripped by the gripping means.

Abstract: A handler for sorting semiconductor chips after they have been tested includes a loading unit for loading chips to be tested and an unloading unit for unloading chips that have been already tested. Chips arrive in trays at the loading unit, and a loading picker removes the chips from the tray. When a tray is empty, it is moved over to the unloading unit by a tray transfer mechanism so that tested chips can be placed back into the tray. The tray transfer mechanism rotates the empty trays upside down as it is moved from the loading unit to the unloading unit to ensure that the tray is completely empty before it arrives at the unloading unit.

Abstract: Methods of mounting electronic components on a plurality of printed circuit boards simultaneously are provided. An exemplary method may include supplying a first printed circuit board to a first conveyor and then transferring the first printed circuit board to a second conveyor and simultaneously supplying a second printed circuit board to the first conveyor. The method may then include transferring the first printed circuit board to a third conveyor and the second printed circuit board to a third conveyor, and mounting electronic components on about half of the first printed circuit board by moving the first printed circuit board to one side and, simultaneously mounting electronic components on about half of the second printed circuit board. The method may then include sequentially transferring the first and second printed circuit boards to a fourth conveyor, and then sequentially discharging the first and second printed circuit boards.

Abstract: Provided is an apparatus for sorting burn-in tested packaged chips, including a DC test unit performing a DC test on packaged chips, a DC failure/loading head moving in a first direction to load packaged chips onto the DC test unit, and an inserting head moving in a second direction perpendicular to the first direction to transfer DC test-passed packaged chips from the DC test unit to a burn-in board, wherein the DC test unit is moved in the second direction, close to the DC failure/loading head when loading the packaged chips onto the DC test unit and close to the inserting head when transferring the packaged chips to the burn-in board, to sort burn-in tested packaged chips. The structure in which the DC test unit is movable toward the DC failure/loading head and the inserting head makes it possible to reduce the distance which the heads have to travel and to prevent the DC failure/loading head and the inserting head from interfering with each other.

Abstract: A handler for handling semiconductor chips during a testing process includes a loading position at which packaged chips are loaded into a test tray, and an unloading position at which the packaged chips are unloaded from the test tray. The test tray follows a path through the handler from the loading position to the unloading position, and from the unloading position to the loading position. By separately performing the loading and unloading operations at these different positions within the handler, malfunctions in loading and unloading pickers that load and unload the chips may be reduced. Further, a malfunction in one picker performing one operation may be prevented from influencing operations of the other picker performing another operation. Additionally, collision between the loading picker and the unloading picker may be prevented.

Abstract: A transfer device of a handler for testing semiconductor devices is provided in which a pitch between each of a plurality of picker heads may be adjusted without replacing a cam plate. The transfer device may include a base part, a plurality of picker heads movably mounted on the base part, and a cam plate movably mounted on the base part and having a plurality of inclined cam grooves formed therein. Each picker head is connected to a corresponding cam groove by a connection part extending therebetween, with an end of each connection part movably coupled to its respective cam groove. A driving unit reciprocates the cam plate so that, as the ends of the connection parts move within the cam grooves, a position of the picker heads may be varied.

Abstract: A socket assembly for testing semiconductor devices includes a socket board electrically connected to an outside testing device, and a socket guide which covers the socket board. The socket guide has an open part to receive the semiconductor device and allows pins on the semiconductor device to couple with connection pins on the socket board. A spacer may be interposed between the socket board and the socket guide to maintain a predetermined distance between the semiconductor device and the socket board. In this manner, the balls or the leads of each semiconductor device may be pressed onto connection pins of the socket to a predetermined depth, even when the semiconductor devices have different thicknesses.

Abstract: A method for recognizing working position in a semiconductor test handler is disclosed. The method includes the steps of: (a) obtaining necessary information through image input unit while moving device transfer unit to upper portion of tray and in horizontal and vertical directions; (b) obtaining image information of identifiers attached to respective change kits through the image input unit while moving the device transfer unit to the respective change kits and moving the device transfer unit in one direction, and simultaneously obtaining origin of the change kit; (c) comparing kinds of semiconductor devices inputted into control unit of the handler with information of the identifiers which are obtained in the step of (b), and determining whether or not the kinds of the semiconductor devices accords with those of the change kits; and (d) calculating the working position of the device transfer unit using the image information obtained through the steps a) to c) in the image processor and the control unit.

Abstract: A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices.

Abstract: A method of manufacturing a surface emitting fluorescent lamp, designed to reduce a total thickness of the surface emitting fluorescent lamp, and to allow easy sealing of a gas injection port. The method comprises forming at least one injection port connected to one side of a discharge channel in a horizontal direction of the fluorescent lamp to communicate with the discharge channel simultaneous with forming a discharge space, providing a sealant within the gas injection port in order to seal the gas injection port, providing a mercury pellet containing mercury to one side of the sealant, vacuum exhausting the discharge space of the fluorescent lamp, diffusing inert gas into the discharge space, and diffusing mercury vapor evaporated from the mercury pellet into the discharge space. Then, the sealant is melted, and seals a connection between the gas injection port and the discharge channel.