Abstract: A gas injection port structure for a flat fluorescent lap (FFL) is provided. The FFL has a flat lower plate and an upper plate that form a channel therebetween, and at least one gas injection port in communication with the channel. The gas injection port may be formed at a predetermined position on the upper plate so that a height of the gas injection port is level with or lower than a height of the channel. The gas injection port may contain a mercury getter and a sealing material having a passage formed therethrough so that mercury vapor may be injected into the channel and then the channel sealed. The gas injection port minimizes a thickness of the FFL, and improves durability of the FFL.

Abstract: A flat fluorescent lamp (FFL) for display devices, which has an improved electrode structure for plasma discharge, thus being efficiently operated using a low voltage and having high optical efficiency, is disclosed. The FFL of the present invention is provided with a plurality of branch electrodes extending from main electrodes, provided on opposite ends of a lamp body, in opposite directions toward the opposite main electrodes and being parallel to longitudinal axes of the discharge channels. Furthermore, the FFL may include joint electrodes which electrically couple the branch electrodes, provided around each of the opposite ends of the lamp body, to each other. The FFL may further include step electrodes and/or inductive electrodes.

Abstract: An external electrode surface emission fluorescent lamp for LCD backlighting includes (a) a serpentine-shaped upper sheet having a section for maximizing brightness uniformity within a predetermined distance from its surface; (b) a plate-shaped lower sheet combined with the upper sheet to form mutually connected channels; (c) external electrodes installed on surfaces of both ends of the upper sheet; and (d) auxiliary electrodes installed along the surface of channels.

Abstract: Apparatus for assembling substrates of a planar fluorescent lamp including a base mounted movable along a process line, the base having an upper surface for placing a first substrate of the fluorescent lamp, at least one movable board over the base, the movable board being mounted rotatable between a first position and a second position, at least one pair of parallel links each having one end rotatably coupled to the base and the other end rotatably coupled to the movable board for the movable board rotatable from the first position to the second position, a plurality of clamping members mounted on the movable board for holding a second substrate of the fluorescent lamp at a position under the movable board, a stopping member mounted in the process line over a direction of movement of the base, for coming into contact with the movable board to cause rotation of the movable board, and a damping member for making a damping action at a time the first, and second substrates of the fluorescent lamp come into conta

Abstract: Sorting handler for a burn-in tester including two DC testing parts and two unloading buffers on opposite sides of a burn-in board at a working post in a line with a main working line respectively, one pair of a loader part for supplying new devices and an unloader part for receiving tested good devices on each of side parts of a body, so that two insert/remove pickers carry out a work continuously in which two insert/remove pickers move along the main working line in both directions with reference to the burn-in board, to remove the devices from the burn-in board, and insert devices to be tested in the space in turn, thereby improving a test productivity per a unit time period.

Abstract: A test handler which is capable of transporting and testing a plurality of USB memory devices is provided. The handler includes a tray loaded with USB memory devices for testing, and a loading/unloading picker which transfers the USB memory devices from the tray to a shuffle for transport to a test socket. The shuffle moves to insert connectors of the USB memory devices into corresponding USB ports of a test socket for testing, and to extract the connectors from the USB ports after testing. The loading/unloading picker is capable of detecting an orientation of the connectors of the USB memory devices to ensure proper insertion into corresponding USB ports in the test socket.

Abstract: A test tray for a handler for testing semiconductor devices is disclosed which is capable of reducing the costs and time taken for replacement of carrier modules, and achieving an enhancement in workability.

Abstract: Handler for testing a semiconductor device including a carrier unit for detachably holding, and carrying a plurality of devices, a test board having a plurality of test sockets for respectively coming into contact with the devices held at the carrier unit for testing the devices, a press unit for respectively pressing, and bringing the devices on the carrier unit into contact with the test sockets on the test board when the carrier unit is aligned with the test board, a spray unit for directly, and selectively spraying a high or low temperature gas to surfaces of the devices in contact with the test sockets from a position in a neighborhood of the devices of the carrier unit, to heat or cool the devices to a preset temperature, a gas supply unit for selectively supplying the high or low temperature gas to the spray unit, and a control unit for controlling the gas supply to the spray unit from the gas supply unit, thereby directly spraying high or low temperature gas to a surface of the device without an enclo

Abstract: An apparatus for transferring semiconductor devices in a semiconductor device handler is provided which simplifies set up procedures when a species of device to be tested, and the associated change kit, is changed. A reference picker and three variable pickers are positioned within the framing structure of the handler, with the motion of the third variable picker synchronized relative to the motion of the first and second variable pickers. A plurality of sensors determine an initial position of the variable pickers, and then motion of the variable pickers is monitored by respective scanning heads and linear scales until a new setup position which corresponds to the new device species is attained. In this manner, the procedure and structure for varying position and pitch of the various pickers can be simplified, thus reducing processing time and cost.

