Patents Assigned to Mitsubishi Material Corporation
  • Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar
    Patent number: 11655523
    Abstract: This copper alloy for electronic or electric devices includes: Mg: 0.15 mass % or greater and less than 0.35 mass %; and P: 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities, wherein an amount of Mg [Mg] and an amount of P [P] in terms of mass ratio satisfy [Mg]+20×[P]<0.5, and 0.20<(NFJ2/(1?NFJ3))0.5?0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NFJ2.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: May 23, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka Matsunaga, Kenichiro Kawasaki, Hiroyuki Mori, Kazunari Maki, Yoshiteru Akisaka
  • NEGATIVE ELECTRODE MATERIAL, BATTERY, METHOD FOR PRODUCING NEGATIVE ELECTRODE MATERIAL, AND METHOD FOR PRODUCING BATTERY
    Publication number: 20230155110
    Abstract: A negative electrode material is a negative electrode material for a battery, and the material includes carbon, tungsten trioxide formed on the surface of the carbon, and silicon formed on the surface of the carbon.
    Type: Application
    Filed: February 22, 2021
    Publication date: May 18, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Naoki Rikita, Yoshinobu Nakada, Jie Tang
  • TITANIUM SUBSTRATE, METHOD FOR PRODUCING TITANIUM SUBSTRATE, ELECTRODE FOR WATER ELECTROLYSIS, AND WATER ELECTROLYSIS APPARATUS
    Publication number: 20230143743
    Abstract: A titanium substrate of the present invention includes a substrate main body formed of titanium or a titanium alloy, in which a Magneli phase titanium oxide film formed of a Magneli phase titanium oxide represented by a chemical formula TinO2n-1 (4?n?10) is formed on a surface of the substrate main body and a BET value of the substrate main body on which the Magneli phase titanium oxide film is formed is 0.1 m2/g or less.
    Type: Application
    Filed: March 25, 2021
    Publication date: May 11, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yosuke Sano, Shinichi Ohmori
  • Cu-Ni-Si BASED COPPER ALLOY PLATE, Cu-Ni-Si BASED COPPER ALLOY PLATE WITH PLATING FILM, AND METHODS OF PRODUCING THE SAME
    Publication number: 20230143481
    Abstract: A Cu—Ni—Si based copper alloy containing Ni and Si: in a center portion in a plate thickness direction, containing 0.4% by mass or more and 5.0% by mass or less of Ni, 0.05% by mass or more and 1.5% by mass or less of Si, and the balance Cu and inevitable impurities; where an Ni concentration on a plate surface is 70% or less of a center Ni concentration in the thickness center portion; a surface layer portion having a depth from the plate surface to be 90% of the center Ni concentration; in the surface layer portion, the Ni concentration increases from the plate surface toward the thickness center portion at 5.0% by mass/µm or more and 100% by mass/µm or less of a concentration gradient; to improve the electric connection reliability under high-temperature environment.
    Type: Application
    Filed: March 12, 2021
    Publication date: May 11, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kazuaki Sakai, Naoki Miyashima, Kazunari Maki, Shinichi Funaki
  • HARD COMPOSITE MATERIAL
    Publication number: 20230141147
    Abstract: A cBN sinter comprising cubic boron nitride grains and a binder phase, the binder phase comprising Ti2CN and Co2B, wherein the ratio ITi2CN/ICo2B of a peak intensity ITi2CN assigned to Ti2CN appearing at 2? = 41.9° to 42.2° to a peak intensity ITiAl3 assigned to Co2B appearing at 2? = 45.7° to 45.9° is in a range of 0.5 and 2.0 in an XRD measurement.
    Type: Application
    Filed: March 9, 2021
    Publication date: May 11, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Masahiro Yano
  • Thermoelectric conversion material, thermoelectric conversion element, thermoelectric conversion module, and method for manufacturing thermoelectric conversion material
    Patent number: 11647674
    Abstract: A thermoelectric conversion material formed of a sintered body containing magnesium silicide as a main component contains 0.5 mass % or more and 10 mass % or less of aluminum oxide. The aluminum oxide is distributed at a crystal grain boundary of the magnesium silicide.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: May 9, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Yoshinobu Nakada
  • METHOD FOR PRODUCING LITHIUM SULFIDE
    Publication number: 20230135532
    Abstract: A method for producing lithium sulfide includes: a preparation process (step S12) at which a raw material and a reducing agent are charged into a furnace, the raw material being mainly composed of lithium sulfate having a property of weight loss of 5% or more to 25% or less upon heating to 120° C.; and a temperature raising process (step S14) at which the raw material and the reducing agent are heated in the furnace to raise the temperature.
