Patents Assigned to Mitsubishi Material Corporation
  • HEAT SINK INTEGRATED INSULATING CIRCUIT BOARD
    Publication number: 20230071498
    Abstract: This heat sink integrated insulating circuit substrate includes: a heat sink including a top plate part and a cooling fin; an insulating resin layer formed on the top plate part of the heat sink; and a circuit layer made of metal pieces arranged on a surface of the insulating resin layer opposite to the heat sink, wherein, when a maximum length of the top plate part is defined as L, an amount of warpage of the top plate part is defined as Z, and deformation of protruding toward a bonding surface side of the top plate part of the heat sink is defined as a positive amount of warpage, and a curvature of the heat sink is defined as C=|(8×Z)/L2|, a ratio P/Cmax between a maximum curvature Cmax(l/m) of the heat sink during heating from 25° C. to 300° C. and peel strength P (N/cm) of the insulating resin layer satisfies P/Cmax>60.
    Type: Application
    Filed: February 19, 2021
    Publication date: March 9, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Toyo Ohashi, Yoshiaki Sakaniwa
  • Thermistor with protective film and manufacturing method thereof
    Patent number: 11600410
    Abstract: A thermistor has a thermistor element, a protective film, and an electrode portion. The protective film is formed of a SiO2 film having a film thickness in a range of 50 nm or more and 1000 nm or less. The protective film is formed in contact with the thermistor element. Alkali metal is unevenly distributed in a region including an interface between the thermistor element and the protective film.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: March 7, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takehiro Yonezawa, Miki Adachi
  • Thermistor and method for manufacturing thermistor
    Patent number: 11594350
    Abstract: A thermistor includes a thermistor element, a protective film formed on the surface of the thermistor element, and electrode portions formed on both end portions of the thermistor element, in which the protective film is formed of silicon oxide, and, as a result of observing a bonding interface between the thermistor element and the protective film, a ratio L/L0 of a length L of an observed peeled portion to a length L0 of the bonding interface in an observation field is 0.16 or less.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: February 28, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takehiro Yonezawa, Satoko Higano
  • Raw material for metal porous body and metal porous body
    Patent number: 11590570
    Abstract: A material for porous metal body having a coil shape of a wire material wound in a helical shape, made of metal which having good thermal conductivity and can join by sintering; an average wire diameter Dw of the wire material is 0.05 mm to 2.00 mm inclusive, an average coil outer diameter Dc is 0.5 mm to 10.0 mm inclusive, a coil length L of 1 mm to 20 mm inclusive, and a winding number N is 1 to 10; and the plurality of materials for porous metal body are combined and sintered to form a metal porous body having a plurality of pores so that a pore ratio of the metal porous body is facilitated to be controlled.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: February 28, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Toshihiko Saiwai
  • THERMOELECTRIC CONVERSION STRUCTURE
    Publication number: 20230059024
    Abstract: This thermoelectric conversion structure has a heat source and a thermoelectric conversion module installed at the heat source, where the thermoelectric conversion module has a plurality of thermoelectric conversion elements, a first electrode portion disposed on one end side of the thermoelectric conversion elements, and a second electrode portion disposed on the other end side of the thermoelectric conversion elements, and has a structure in which the plurality of thermoelectric conversion elements are electrically connected to each other via the first electrode portion and the second electrode portion, and at least a first electrode portion side of the thermoelectric conversion module, facing a heat source direction, has a structure that is free of fixation and free of restraint.
    Type: Application
    Filed: February 2, 2021
    Publication date: February 23, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Koya Arai
  • SILVER PASTE AND METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING BONDED ARTICLE
    Publication number: 20230057625
    Abstract: This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.
    Type: Application
    Filed: December 18, 2020
    Publication date: February 23, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Tsukasa Yasoshima, Kotaro Masuyama, Kohei Otogawa, Takuma Katase
  • Silver powder, paste composition, and method of producing silver powder
    Patent number: 11587695
    Abstract: A silver powder is produced by reducing silver carboxylate and a particle size distribution of primary particles comprises a first peak of a particle size in a range of 20 nm to 70 nm and a second peak of a particle size in a range of 200 nm to 500 nm, organic matters are decomposed in an extent of 50 mass % or more at 150° C., gases generated in heating at 100° C. are: gaseous carbon dioxide; evaporated acetone; and evaporated water.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: February 21, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kotaro Masuyama, Kazuhiko Yamasaki
  • COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHOD FOR PRODUCING SAME
    Publication number: 20230047984
    Abstract: Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass % or more and less than 0.3 mass %, center P concentration is 0.001 mass % or more and 0.2 mass % or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass %/m or more and 5 mass %/m or less increasing from surface toward center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.
