Patents Assigned to Mitsubishi Material Corporation
  • ELECTRODEPOSITION DISPERSION AND METHOD FOR PRODUCING INSULATING FILM
    Publication number: 20240059912
    Abstract: The electrodeposition dispersion of the present invention is an electrodeposition dispersion for electrodepositing an electrodeposited film on a conductive base material, the solution including water, a dispersion medium, and a solid component, in which the solid component includes a polyimide-based resin and a fluorine-based resin, the fluorine-based resin content included in the solid component is in a range of 72 mass % or more and 95 mass % or less, an average particle diameter of the solid component dispersed in the water and the dispersion medium is 50 nm or more and 500 nm or less, and a standard deviation of the particle diameter of the solid component is 250 nm or less.
    Type: Application
    Filed: January 13, 2022
    Publication date: February 22, 2024
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shintaro Iida, Kazuhiko Yamasaki
  • Terminal material for connector
    Patent number: 11905614
    Abstract: A terminal material having a base material in which at least a surface is made of Cu or Cu alloy; an Ni layer with at thickness of 0.1 ?m to 1.0 ?m inclusive on the base material; a Cu—Sn intermetallic compound layer with a thickness of 0.2 ?m to 2.5 ?m inclusive on the Ni layer; and an Sn layer with a thickness of 0.5 ?m to 3.0 ?m inclusive on the Cu—Sn intermetallic compound layer, when cross sections of the Cu—Sn intermetallic compound layer and the Sn layer are analyzed by the EBSD method with a measuring step 0.1 ?m and a boundary in which misorientation between adjacent pixels is 2° or more is deemed to be a crystal boundary, an average crystal grain size Dc of the Cu—Sn intermetallic compound layer is 0.5 ?m or more, and a grain size ratio Ds/Dc is five or less.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: February 20, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Naoki Miyashima, Kazunari Maki, Shinichi Funaki, Seiichi Ishikawa
  • Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board
    Patent number: 11908768
    Abstract: Forming aluminum circuit layers forming an aluminum circuit layers on one surface of a ceramic substrate and forming copper circuit layers are included. The copper circuit layers are formed by laminating copper boards for the circuit layers on the respective aluminum circuit layers, arranging the laminate between a pair of support boards having a convex curved surface at least on one surface so as to face to each other, moving the support boards in a facing direction to press the laminate in a lamination direction, and heating in this pressing state so that the copper boards for the circuit layers are bonded on the aluminum circuit layers respectively by solid phase diffusion. In the step of forming the copper circuit layers, the support boards are arranged so that either one of the convex curved surface is in contact with the adjacent copper boards for the circuit layers in the laminate.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: February 20, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara, Yoshiyuki Nagatomo
  • Terminal material for connectors
    Patent number: 11901659
    Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: February 13, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshie Tarutani, Kenji Kubota
  • SURFACE COATED CUTTING TOOL
    Publication number: 20240043344
    Abstract: A surface-coated cutting tool includes a coating layer having a laminated structure that includes first sublayers and second sublayers having a cubic crystal structure and has an average thickness of 0.5 to 8 ?m, the bottommost and topmost sublayers being both first sublayers; the first sublayer has an average thickness of 0.1 to 2 ?m and a composition (Al1?xCrx)N, where x=0.20 to the second sublayer has an average thickness of 0.1 to 2 ?m, has a composition (Al1-a-bCraSib)N where a=0.20 to 0.60, b=0.01 to 0.20, and has a repeated variation in Si content with an average interval of 1 to 100 nm between local minima and local maxima, the average local maximum and minimum are each within a specific range; and the diffraction peaks of the 111 and 200 diffraction peaks each have a predetermined full width at half maximum and a peak intensity.