    Type: Application
    Filed: February 2, 2021
    Publication date: May 4, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fumitake Kikuchi, Kanji Kuba
  • INSULATED CIRCUIT SUBSTRATE MANUFACTURING METHOD
    Publication number: 20230127557
    Abstract: An insulated circuit substrate manufacturing method of the present invention includes a metal piece disposing step of disposing the metal piece in a circuit pattern shape on a resin material serving as the insulating resin layer and a bonding step of bonding the insulating resin layer and the metal piece by pressurizing and heating the resin material and the metal piece at least in a laminating direction. In the bonding step, the metal piece and the resin material are pressurized in the laminating direction by a pressurizing jig that includes a cushion material disposed on a side of the metal piece and a guide wall portion disposed at a position facing a peripheral portion of the cushion material, and the peripheral portion of the cushion material is brought into contact with the guide wall portion during pressurization.
    Type: Application
    Filed: March 24, 2021
    Publication date: April 27, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshiaki Sakaniwa, Toyo Ohashi
  • HEAT EXCHANGER
    Publication number: 20230126444
    Abstract: A heat exchanger having an outer tube through which a heating or cooling medium flows, a heat source that heats or cools the outer tube at a middle position at the exterior, and a heat-exchange part which can perform a heat exchange between the heating or cooling medium flows in the outer tube and the heat source; the heat-exchange part is provided with a porous body in a cylindrical shape being in close contact with an inner peripheral surface of the outer tube, at least one inside channel that is formed inside the porous body, and at least one valve that opens and closes the inside channel; and continuous pores that communicate with both ends of the flow direction of the heating or cooling medium and through which the heating or cooling medium can flow are formed.
    Type: Application
    Filed: February 10, 2021
    Publication date: April 27, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshihiko Saiwai, Koya Arai
  • COPPER-GRAPHENE BONDED BODY AND METHOD FOR MANUFACTURING SAME, AND COPPER-GRAPHENE BONDED STRUCTURE
    Publication number: 20230127611
    Abstract: A copper-graphene bonded body is a copper-graphene bonded body including a copper member made of copper or a copper alloy and a ceramic member made of silicon nitride, the copper member. The copper member and the ceramic member are bonded to each other, between the copper member and the graphene-containing carbonaceous member, an active metal carbide layer containing a carbide of one or more kinds of active metal selected from Ti, Zr, Nb, and Hf is formed on a side of the graphene-containing carbonaceous member, and a Mg solid solution layer having Mg dissolved in a matrix phase of Cu is formed between the active metal carbide layer and the copper member.
    Type: Application
    Filed: January 22, 2021
    Publication date: April 27, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • Copper/ceramic bonded body, insulating circuit board, method for producing copper/ceramic bonded body, and method for producing insulating circuit board
    Patent number: 11638350
    Abstract: This copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of nitrogen-containing ceramics, the copper member and the ceramic member are bonded to each other, in which, between the copper member and the ceramic member, an active metal nitride layer containing nitrides of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member side, and a Mg solid solution layer in which Mg is solid-dissolved in a Cu matrix is formed between the active metal nitride layer and the copper member, and Cu-containing particles composed of either one or both of Cu particles and compound particles of Cu and the active metal are dispersed in an interior of the active metal nitride layer.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: April 25, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • SURFACE-COATED CUTTING TOOL
    Publication number: 20230119858
    Abstract: A surface coated cutting tool comprises: a tool substrate and a coating layer on a surface of the tool substrate; wherein the coating layer comprises a lower layer, an intermediate layer, and an upper layer, in sequence from the tool substrate toward the surface of the tool. The lower layer comprises an A layer having an average composition represented by formula: (Al1-xCrx)N, where x is 0.20 to 0.60; the intermediate layer comprises a B layer having an average composition represented by formula: (Al1-a-bCraSib)N, where a is 0.20 to 0.60 and b is 0.01 to 0.20; and the upper layer comprises a C layer having an average composition represented by formula: (Ti1-?-?Si?W?)N where ? is 0.01 to 0.20 and ? is 0.01 to 0.10; and the upper layer has a repeated variation in W level with an average interval of 1 nm to 100 nm between adjacent local maxima and minima.
    Type: Application
    Filed: March 12, 2021
    Publication date: April 20, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Shun Sato
  • MEMBER FOR PLASMA PROCESSING APPARATUS, METHOD FOR MANUFACTURING SAME, AND PLASMA PROCESSING APPARATUS
    Publication number: 20230114319
    Abstract: A member for a plasma processing apparatus includes a base material and a heat transfer layer provided on one surface of the base material, and the heat transfer layer contains at least one of a fluorine-based resin and a fluorine-based elastomer.
