Abstract: A feeder for the surface mounting device is disclosed. The feeder includes a feeding unit being installed at one side of a main frame, having a plurality of armature coils and a circular permanent magnetic unit facing the plurality of armature coils to generate a rotation/reverse rotation force and carry a tape at a pitch interval and having a position sensing unit and a position detecting disk capable of sensing the position of the circular permanent magnetic unit, a vinyl separation unit carrying the vinyl removed from the tape by the rotation force or re-carrying the vinyl by the reverse rotation force, and a vinyl recovery unit recovering the vinyl by winding the same by the rotation force or discharging the vinyl by the reverse rotation force.

Abstract: A handler for testing semiconductor devices is provided, wherein a soaking plate is fitted on a handler body having temperature control means for heating and/or cooling semiconductor devices placed thereon. Loading/unloading shuttles are movably fitted, such that they can move in a forward/backward direction, for carrying the semiconductor deices to/from a test site, thereby simplifying a handler system and permitting accurate temperature testing under in high or low temperature environments.

Abstract: An indexing device in a semiconductor device handler, and a method for operating the same, utilizes a plurality of pairs of loading shuttles and unloading shuttles located on both sides of test sockets. Index heads move over and across the test sockets and the loading/unloading shuttles. While one of the index heads holds devices that are being tested, the other index head unloads tested semiconductor devices on one of the unloading shuttles, receives semiconductor devices to be tested from a loading shuttle, and stands by in the vicinity of the test sockets. This allows the semiconductor devices held by the index head at the stand by position to be immediately inserted into the test socket for testing when the other index head moves for unloading the tested semiconductor devices from the test sockets. As a result, an indexing time period is minimized, a size of the device can be reduced, and easy maintenance can be carried out.

Abstract: A gripper having a grip tip for parts having different shapes is provided for a surface mount device. The gripper includes a piston installed inside of a through hole formed in a holder, and lifted or lowered by air flown in/out through the through hole, a moving unit connected to fixed blocks of the holder by a connection device configured to increase or decrease an interval according to the lifting or lowering operation of the piston, and multiple grip tips configured to support at least three points of a parts having a different shape.

Abstract: The present invention discloses an apparatus for transferring a printed circuit board in which printed circuit boards having various sizes can be transferred by using one transfer apparatus.

Abstract: There is provided a picking apparatus for transferring semiconductor devices in a test handler to increase the number of devices transferred at one time and suitable for devices having different pitches.

Abstract: A surface mounting device of the present invention has a printed circuit board carrier including a plurality of transfers installed at a predetermined portion of a base frame; and a plurality of conveyers movable in a predetermined direction. A surface mounting method of the present invention comprises the steps of: transferring a printed circuit board from a first transfer to one of a plurality of conveyers movable in a predetermined direction; perform the mounting of parts from a feeder on the printed circuit board; transferring the printed circuit board onto which parts have been mounted to the other one of the plurality of conveyers; and transferring the printed circuit board to a second transfer.

Abstract: A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.

Abstract: A linear motor having an air bearing integrally is disclosed. The linear motor includes a “U” shaped frame having permanent magnets spaced from each other on its inner walls, an inverted “U” shaped frame spaced from outer walls of the “U” shaped frame at interval, having an extension frame for protecting the “U” shaped frame and having air injection openings for injecting air into both ends of a center frame, and an armature coil portion installed on the bottom surface of center frame and spaced from the permanent magnets at interval. Accordingly, a step difference between heights generated when the air bearing and the linear motor are installed, can be removed, and the linear motor can be cooled using the air applied to the air bearing.

Abstract: A feeder for the surface mounting device is disclosed. The feeder includes a feeding unit being installed at one side of a main frame, having a plurality of armature coils and a circular permanent magnetic unit facing the plurality of armature coils to generate a rotation/reverse rotation force and carry a tape at a pitch interval and having a position sensing unit and a position detecting disk capable of sensing the position of the circular permanent magnetic unit, a vinyl separation unit carrying the vinyl removed from the tape by the rotation force or re-carrying the vinyl by the reverse rotation force, and a vinyl recovery unit recovering the vinyl by winding the same by the rotation force or discharging the vinyl by the reverse rotation force.

Abstract: A suction head for a mounting apparatus includes: a socket having a first through hole in an inner direction and a fixing member inside the first through hole, one end of the inside of the first through hole being mounted to a hollow shaft by using the fixing member, a nozzle having a second through hole for forming an air passage when sucking parts in the inner direction, a coupling member having a third through hole in the inner direction and plate spring members installed inside the third through hole for supporting the nozzle and for alleviating impact when the nozzle sucks parts, and a holder for fixing the nozzle so that it is not removed from the coupling member.