    Type: Application
    Filed: December 15, 2021
    Publication date: February 8, 2024
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Shun Sato, Yuto Sugawara
  • RESIN MOLDED BODY, BATTERY PACK
    Publication number: 20240047819
    Abstract: A resin molded body according to the present invention is a resin molded body to be provided on an outer periphery of one or more lithium-ion secondary battery cells including a safety valve or an exhaust hole such that at least the safety valve or the exhaust hole is covered, in which a thermal conductivity (measurement temperature: 50° C.) of the resin molded body measured by a steady state comparative-longitudinal heat flow method based on JIS H7903:2008 is less than 1.0 W/m·K, a thickness of a part of the resin molded body, the part covering the safety valve or the exhaust hole, is 0.5 mm or more and 10.0 mm or less, and a hardness of a surface of the resin molded body measured by Type D durometer based on JIS K7215 is 50 or more and 90 or less.
    Type: Application
    Filed: December 16, 2021
    Publication date: February 8, 2024
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Mariko Wakamatsu, Fumiaki Ishikawa, Keiko Ashida, Toshihiro Zushi
  • ALUMINUM POWDER MIXTURE AND METHOD FOR PRODUCING ALUMINUM SINTERED BODY
    Publication number: 20240033819
    Abstract: This aluminum powder mixture is obtained by mixing a starting material powder, which is composed of pure aluminum or an aluminum alloy, with 5% by mass to 30% by mass of an aluminum alloy powder that has a lower melting point than the pure aluminum or the aluminum alloy. The aluminum alloy powder is composed of an aluminum alloy which has a composition that contains 5% by mass to 20% by mass of at least one of Si and Cu, and 0.2% by mass to 2.0% by mass of Mg, with a balance of aluminum and unavoidable impurities. Consequently, sintering among the aluminum powders is accelerated and it is possible to obtain an aluminum sintered body that has a higher density and a high electrical conductivity as well as obtaining a high thermal conductivity.
    Type: Application
    Filed: December 17, 2021
    Publication date: February 1, 2024
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventor: Jun KATO
  • Copper/titanium/aluminum joint, insulating circuit substrate, insulating circuit substrate with heat sink, power module, LED module, and thermoelectric module
    Patent number: 11887909
    Abstract: In a copper/titanium/aluminum bonded body of the present invention, a copper member made of copper or a copper alloy and an aluminum member made of aluminum or an aluminum alloy are bonded via a titanium layer, an intermetallic compound containing Cu and Ti is formed at a bonded interface of the copper member and the titanium layer, and a maximum value of a length Li of an intermetallic compound unformed part along the bonded interface is 20 ?m or less in the bonding interface of the copper member and the titanium layer, the intermetallic compound unformed part being a part free of formation of the intermetallic compound, and a ratio ?Li/L0 is 0.16 or less, ?Li being a total length of the intermetallic compound unformed part along the bonded interface and of L0 being a total length of the bonded interface along the bonded interface.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: January 30, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • Diamond-coated rotary cutting tool
    Patent number: 11878353
    Abstract: A diamond coating includes a first diamond layer made of minute diamond particles and a second diamond layer made of coarse diamond particles: in a flank-face side diamond coating, a mean coat thickness d2 is not less than 3 ?m and not more than 25 ?m, a first diamond layer is formed on a surface side and a second diamond layer is formed on a tool base side: a rake-face side diamond coating is in a smaller range of 50 ?m or 1/10 of a tool diameter from a tip of a base cutting-edge part; in the rake-face side diamond coating, a mean coat thickness d1 is a smaller one in a range not less than 0 ?m and not more than 5.0 ?m or a range less than d2: and a boundary part between the first diamond layer and the second diamond layer.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: January 23, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takuya Kubo, Kazuhisa Murata, Akimitsu Tominaga
  • Copper/ceramic joined body, insulating circuit substrate, copper/ceramic joined body production method, and insulating circuit substrate production method
    Patent number: 11881439
    Abstract: This copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of silicon nitride, wherein the copper member and the ceramic member are bonded to each other, a Mg—N compound phase extending from a ceramic member side to a copper member side is present at a bonded interface between the copper member and the ceramic member, and at least a part of the Mg—N compound phase enters into the copper member.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: January 23, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Nobuyuki Terasaki
  • Tin alloy plating solution
    Patent number: 11879182
    Abstract: The tin alloy plating solution of the present invention includes (A) a soluble salt including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) an alkane sulfonic acid including 9 to 18 carbon atoms in a molecule or a salt thereof, (D) a non-ionic surfactant including one or more phenyl groups in a molecule, and (E) a leveling agent.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: January 23, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Koji Tatsumi
  • HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFACTURING HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD
    Publication number: 20230411266
    Abstract: A heatsink-integrated insulating circuit board includes a heat sink including a radiating fin, an insulating resin layer formed on a top plate part of the heat sink, and a circuit layer arranged on one surface of the insulating resin layer. An angle ? formed between an end of the metal piece and a surface of the insulating resin layer is set to be 70° or more and 110° or less. Root-mean-square heights Sq1 and Rq1 in bonding surfaces to the insulating resin layer in the top plate part of the heat sink and the metal piece, and root-mean-square heights Sq2 and Rq1 in regions other than the bonding surfaces to the insulating resin layer in the top plate part of the heat sink and the metal piece have a relationship of Sq1>Sq2 or Rq1>Rq2.