    Type: Application
    Filed: March 5, 2021
    Publication date: April 13, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fumiaki Ishikawa, Yuto Kurata, Tsukasa Yasoshima, Ichiro Shiono, Takuma Katase
  • METAL BASE SUBSTRATE, ELECTRONIC COMPONENT MOUNTING SUBSTRATE
    Publication number: 20230111128
    Abstract: A metal base substrate of the present invention is a metal base substrate including a metal substrate, an insulating layer laminated on one surface of the metal substrate, and a circuit layer laminated on a surface of the insulating layer opposite to the metal substrate side, in which the circuit layer is made of a metal having a semi-softening temperature of 100° C. or higher and 150° C. or lower, the insulating layer contains a resin, and a relationship between a thickness t (?m) of the insulating layer and an elastic modulus E (GPa) of the insulating layer at 100° C. satisfies a following formula (1).
    Type: Application
    Filed: March 30, 2021
    Publication date: April 13, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fumiaki Ishikawa, Shintaro Hara, Hiroyuki Mori, Kosei Fukuoka
  • TERMINAL MATERIAL FOR CONNECTOR
    Publication number: 20230111976
    Abstract: A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.
    Type: Application
    Filed: January 28, 2021
    Publication date: April 13, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshie Tarutani, Kenji Kubota, Naoki Katou
  • ANTIMICROBIAL MEMBER
    Publication number: 20230115585
    Abstract: An antimicrobial member includes a substrate, an underlayer deposited on the substrate, and a copper layer formed on a surface of the underlayer which is on a side opposite to the substrate and arranged as an outermost layer, in which the copper layer is formed of copper or a copper alloy, the underlayer is formed of a metal oxide, and the substrate is formed of a flexible resin material. It is preferable that no cracking is confirmed after carrying out a bending test 100 times under a condition where a radius of curvature is 6 mm.
    Type: Application
    Filed: March 26, 2021
    Publication date: April 13, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yuki Ito, Yoshiyuki Nagatomo, Yuto Toshimori
  • METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING INSULATION CIRCUIT SUBSTRATE
    Publication number: 20230115820
    Abstract: When a laminate of a plurality of different materials including a metal plate is bonded in a pressurized and heated state, a first pressurizing member in which a first metal foil/a carbon sheet or a ceramic sheet/a graphite sheet are laminated in this order is arranged so that the first metal foil is in contact with a surface of the first metal plate of the laminate, the first metal foil is made of a material that does not react at a contact surface of the first plate member and the first metal foil when heating, and a product of a Young's modulus (GPa) and a thickness (mm) of the first metal foil is 0.6 or more and 100 or less, so that a good bonded body can be manufactured by evenly pressurizing the laminate and foreign substances can be restrained from adhering to the surface of the laminate.
    Type: Application
    Filed: March 22, 2021
    Publication date: April 13, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ryohei Yumoto, Takeshi Kitahara
  • METAL BASE SUBSTRATE
    Publication number: 20230110469
    Abstract: A metal base substrate of the present invention includes a metal substrate, an insulating layer, and a circuit layer, which are laminated in this order, in which the insulating layer contains an insulating resin and an inorganic filler, and an elastic modulus (unit: GPa) at 100° C. of the insulating layer, an elastic modulus (unit: GPa) at 100° C. of the circuit layer, a thickness (unit: ?m) of the insulating layer, a thickness (unit: ?m) of the circuit layer, and a thickness (unit: ?m) of the metal substrate are set so as to satisfy predetermined formulae.
    Type: Application
    Filed: March 31, 2021
    Publication date: April 13, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fumiaki Ishikawa, Shintaro Hara
  • PURE COPPER PLATE
    Publication number: 20230112081
    Abstract: A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 0.01 mass ppm or more and 3.00 mass ppm or less of P, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 ?m or more, and, in a case where a measurement area of 1 mm2 or more is measured by an EBSD method at measurement intervals of 5 ?m steps, a measurement point where a CI value analyzed with data analysis software OIM is 0.1 or less is excluded, and a boundary where an orientation angle between adjacent pixels is 5° or more is regarded as a crystal grain boundary, a Kernel average misorientation (KAM) value is 1.50 or less.
    Type: Application
    Filed: March 8, 2021
    Publication date: April 13, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Yuki ITO, Hiroyuki MORI, Norihisa IIDA, Motohiro HITAKA
  • PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUIT BOARD
    Publication number: 20230114969
    Abstract: A pure copper sheet has a composition including 99.96 mass% or more of Cu, 9.0 mass ppm or more and less than 100.0 mass ppm of a total content of Ag, Sn, and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 µm or more, the pure copper sheet has crystals in which crystal planes parallel to the rolled surface are a {022} plane, a {002} plane, a {113} plane, a {111} plane, and a {133} plane, and diffraction peak intensities of the individual crystal planes that are obtained by X-ray diffraction measurement by a 2?/? method on the rolled surface satisfy I {022}/(I {022} + I {002} + I {113} + I {111} + I {133}) ? 0.15, I {002}/I {111} ? 10.0, and I {002}/I {113} ? 15.0.
    Type: Application
    Filed: March 5, 2021
    Publication date: April 13, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Yuki ITO, Hiroyuki MORI