Patents Assigned to Mitsubishi Material Corporation
  • Copper alloy for electronic/electrical devices, copper alloy planar bar stock for electronic/electrical devices, component for electronic/electrical devices, terminal and bus bar
    Patent number: 11725258
    Abstract: This copper alloy for electronic or electric devices contains 100 mass ppm or greater and 400 mass ppm or less of Mg, 5 mass ppm or greater and 20 mass ppm or less of Ag, and less than 5 mass ppm of P with a balance being Cu and inevitable impurities, in which when a ratio of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to all grain boundary triple junctions is defined as NFJ3 and a ratio of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary constituting the grain boundary triple junction is a random grain boundary, to all grain boundary triple junctions is defined as NFJ2, an expression of 0.22<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: August 15, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka Matsunaga, Yuki Ito, Hiroyuki Mori, Hiroyuki Matsukawa
  • COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICE, TERMINAL, BUS BAR, LEAD FRAME, AND HEAT DISSIPATION SUBSTRATE
    Publication number: 20230250514
    Abstract: This copper alloy contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise: 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater. The half-softening temperature ratio TLD/TTD is greater than 0.95 and less than 1.08. The half-softening temperature TLD is 210° C. or higher.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 10, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
  • Terminal material for connectors
    Patent number: 11721923
    Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: August 8, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshie Tarutani, Kenji Kubota
  • COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL DEVICES, TERMINAL, BUS BAR, LEAD FRAME AND HEAT DISSIPATION SUBSTRATE
    Publication number: 20230243018
    Abstract: This copper alloy of one aspect contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impurities, in which among the inevitable impurities, a S amount is 10 mass ppm or less, a P amount is 10 mass ppm or less, a Se amount is 5 mass ppm or less, a Te amount is 5 mass ppm or less, an Sb amount is 5 mass ppm or less, a Bi amount is 5 mass ppm or less, an As amount is 5 mass ppm or less, a total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less, a mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50, an electrical conductivity is 97% IACS or greater, and a residual stress ratio at 150° C. for 1000 hours is 20% or greater.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 3, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
  • PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL, COMPONENT FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, AND TERMINAL
    Publication number: 20230243020
    Abstract: A copper alloy plastically-worked material comprises Mg in the amount of greater than 10 mass ppm and 100 mass ppm or less and a balance of Cu and inevitable impurities, that comprise 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, and 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio of [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 or greater and 50 or less, the electrical conductivity is 97% IACS or greater. The tensile strength is 200 MPa or greater. The heat-resistant temperature is 150° C. or higher.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 3, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Yuki ITO, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
  • COPPER ALLOY, PLASTICALLY WORKED COPPER ALLOY MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRICAL EQUIPMENT, TERMINAL, HEAT DISSIPATION SUBSTRATE
    Publication number: 20230243019
    Abstract: This copper alloy contains 10-100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise; 10 mass ppm or less of S, 10 mass ppm or less of P, 5 mass ppm or less of Se, 5 mass ppm or less of Te, 5 mass ppm or less of Sb, 5 mass ppm or less of Bi, 5 mass ppm or less of As. The total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less. The mass ratio [Mg]/[S+P+Se+Te+Sb+Bi+As] is 0.6 to 50. The electrical conductivity is 97% IACS or greater. The half-softening temperature is 200° C. or higher. The residual stress ratio RSG at 180° C. for 30 hours is 20% or greater. The ratio RSG/RSB at 180° C. for 30 hours is greater than 1.0.
    Type: Application
    Filed: June 30, 2021
    Publication date: August 3, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Kosei FUKUOKA, Kazunari MAKI, Kenji MORIKAWA, Shinichi FUNAKI, Hiroyuki MORI
  • CO2 SEPARATION AND RECOVERY METHOD AND CO2 SEPARATION AND RECOVERY DEVICE IN CEMENT PRODUCTION EXHAUST GAS
    Publication number: 20230233987
    Abstract: A CO2 separation/recover method in cement production exhaust gas has a step of harmful component removal that removes an acidic component and a harmful component from exhaust gas discharged from a cement production facility; and a step of CO2 separation and recover that separates and recovers CO2 by bringing the exhaust gas from which the acidic component and the harmful component are removed into contact with a CO2 absorption material, so that the acidic component and the harmful component are removed before separating and recovering CO2, resulting in deterioration of the absorbing ability of the CO2 absorption material being suppressed; and the cement production exhaust gas can be appropriately disposed.