    Type: Application
    Filed: November 25, 2021
    Publication date: December 21, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshiaki Sakaniwa, Toyo Ohashi, Marina Sakamaki, Kenji Kubota
  • SLIT COPPER MATERIAL, COMPONENT FOR ELECTRONIC/ELECTRIC DEVICES, BUS BAR, AND HEAT DISSIPATION SUBSTRATE
    Publication number: 20230395278
    Abstract: In this slit copper material, a purity of Cu is 99.96% by mass or greater, a ratio W/t of a plate width W to a plate thickness t is 10 or greater, an electrical conductivity is 97.0% IACS or greater, and an average value of orientation densities at ?2=5°, in a range of ?1=0° to 90°, and at ?=0° in a plate center portion is 2.0 or greater and less than 30.0.
    Type: Application
    Filed: October 20, 2021
    Publication date: December 7, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hirotaka MATSUNAGA, Kosei FUKUOKA, Kazunari MAKI
  • ZIRCONIUM-CONTAINING NITRIDE POWDER AND ULTRAVIOLET RAY-CURABLE BLACK ORGANIC COMPOSITION
    Publication number: 20230382733
    Abstract: This zirconium-containing nitride powder has a composition represented by the following General Formula (I). (Zr, X, Y) (N, O) . . . (I). In General Formula (I), X represents at least one element selected from the group consisting of Dy, Er, Gd, Ho, Lu, Nd, Pr, Sc, Sm, Tb, and Tm, Y represents an element symbol of yttrium, an amount of Y is 0 mol or greater with respect to 1 mol of a total amount of Zr, X, and Y, N represents nitrogen, O represents oxygen, and an amount of oxygen is 0 mol or greater with respect to 1 mol of a total amount of nitrogen and oxygen.