Abstract: A heating and cooling apparatus is provided which employs a series of thermally conductive plates thermally coupled to heating and cooling devices to heat or cool a mounting plate loaded with semiconductor devices. The mounting plate is assembled on a heating plate, which is then assembled on a cooling plate. The heating plate includes upper and lower plates with a heater therebetween which can heat the heating plate to a desired temperature, which in turn heats the mounting plate and the semiconductor devices. The cooling plate has ‘S’ shaped flow grooves formed throughout. When cooling fluid is flowed through the flow grooves, the cooling plate is cooled, which cools the heating plate, which in turn cools the mounting plate and the semiconductor devices.

Abstract: The present invention discloses a back-up plate up/down apparatus in which a back-up plate is ascended or descended without rocking, maintaining a parallel state. The back-up plate up/down apparatus includes a base plate; guide blocks installed with a constant distance to the base plate; a first driving cylinder installed between the guide blocks; fixed blocks installed with a constant distance to both ends of the base plate and having rotating shafts inserted to both ends thereof; rotating links, in which the rotating shaft is inserted to an end thereof and a connecting member is connected to the other end thereof; a second driving cylinder connected to the connecting members by means of a rod; holders fixed at rods of other connecting members slidably and for fixing the back-up plate; and sensors installed to the holders with a constant distance.

Abstract: The present invention discloses a cooling apparatus for a linear motor comprising: a ‘U’ shaped stator back iron; a stator having a plurality of permanent magnets installed on inner facing surfaces of the stator back iron; a coil unit positioned between the stator and the permanent magnets with a predetermined gap; a movable unit having a movable unit back iron fixed on the coil unit, the movable back iron having at least one first air hole formed therein in a longitudinal direction and a first air nozzle linked to the first air hole for injecting cooling air from the top portion of the coil unit to the bottom portion; and a frame aligned at the lower portion of the coil unit having a second air hole formed in a longitudinal direction thereof for receiving the cooling air and a second air nozzle linked to the second air hole for injecting the cooling air from the bottom portion of the coil unit to the top portion.

Abstract: A surface mounting device having a coplanarity inspection system is disclosed. The surface mounting device includes: a vision apparatus including a camera for picking an electronic component from a head and inspecting a position and an alignment state of the electronic components; a laser sensor including a light receiving part and a light emitting part for inspecting the coplanarity of the electronic components; a controller for controlling data obtained by the laser sensor; and a computer for computing the coplanarity by receiving the data outputted from the controller.

Abstract: The present invention discloses a tape feeder for supplying plural electronic components arranged and mounted to a tape in turn comprising: a main frame; a shutter installed to an upper portion of the main frame for opening and closing a component discharge opening of the electronic components; first and second sprocket wheels installed to a lower portion of the shutter for moving the tape received the electronic components by a predetermined pitch; a rotating latch connected to the first and second sprocket wheels for rotating the first and second sprocket wheels; plural levers connected to a side of the rotating latch for driving the rotating latch; an eccentric cam having a taper formed at its side constructed rotatably for driving the rotating lever; a shutter lever constructed for performing the forward and backward movement of the shutter by the driving of the eccentric cam; and a manual lever for moving the tape by one pitch by a worker when an initial work is set to supply the electronic components.

Abstract: An elevation apparatus for a handler used for loading/unloading integrated circuit devices into/from a test tray is provide that includes an up/down block slidably mounted to be vertically displaceable with respect to a base plate. A nozzle block is affixed to the up/down block for displacement therewith. An aligner assembly is disposed above the nozzle block and supported by a pair of upper base blocks that are slidably mounted for displacement relative to the base plate. An elastically coupling assembly couples the pair of upper base blocks to the up/down block, the elastic coupling assembly upwardly displacing the pair of upper base blocks responsive to a corresponding upward displacement of the up/down block. The apparatus also includes a drive assembly secured to the base plate and coupled to the up/down block for vertically displacing the up/down block.

Abstract: The present invention discloses a stacker for a tray feeder including: a plurality of frames for forming an outer portion of the stacker; an elevator capable of moving upwardly and downwardly and positioned at a side of an auxiliary frame of the plurality of frames; a driving means for driving the elevator; and a magazine for receiving the tray plates and mounted to the elevator. According to the present invention, the tray plate on which the electronic parts is positioned is precisely mounted by the magazine having the alignment bars due to operation of the stacker, and safely transferred to a predetermined position, to improve productivity and reliability.

Abstract: A nozzle rotating apparatus of a module head of a surface mounting device is capable of correcting an error occurring when a nozzle picks an electronic component and places it on a printed circuit board. The nozzle rotating apparatus of a module head of a surface mounting device for picking up an electronic component and placing it at a predetermined position, includes: a head movable in a predetermined direction along an upper portion of a substrate and having at least one shaft; a driving means for driving the head; a nozzle mounted at a lower predetermined portion of the head to pick up and place the electronic component; pinions installed at the outer periphery of the shaft installed at a predetermined portion of the head; a rack engaged with the pinions; and a driving force transmitting means for moving the rack to a predetermined direction.

Abstract: Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature.