Abstract: A multi-stacker for a handler is provided. After a device positioned in a test tray is tested at a test site and is classified, each test tray is unloaded according to the classification. The multi-stacker for a handler includes a stacker frame installed longitudinally on a handler frame and coupled to a side plate, a tray stacking portion for stacking a test tray loaded with a classified device in the stacker frame, and a guide for determining a position of a test tray placed on the tray plate and installed at four edges of the tray plates so as to prevent the tray plate from deviating from a predetermined position. As the tray is moved up and down along an inside of the guide, the test tray holding a classified device may be unloaded.

Abstract: The present invention discloses a transfer for a tray feeder comprising: a base frame; a support frame installed at both sides of the base frame; first and second linear motion guiders installed oppositely and longitudinally to the inside of the support frame and having a plurality of first and second linear motion guide rails; first and second plates installed to an upper portion of the first and second linear guides and having a cylinder block capable of supporting a side of the tray received an electronic parts and the like; and a driving unit installed to a side portion of the support frame and for making the movement of the first and second plates; wherein the first and second plates can move along the first and second guide rails, crossing with each other.

Abstract: An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly.

Abstract: A position control apparatus of a feeder stage is disclosed, at which a tape reel for feeding parts to be mounted on a PCB is mounted in a surface mount device (SMD). The position control apparatus includes a feeder stage disposed inside a base frame of a SMD, a height/rotation power transmission device for controlling a height (Z) and a rotation angle (?) of the feeder stage, a first power transmission device for controlling the X-axis position of the feeder stage, and a second power transmission device for controlling the Y-axis position of the feeder stage. Therefore, the apparatus can be easily controlled the mounting position of the tape reel by controlling the position of the feeder stage at which the tape reel is mounted in the SMD.

Abstract: The surface mounting method includes: transferring the PCB to one conveyer among multiple conveyers capable of moving from a first transfer; transferring the PCB to another conveyer; transferring the PCB to one conveyer, while electronic parts from a parts feeder are mounted onto the transferred PCB; mounting the electronic parts from the parts feeder again onto the transferred PCB, while the PCB onto which the parts have been mounted is transferred to the second transfer; and transferring the PCB onto which the parts have been mounted again to the second transfer, while a new PCB is transferred to one conveyer of the conveyers from the first transfer.

Abstract: An aligning apparatus for a semiconductor device test handler is provided which reduces semiconductor device loading and unloading time. An exchange unit of the handler includes a pair of aligners which operate independently to continuously transfer devices to a test site of the handler for test, and then away from the handler upon completion of the test. Both horizontal and vertical movement of each of the aligners facilitates the loading and unloading of semiconductor devices. This aligning apparatus provides for simplified design and operation of the aligners, and improves loading and unloading speed, thereby enhancing test efficiency.

Abstract: Sorting handler for a burn-in tester including two DC testing parts and two unloading buffers on opposite sides of the burn-in board at a working post in a line with a main working line respectively, one pair of a loader part for supplying new devices and an unloader part for receiving tested good devices on each of side parts of a body, so that two insert/remove pickers carry out a work continuously in which two insert/remove pickers move along the main working line in both directions with reference to the burn-in board, to remove the devices from the burn-in board, and insert devices to be tested in the space in turn, thereby improving a test productivity per a unit time period.

Abstract: Carrier module for a semiconductor device test handler including a carrier module body, a device seating part in an underside part of the carrier module body, at least one pair of first latches at opposite sides of the device seating part arranged opposite to, and movable away from, or close to, each other, for holding, or releasing opposite side parts of the semiconductor device seated on the device seating part, at least one pair of second latches rotatably fitted on opposite sides of the first latch, for holding an underside part of the semiconductor device seated on the device seating part, and releasing the semiconductor device interlocked with a releasing action of the first latch, a latch button fitted in an upper part of the carrier module to move in up/down directions and coupled to one end of the first latch, for moving up and down to make the first latch to move, and a first elastic member, and a second elastic member for elastic supporting of the first latch, and the second latch, thereby securely

Abstract: An apparatus and method are provided for recognizing a working height of a device transfer system in a semiconductor device test handler which allows the working height of the device transfer system to be quickly measured and/or precisely reset. The device transfer system moves horizontally and vertically on a handler body of the semiconductor device test handler, and moves horizontally and vertically, and includes a plurality of pickers which pick up the semiconductor devices. An elevating block installed at one side of the device transfer system moves upward and downward, and a touch probe installed vertical relative to the elevating block moves upward and downward based on contact with a target object. A detector detects ascendance of the touch probe upon contact with the target object, and a working position is determined based on an initial position, a measured position, and a series of offset values.

Abstract: An apparatus and method is provided for recognizing a working position of a device transfer system in a semiconductor device test handler. The working position of a transfer unit of the handler is adjusted based on tray and change kit positions to allow components to be quickly and precisely loaded and transferred when various kinds of semiconductor devices are tested in the handler. A laser sensor which detects a color change of an object is provided with the transfer unit, and scans corners of the tray and change kits to acquire position information related to the tray and change kits. The working position of the transfer unit is calculated using basic handler information contained in the control unit of the handler and the acquired information.

Abstract: The present invention relates to a fan apparatus for a chamber of a handler which prevents the breakage of a bearing housing by a guide recess and a key slidable to the guide recess along the axis varied due to a thermal stress generated in the axial direction of the fan apparatus according to a change in temperature of the fan apparatus mounted inside the chamber. The fan apparatus includes: a first housing having a first guide recess formed; a second housing contained in the first housing and slidable therein; a bearing being installed inside the second housing and supporting the shaft; a plurality of labyrinths being installed at both sides of the bearing and supporting the bearing; and a push cover covering the second housing inserted into the first housing.