    Type: Application
    Filed: May 28, 2021
    Publication date: July 27, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshinori Takayama, Hajime Kawasaki, Takuma Koma, Takuya Komatsu
  • METHOD FOR UTILIZING CO2 IN EXHAUST GAS FROM CEMENT PRODUCTION, AND CO2 UTILIZING SYSTEM
    Publication number: 20230227354
    Abstract: Generating methane by adding hydrogen to CO2 in exhaust gas discharged a from cement production facility or CO2 that is separated and recovered from the exhaust gas, and using the methane as an alternative fuel to fossil fuel such as coal, petroleum, natural gas and the like, by methanation of CO2 in the exhaust gas from the cement production facility that includes exhaust gas originated from lime stone not from the fossil oil and effectively utilizing it, it is possible to reduce usage of the fossil fuel, suppress CO2 originated from energy, and improve an effect of reducing greenhouse gas.
    Type: Application
    Filed: May 28, 2021
    Publication date: July 20, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshinori Takayama, Hajime Kawasaki, Takuma Koma, Takuya Komatsu
  • High-concentration tin sulfonate aqueous solution and method for producing same
    Patent number: 11692277
    Abstract: The present invention provides a high-concentration tin sulfonate aqueous solution, in which a divalent tin ion (Sn2+) concentration is 360 g/L to 420 g/L, a tetravalent tin ion (Sn4+) concentration is 10 g/L or less, a free methanesulfonic acid concentration is 40 g/L or less, a Hazen unit color number (APHA) is 240 or less, and a turbidity is 25 FTU or less. This aqueous solution is produced such that stannous oxide powder whose temperature is adjusted to a temperature of 10° C. or lower is added to an aqueous methanesulfonic acid solution having a concentration of 60% by mass to 90% by mass when the aqueous solution circulates in a state of being maintained at the temperature of 10° C. or lower, and the stannous oxide powder is dissolved.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: July 4, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koji Tatsumi, Kyohei Mineo, Hirotaka Hirano
  • MANUFACTURING METHOD FOR INSULATING RESIN CIRCUIT SUBSTRATE
    Publication number: 20230207333
    Abstract: There is provided a manufacturing method for an insulating resin circuit substrate, which is a manufacturing method for an insulating resin circuit substrate which includes an insulating resin layer composed of a polyimide resin and a circuit layer consisting of metal pieces disposed in a circuit pattern shape on one surface of the insulating resin layer. The manufacturing method includes a temporary fixing step of pressurizing the metal pieces toward the resin sheet material while heating the metal pieces to temporarily fix the metal pieces and a joining step of disposing a cushion material on a side of the metal pieces which are temporarily fixed and pressurizing the metal pieces and the resin sheet material in a laminating direction, while heating the metal pieces and the resin sheet material, to join the resin sheet material and the metal pieces.
    Type: Application
    Filed: May 31, 2021
    Publication date: June 29, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshiaki Sakaniwa, Toyo Ohashi
  • COPPER/CERAMIC BONDED BODY AND INSULATED CIRCUIT SUBSTRATE
    Publication number: 20230197556
    Abstract: A copper/ceramic bonded body of the present invention is formed by bonding a copper member, which is formed of copper or a copper alloy, and a ceramic member, in which a ratio D1/D0 is 0.60 or less, D0 being an average crystal grain size of the entire copper member, D1 being an average crystal grain size of the copper member at a position 50 ?m from a bonding surface with the ceramic member, D0 and D1 being obtained by observing a cross-section of the copper member along a laminating direction.
    Type: Application
    Filed: May 24, 2021
    Publication date: June 22, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Satoshi Takakuwa, Nobuyuki Terasaki, Shuji Nishimoto
  • Method of manufacturing power module substrate board and ceramic-copper bonded body
    Patent number: 11676882
    Abstract: To provide a method of manufacturing power module substrate board at high productivity and a ceramic-copper bonded body in which warps are reduced. In a bonded body-forming step, a circuit layer-forming copper layer consisting of a plurality of first copper layers is formed by arranging and bonding a plurality of first copper boards on a first surface of a ceramic board, and a metal layer-forming copper layer consisting of a second copper layer with a smaller arrangement number than that of the first copper layers is formed by bonding a second copper board having a larger planar area than that of the first copper board and a smaller thickness than that of the first copper board so as to cover at least two of adjacent substrate board-forming areas on a second surface of the ceramic board among the substrate board-forming areas partitioned by the dividing groove.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: June 13, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takeshi Kitahara, Tomoya Oohiraki, Yoshiyuki Nagatomo
  • HARD COMPOSITE MATERIAL
    Publication number: 20230174430
    Abstract: A cBN sinter comprising cubic boron nitride grains and a binder phase, the binder phase comprising Ti2CN and TiAl3, wherein the ratio ITi2CN/ITiAl3 of the peak intensity ITi2CN of Ti2CN appearing at 2?=41.9° to 42.2° to the peak intensity ITiAl3 of TiAl3 appearing at 2?=39.0° to 39.3° is in a range of 2.0 to 30.0 in an XRD measurement.