Abstract: An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly.

Abstract: A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices.

Abstract: A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.

Abstract: A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.

Abstract: Mounting methods of electronic components in which the electronic components are mounted on plural printed circuit boards are disclosed. An exemplary method includes: supplying a printed circuit board on a first conveyor; transferring the printed circuit board to the third conveyor and simultaneously, transferring the printed circuit board transferred to the first conveyor to the second conveyor; mounting the electronic components to about half-portion of the printed circuit board by moving the printed circuit board to one side and simultaneously, mounting the electronic components to about half-portion from the original position of the printed circuit board; and transferring the printed circuit board to a fourth conveyor, simultaneously transferring the printed circuit board to the second conveyor to the third conveyor and then discharging the printed circuit boards sequentially.

Abstract: The present invention relates to an external electrode fluorescent lamp which can provide higher degree of and more improved uniformity of brightness than those of conventional ones, and to a LCD back light unit using the external electrode fluorescent lamp. The present invention also relates to an equipment and a driving device to adapt the LCD back light unit. The external electrode fluorescent lamp of the present invention is comprising: an upper panel of lamp which is serpentine shaped; a lower panel which is planar shaped and to be combined with the upper panel to make channels between the upper panel and the low panel; and external electrodes which are located at the two extreme sides at the surface of the upper panel.

Abstract: Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is seated thereon, a housing over the carrier module body, a supplementary housing fitted in a lower part of the housing to be movable in up/down directions, for elastic contact with the carrier module body by a first elastic member fitted inside of the housing, a vacuum tube in the supplementary housing so as to be in communication with the pass through hole in the carrier module body, at least one pair of latches in a lower part of the carrier module body to move apart or close in an outer or inner side, for holding or releasing the semiconductor device seated on the carrier module body, a latch button fitted in an upper part of the carrier module body so as to be movable in up/down directions, and coupled to the latch with a connection pin for moving in up/down directions by an external force, to making the latch t

Abstract: An external electrode surface emission fluorescent lamp for LCD backlighting includes (a) a serpentine-shaped upper sheet having a section for maximizing brightness uniformity within a predetermined distance from its surface; (b) a plate-shaped lower sheet combined with the upper sheet to form mutually connected channels; (c) external electrodes installed on surfaces of both ends of the upper sheet; and (d) auxiliary electrodes installed along the surface of channels.

Abstract: Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature.

Abstract: A device picker in a handler includes a vertical plate installed on the installation rest to be movable, a plurality of variable pitch blocks installed in parallel with each other on a lower end of the vertical plate through guide members to be movable in right and left directions to enable right/left pitch adjustment, a pair of pickup members installed on front and rear sides of each of the variable pitch blocks through guide members to ascend/descend, respectively, the pickup members coupled with each other to interoperate in opposite directions to pick up and release the devices alternately, a block driving means for moving the variable pitch blocks in a lateral direction, and a pickup member driving means for interoperating the pickup members to move upward and downward in opposite directions, respecively.

Abstract: Handler for testing a semiconductor device including a carrier unit for detachably holding, and carrying a plurality of devices, a test board having a plurality of test sockets for respectively coming into contact with the devices held at the carrier unit for testing the devices, a press unit for respectively pressing, and bringing the devices on the carrier unit into contact with the test sockets on the test board when the carrier unit is aligned with the test board, a spray unit for directly, and selectively spraying a high or low temperature gas to surfaces of the devices in contact with the test sockets from a position in a neighborhood of the devices of the carrier unit, to heat or cool the devices to a preset temperature, a gas supply unit for selectively supplying the high or low temperature gas to the spray unit, and a control unit for controlling the gas supply to the spray unit from the gas supply unit, thereby directly spraying high or low temperature gas to a surface of the device without an enclo