    Type: Application
    Filed: December 8, 2020
    Publication date: February 16, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshiteru Akisaka, Naoki Miyashima, Kazunari Maki, Shinichi Funaki
  • Insulated electric wire, production method therefor, coil and coil production method using same
    Patent number: 11581127
    Abstract: There is provided an insulated electric wire formed by covering a rectangular conductor wire having a rectangular cross-sectional shape with an insulating film. The insulating film is formed of an inner layer covering a surface of the rectangular conductor wire, and an outer layer covering a surface of the inner layer. A thickness (t1) of a section of the inner layer, which covers one short side of two facing short sides of the same length of a rectangular cross section of the rectangular conductor wire, is greater than a thickness (t2) (including that t2=0) of a section of the inner layer which covers the other short side. An elastic modulus and/or a yield stress of the inner layer are less than an elastic modulus and/or a yield stress of the outer layer.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: February 14, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Makoto Urushihara, Yasuhiko Kudo, Shintaro Iida, Hideaki Sakurai
  • THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT, AND THERMOELECTRIC CONVERSION MODULE
    Publication number: 20230043063
    Abstract: A thermoelectric conversion material includes Mg2SixSn1?x (where 0.3?X?1) and a boride containing one or two or more metals selected from titanium, zirconium, and hafnium. Further, it is preferable that the boride is one or two or more selected from TiB2, ZrB2, and HfB2.
    Type: Application
    Filed: December 22, 2020
    Publication date: February 9, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Yoshinobu Nakada
  • TIN OR TIN ALLOY ELECTROPLATING SOLUTION, METHOD FOR FORMING BUMPS, AND METHOD FOR PRODUCING CIRCUIT BOARD
    Publication number: 20230038219
    Abstract: This tin or tin alloy electroplating solution according to one aspect contains a soluble salt (A) including at least a stannous salt, one or more compounds (B) selected from the group consisting of an organic acid, an inorganic acid, and a salt thereof, a surfactant (C) that is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by the following General Formula (1), and a leveling agent (D). In General Formula (1), m is an integer of 1 to 3, n is an integer of 10 to 30, and X is a cation.
    Type: Application
    Filed: January 4, 2021
    Publication date: February 9, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kyoka Susuki, Mami Watanabe, Kiyotaka Nakaya, Koji Tatsumi, Jyunta Inoue
  • CONNECTION TERMINAL
    Publication number: 20230042851
    Abstract: A connection terminal having a copper alloy as a base material, the copper alloy comprising Zn in an amount of 21 mass % or more and 27 mass % or less, Sn in an amount of 0.6 mass % or more and 0.9 mass % or less, Ni in an amount of 2.5 mass % or more and 3.7 mass % or less, and P in an amount of 0.01 mass % or more and 0.03 mass % or less, and the balance being Cu and inevitable impurities, wherein the copper alloy has: a 0.2% proof stress of 620 MPa or higher and 700 MPa or lower, and an electrical conductivity of 15% IACS or higher and 20% IACS or lower.
    Type: Application
    Filed: January 12, 2021
    Publication date: February 9, 2023
    Applicants: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD., MITSUBISHI MATERIALS CORPORATION
    Inventors: Toshiro SAKAI, Kingo FURUKAWA, Takeshi MASUDA, Tetsuya KUWABARA, Michio TAKASAKI
  • Tin-plated copper terminal material and method of manufacturing the same
    Patent number: 11572633
    Abstract: A tin-plated copper terminal material in which on a substrate made of copper or copper alloy, a nickel-or-nickel-alloy layer, a copper-tin alloy layer, and a tin layer are laminated in this order; in this material, the tin layer has an average thickness 0.2 ?m to 1.2 ?m inclusive; the copper-tin alloy layer is a compound alloy layer in which Cu6Sn5 is a main ingredient and part of copper in the Cu6Sn5 is substituted with nickel, and an average crystal grain size is 0.2 ?m to 1.5 ?m inclusive; part of the copper-tin alloy layer appears on a surface of the tin layer and tin solidification parts exist like islands; and the tin solidification parts have an average diameter 10 ?m to 1000 ?m inclusive in a direction along the surface of the tin layer and an area ratio to the surface of the tin layer 1% to 90% inclusive.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: February 7, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Fuyumi Mawatari, Kazunari Maki, Shinichi Funaki, Yuki Inoue, Kiyotaka Nakaya
  • COPPER-CERAMIC BONDED BODY, INSULATED CIRCUIT BOARD, METHOD FOR PRODUCING COPPER-CERAMIC BONDED BODY, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD
    Publication number: 20230034784
    Abstract: A copper-ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of silicon nitride, the copper member and the ceramic member being bonded to each other, in which a maximum length of a Mg—N compound phase which is present at a bonded interface between the copper member and the ceramic member is less than 100 nm, and in a unit length along the bonded interface, the number density of the Mg—N compound phase in a range of a length of 10 nm or more and less than 100 nm is less than 8 pieces/?m.