    Type: Application
    Filed: March 9, 2021
    Publication date: June 8, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Masahiro Yano
  • Powder molding press method of green compact for cutting insert, and powder molding press device
    Patent number: 11666966
    Abstract: A powder molding press method of a green compact for a cutting insert including: filling a molding space with raw material powder in a state where a lower punch is inserted from below into a hole portion of a die; performing preliminary molding by inserting an upper punch for preliminary molding including a preliminary molding surface having a shape different from a shape obtained by inverting the upper surface of the green compact for a cutting insert in a plane symmetry into the molding space from above such that a thick portion between the upper and lower surfaces in the direction of the insert center line is filled with more raw material powder than a thin portion therebetween, relative to a state before the step of performing the preliminary molding; and inserting an upper punch for final molding into the molding space from above to powder-molding-press the raw material powder.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: June 6, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kentaro Ohno, Masaru Hotta, Tomotsugu Gouda, Yoshitomo Shibuya
  • THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT, AND THERMOELECTRIC CONVERSION MODULE
    Publication number: 20230166970
    Abstract: There is provided a thermoelectric conversion material containing Cu and Se as main components, an element M including one or two or more elements selected from Group 10 elements and Group 11 elements excluding Cu, and optional element of Te. The thermoelectric conversion material is represented by the following chemical formula. Chemical Formula: CuxSe(1?y)TeyMz, 1.95?x<2.05,0?y?0.1,0.002?z?0.03.
    Type: Application
    Filed: March 22, 2021
    Publication date: June 1, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Koya Arai, Chompunoot Wiraseranee, Shota Nakayama
  • Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structure
    Patent number: 11661667
    Abstract: An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 ?m and not more than 5.0 ?m and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: May 30, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kenji Kubota, Yoshie Tarutani, Takashi Tamagawa, Kiyotaka Nakaya
  • WIRE ROD OF CU-ZN-SI BASED ALLOY OBTAINED BY UP-DRAWING CONTINUOUS CASTING
    Publication number: 20230160039
    Abstract: A wire rod of a Cu—Zn—Si based alloy obtained by up-drawing continuous casting is provided; the amount of Cu is within a range of 75.0 mass% or more and 76.9 mass% or less, the amount of Si is within a range of 2.6 mass% or more and 3.1 mass% or less, the amount of Zr is within a range of 0.003 mass% or more and 0.20 mass% or less, the amount of P is within a range of 0.02 mass% or more and 0.15 mass% or less, the balance is composed of Zn and inevitable impurities, and the number density of a Zr—P compound containing Zr and P is within a range of 1500 pieces/mm2 or more and 7000 pieces/mm2 or less.
    Type: Application
    Filed: May 7, 2021
    Publication date: May 25, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Masahiro Kataoka, Shinobu Satou, Kanta Dairaku, Keiichiro Oishi
  • Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar
    Patent number: 11655523
    Abstract: This copper alloy for electronic or electric devices includes: Mg: 0.15 mass % or greater and less than 0.35 mass %; and P: 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities, wherein an amount of Mg [Mg] and an amount of P [P] in terms of mass ratio satisfy [Mg]+20×[P]<0.5, and 0.20<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NFJ2.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: May 23, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka Matsunaga, Kenichiro Kawasaki, Hiroyuki Mori, Kazunari Maki, Yoshiteru Akisaka
  • NEGATIVE ELECTRODE MATERIAL, BATTERY, METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL, AND METHOD FOR PRODUCING BATTERY
    Publication number: 20230155110
    Abstract: A negative electrode material is a negative electrode material for a battery, and the material includes carbon, tungsten trioxide formed on the surface of the carbon, and silicon formed on the surface of the carbon.
    Type: Application
    Filed: February 22, 2021
    Publication date: May 18, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Naoki Rikita, Yoshinobu Nakada, Jie Tang
  • TITANIUM SUBSTRATE, METHOD FOR PRODUCING TITANIUM SUBSTRATE, ELECTRODE FOR WATER ELECTROLYSIS, AND WATER ELECTROLYSIS APPARATUS
    Publication number: 20230143743
    Abstract: A titanium substrate of the present invention includes a substrate main body formed of titanium or a titanium alloy, in which a Magneli phase titanium oxide film formed of a Magneli phase titanium oxide represented by a chemical formula TinO2n-1 (4?n?10) is formed on a surface of the substrate main body and a BET value of the substrate main body on which the Magneli phase titanium oxide film is formed is 0.1 m2/g or less.
    Type: Application
    Filed: March 25, 2021
    Publication date: May 11, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yosuke Sano, Shinichi Ohmori