Abstract: A device for seating a semiconductor device in a semiconductor test handler is provided. The device includes a plate having a plurality of device seating members each for seating the semiconductor device. The device also includes a latch rotatably mounted to one side of the device seating member for pressing down or freeing the semiconductor device seated on the device seating member. A latch operating means for causing the latch to press down the semiconductor device when the semiconductor device is seated on the device seating member is also included. The provided device also releases the pressing down action when the semiconductor device is seated on the device seating member and when the semiconductor device is taken away from the device seating member, thereby seating the semiconductor device on the device seating device accurately and positively.

Abstract: A device for seating a semiconductor device in a semiconductor test handler is provided. The device includes a plate having a plurality of device seating members each for seating the semiconductor device. The device also includes a latch rotatably mounted to one side of the device seating member for pressing down or freeing the semiconductor device seated on the device seating member. A latch operating means for causing the latch to press down the semiconductor device when the semiconductor device is seated on the device seating member is also included. The provided device also releases the pressing down action when the semiconductor device is seated on the device seating member and when the semiconductor device is taken away from the device seating member, thereby seating the semiconductor device on the device seating device accurately and positively.

Abstract: An indexing device in a semiconductor device handler, and a method for operating the same, utilizes a plurality of pairs of loading shuttles and unloading shuttles located on both sides of test sockets. Index heads move over and across the test sockets and the loading/unloading shuttles. While one of the index heads holds devices that are being tested, the other index head unloads tested semiconductor devices on one of the unloading shuttles, receives semiconductor devices to be tested from a loading shuttle, and stands by in the vicinity of the test sockets. This allows the semiconductor devices held by the index head at the stand by position to be immediately inserted into the test socket for testing when the other index head moves for unloading the tested semiconductor devices from the test sockets. As a result, an indexing time period is minimized, a size of the device can be reduced, and easy maintenance can be carried out.

Abstract: The present invention relates to a carrier module for micro-BGA (&mgr;-BGA) type device which is capable of testing a produced device without damaging to a solder ball thereunder after being rapidly connected to a test socket. A carrier module for a &mgr;-BGA type device according to the present invention comprises: an upper and lower carrier module body formed with protrusions at the upper and lower portions thereof; a device receiving unit inserted to the upper carrier module body for receiving a &mgr;-BGA type device; and a spring secured elastically to the upper and lower protrusions by being inserted thereto.

Abstract: The present invention discloses a tape feeder for supplying plural electronic components arranged and mounted to a tape in turn comprising: a main frame; a shutter installed to an upper portion of the main frame for opening and closing a component discharge opening of the electronic components; first and second sprocket wheels installed to a lower portion of the shutter for moving the tape received the electronic components by a predetermined pitch; a rotating latch connected to the first and second sprocket wheels for rotating the first and second sprocket wheels; plural levers connected to a side of the rotating latch for driving the rotating latch; an eccentric cam having a taper formed at its side constructed rotatably for driving the rotating lever; a shutter lever constructed for performing the forward and backward movement of the shutter by the driving of the eccentric cam; and a manual lever for moving the tape by one pitch by a worker when an initial work is set to supply the electronic components.

Abstract: An apparatus for controlling cooling of a gantry having a linear motor includes: a stator provided with a first temperature sensor, having a heat sink and a cooling fan at predetermined portions of an X-axis and an Y-axis linear motors; a mover provided with a second temperature sensor, having a heat sink installed on the upper surface of an X-axis and a Y-axis linear motors; an encoder for sensing a position and velocity of the mover; an encoder periphery sensor part for measuring surroundings (a temperature, a humidity and a pressure) of the encoder; an A/D converter for receiving a first and a second temperature signals and converting them from an analog signal to a digital signal and outputting the same; a controller for controlling a drive signal outputted from a mover driver unit to control the velocity of the Y-axis linear motor and the X-axis linear motor; a D/V converter for converting digital signals, that is, a cooling fan control signal and an air valve control signal to a plurality of drive signa

Abstract: Handler for testing a semiconductor device including a carrier unit for detachably holding, and carrying a plurality of devices, a test board having a plurality of test sockets for respectively coming into contact with the devices held at the carrier unit for testing the devices, a press unit for respectively pressing, and bringing the devices on the carrier unit into contact with the test sockets on the test board when the carrier unit is aligned with the test board, a spray unit for directly, and selectively spraying a high or low temperature gas to surfaces of the devices in contact with the test sockets from a position in a neighborhood of the devices of the carrier unit, to heat or cool the devices to a preset temperature, a gas supply unit for selectively supplying the high or low temperature gas to the spray unit, and a control unit for controlling the gas supply to the spray unit from the gas supply unit, thereby directly spraying high or low temperature gas to a surface of the device without an enclo

Abstract: The present invention discloses a mounting method of electronic components in which the electronic components are mounted on plural printed circuit boards.

Abstract: A method of mounting electrical components on a printed circuit board includes moving the printed circuit board to a first mounting location, picking up a plurality of electrical components with a corresponding plurality of mounter heads, and then placing the electrical components onto the printed circuit board with the mounter heads. The mounter heads are arranged so that they can move with respect to each other in both the X and Y directions, which allows the mounting device to mount a plurality of electrical components onto the printed circuit board substantially simultaneously, thereby reducing the amount of time required to produce a finished PCB. In some embodiments of the invention, the printed circuit board may be moved from a first position at which a first mounting head mounts electrical components onto the printed circuit board to a second mounting position at which a second mounting head mounts electrical components on the printed circuit board.