    Type: Application
    Filed: November 30, 2020
    Publication date: February 2, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • SILVER PASTE, AND METHOD OF PRODUCING JOINED ARTICLE
    Publication number: 20230025330
    Abstract: This silver paste includes a silver powder and a solvent, in which the silver powder includes first silver particles having a particle size of 100 nm or more and less than 500 nm, second silver particles having a particle size of 50 nm or more and less than 100 nm, and third silver particles having a particle size of 1000 nm or more and less than 10000 nm, and the content of the first silver particles is 12% by volume or more and 90% by volume or less, the content of the second silver particles is 1% by volume or more and 38% by volume or less, and the content of the third silver particles is 5% by volume or more and 80% by volume or less, regarding a total amount of the silver powder as 100% by volume.
    Type: Application
    Filed: December 17, 2020
    Publication date: January 26, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Tsukasa Yasoshima, Kotaro Iwata, Takuma Katase
  • METHOD OF PRODUCING COPPER OXIDE POWDER, AND COPPER OXIDE POWDER
    Publication number: 20230027568
    Abstract: A method of producing copper oxide powder includes a high-purity copper acidic solution preparation step (S01) of preparing an acidic solution containing 99.99% by mass or more of copper regarding metal components as 100% by mass, an organic acid salt addition step (S02) of adding an organic acid salt to this high-purity copper acidic solution, an organic acid copper production step (S03) of generating an organic acid copper by reacting the added organic acid salt with copper ions, an organic acid copper recovery step (S04) of recovering the obtained organic acid copper, and a heating step (S05) of forming copper oxide powder by heating the recovered organic acid copper, in which the organic acid forming the organic acid salt has 10 or less carbon atoms, and copper oxide powder.
    Type: Application
    Filed: December 4, 2020
    Publication date: January 26, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Kyoka Susuki, Mami Watanabe, Tomohiko Yamaguchi, Kiyotaka Nakaya
  • COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD
    Publication number: 20230022285
    Abstract: According to the present invention, there is provided a copper/ceramic bonded body including: a copper member made of copper or a copper alloy; and a ceramic member made of silicon-containing ceramics, the copper member and the ceramic member being bonded to each other, in which a maximum indentation hardness in a region is set to be in a range of 70 mgf/?m2 or more and 150 mgf/?m2 or less, the region being from 10 ?m to 50 ?m with reference to a bonded interface between the copper member and the ceramic member toward the copper member side.
    Type: Application
    Filed: December 4, 2020
    Publication date: January 26, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • FINE SILICON PARTICLES AND PRODUCTION METHOD THEREOF
    Publication number: 20230025365
    Abstract: The present invention provides a fine silicon powder and the like including fine silicon particles having a microscopically measured particle diameter of 1 ?m or more and an average circularity determined in accordance with Formula (1) of 0.93 or more, in which an average particle diameter based on volume, which is measured by a laser diffraction scattering method, is in a range of 0.8 ?m or more and 8.0 ?m or less, an average particle diameter based on number, which is measured by the laser diffraction scattering method, is in a range of 0.100 ?m or more and 0.150 ?m or less, and a specific surface area, which is measured by a BET method, is in a range of 4.0 m2/g or more and 10 m2/g or less. Circularity=(4×?×projected area of particle)1/2/peripheral length of particle (1).
    Type: Application
    Filed: December 2, 2020
    Publication date: January 26, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshinobu Nakada, Naoki Rikita
  • Insulated conductor and insulated conductor manufacturing method
    Patent number: 11555254
    Abstract: An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a low-concentration fluorine layer disposed on a surface side of the conductor and a high-concentration fluorine layer disposed on at least a part of an outside surface of the low-concentration fluorine layer, the low-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively lower than that of the high-concentration fluorine layer, and the high-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively higher than that of the low-concentration fluorine layer.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: January 17, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Hideaki Sakurai
  • Thermistor and method for manufacturing thermistor
    Patent number: 11557409
    Abstract: A thermistor includes a thermistor element, a protective film formed on the surface of the thermistor element, and electrode portions formed on both end portions of the thermistor element, in which the protective film is formed of silicon oxide, and, as a result of observing a bonding interface between the thermistor element and the protective film, a ratio L/L0 of a length L of an observed peeled portion to a length L0 of the bonding interface in an observation field is 0.16 or less.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: January 17, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takehiro Yonezawa, Satoko Higano