    Type: Application
    Filed: October 29, 2021
    Publication date: November 30, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Masaya Karube, Tasuku Sugiura
  • Drilling tip and drill bit
    Patent number: 11821264
    Abstract: A drilling tip includes a tip main body that has a posterior end portion having a columnar or disk shape centered on a tip center line and a distal end portion and is made of a cemented carbide and a hard layer that coats the distal end portion and is made of a polycrystalline diamond sintered body. The distal end portion has a convex portion, and a concave portion. A diameter D of the posterior end portion is 8 mm to 20 mm. A ratio r1/D of a radius r1 of the convex portion is 0.1 to 0.65, and a ratio r2/D of a radius r2 of the concave portion is 0.05 to 3.0. An angle formed by a straight line that connects a tangent point which the convex portion tangents to the concave portion and a center of the convex portion to each other is 20° to 90°.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: November 21, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yuichiro Takeuchi, Toshihiko Matsuo, Wardoyo Akhmadi Eko
  • Free-cutting copper alloy and method for producing free-cutting copper alloy
    Patent number: 11814712
    Abstract: This free-cutting copper alloy contains Cu: more than 57.5% but less than 64.5%, Si: more than 0.20% but less than 1.20%, Pb: more than 0.001% but less than 0.20%, Bi: more than 0.10% but less than 1.00%, and P: more than 0.001% but less than 0.20%, with the balance being Zn and unavoidable impurities, wherein the total amount of Fe, Mn, Co and Cr is less than 0.45%, the total amount of Sn and Al is less than 0.45%, relationships of 56.3?f1=[Cu]?4.8×[Si]+0.5×[Pb]+0.5×[Bi]?0.5×[P]?59.5 and 0.12?f2=[Pb]+[Bi]<1.0 are satisfied.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: November 14, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Keiichiro Oishi, Kouichi Suzaki, Hiroki Goto
  • GROOVING TOOL
    Publication number: 20230347426
    Abstract: This grooving tool includes a cutting insert, a holder, and a coolant flow path. The holder includes an insert mounting seat, and jaw parts that are disposed on an upper side and a lower side of the insert mounting seat and fix the cutting insert. The jaw part forms a curved shape as viewed from a tool distal end side, and has a thickness that is decreased as a distance from the insert mounting seat is increased.
    Type: Application
    Filed: August 31, 2021
    Publication date: November 2, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Takuma Kiso, Taichi Onoe, Shota Toduka
  • Metal particle aggregates, method for producing same, paste-like metal particle aggregate composition, and method for producing bonded body using said paste-like metal particle aggregate composition
    Patent number: 11801556
    Abstract: A metal particle aggregate includes metal particles and an organic substance. The metal particles include first particles that contain one or both of silver and copper in an amount of 70% by mass or more relative to 100% by mass of all metals and have a particle diameter of 100 nm or more and less than 500 nm at a ratio of 20 to 30% by number, and include second particles that have a particle diameter of 50 nm or more and less than 100 nm, and third particles that have a particle diameter of less than 50 nm at a ratio of 80 to 70% by number in total. Surfaces of the first to third particles are covered with the same protective film.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: October 31, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Tomohiko Yamaguchi, Koutarou Masuyama, Kazuhiko Yamasaki, Akihiro Higami
  • Metal oxide microparticles, method for producing same, dispersion for forming infrared-shielding film, method for producing same, method for forming infrared-shielding film, and base material having infrared-shielding film
    Patent number: 11796725
    Abstract: In these metal oxide microparticles, surfaces of microparticles of a metal oxide are modified by a fatty acid having 5 or more and 14 or less carbon atoms and having a branched chain, the metal oxide is metal oxides of a plurality of kinds of metals selected from the group consisting of Zn, In, Sn, and Sb, and an average particle diameter of the microparticles is 80 nm or less. In a dispersion for forming an infrared-shielding film, the metal oxide microparticles are dispersed in a hydrophobic solvent, and a light transmittance in a wavelength range of 800 nm to 1,100 nm is 20% or more and less than 70%.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: October 24, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Satoko Higano, Miho Shoji
  • Copper alloy plate, copper alloy plate with plating film, and manufacturing method thereof
    Patent number: 11795525
    Abstract: To improve adhesion between a plating film reducing contact electrical resistance and a copper alloy plate containing Mg. A copper alloy plate containing Mg of more than 1.2% by mass and 2% by mass or less and the balance Cu and inevitable impurities in a center portion in a plate thickness direction, in the copper alloy plate, a surface Mg concentration at a surface is 30% or less of a center Mg concentration at the center portion in the plate thickness direction, a surface layer portion having a depth from the surface to where a Mg concentration is 90% of the center Mg concentration is provided, and in the surface layer portion, the Mg concentration increases from the surface toward the center portion of the plate thickness direction with a concentration gradient of 0.2% by mass/?m or more and 50% by mass/?m or less.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: October 24, 2023
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Naoki Miyashima, Takanori Kobayashi, Kazunari Maki, Shinichi Funaki, Hiroyuki Mori, Yuki Ito