Abstract: An antimicrobial member includes a substrate, an underlayer deposited on the substrate, and a copper layer formed on a surface of the underlayer which is on a side opposite to the substrate and arranged as an outermost layer, in which the copper layer is formed of copper or a copper alloy, the underlayer is formed of a metal oxide, and the substrate is formed of a flexible resin material. It is preferable that no cracking is confirmed after carrying out a bending test 100 times under a condition where a radius of curvature is 6 mm.

Abstract: When a laminate of a plurality of different materials including a metal plate is bonded in a pressurized and heated state, a first pressurizing member in which a first metal foil/a carbon sheet or a ceramic sheet/a graphite sheet are laminated in this order is arranged so that the first metal foil is in contact with a surface of the first metal plate of the laminate, the first metal foil is made of a material that does not react at a contact surface of the first plate member and the first metal foil when heating, and a product of a Young's modulus (GPa) and a thickness (mm) of the first metal foil is 0.6 or more and 100 or less, so that a good bonded body can be manufactured by evenly pressurizing the laminate and foreign substances can be restrained from adhering to the surface of the laminate.

Abstract: A metal base substrate of the present invention includes a metal substrate, an insulating layer, and a circuit layer, which are laminated in this order, in which the insulating layer contains an insulating resin and an inorganic filler, and an elastic modulus (unit: GPa) at 100° C. of the insulating layer, an elastic modulus (unit: GPa) at 100° C. of the circuit layer, a thickness (unit: ?m) of the insulating layer, a thickness (unit: ?m) of the circuit layer, and a thickness (unit: ?m) of the metal substrate are set so as to satisfy predetermined formulae.

Abstract: A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 0.01 mass ppm or more and 3.00 mass ppm or less of P, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 ?m or more, and, in a case where a measurement area of 1 mm2 or more is measured by an EBSD method at measurement intervals of 5 ?m steps, a measurement point where a CI value analyzed with data analysis software OIM is 0.1 or less is excluded, and a boundary where an orientation angle between adjacent pixels is 5° or more is regarded as a crystal grain boundary, a Kernel average misorientation (KAM) value is 1.50 or less.

Abstract: A pure copper sheet has a composition including 99.96 mass% or more of Cu, 9.0 mass ppm or more and less than 100.0 mass ppm of a total content of Ag, Sn, and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 µm or more, the pure copper sheet has crystals in which crystal planes parallel to the rolled surface are a {022} plane, a {002} plane, a {113} plane, a {111} plane, and a {133} plane, and diffraction peak intensities of the individual crystal planes that are obtained by X-ray diffraction measurement by a 2?/? method on the rolled surface satisfy I {022}/(I {022} + I {002} + I {113} + I {111} + I {133}) ? 0.15, I {002}/I {111} ? 10.0, and I {002}/I {113} ? 15.0.

Abstract: A surface-coated cutting tool according to the present invention includes a tool body and a hard coating layer including a complex carbonitride layer containing a small amount of chlorine and (Ti(1-x)ZrxyHfx(1-y))(N(1-z)Cz) (0.10?x?0.90, 0<y?1.0, 0.08<z<0.60), a ZrHf and C content ratios in cycles, a cycle distance between a maximum ZrHf content point and an adjacent minimum ZrHf content point and a cycle distance between a maximum C content point and an adjacent minimum C content point are 5 to 100 nm, an average value of content ratio differences ?x and ?z is 0.02 or more, a distance between the maximum ZrHf content point and the maximum C content point is ? or less of the distance between a maximum content point and a minimum content point of adjacent ZrHf components, and a composition fluctuation structure is 10% or more.

Abstract: A method for manufacturing a cutting tool includes: the cutting tool comprising a tool body made of a sintered alloy, a hard coating which is disposed on an outer surface of the tool body and has at least a layer formed of any of a carbide, a nitride, and a carbonitride, or a composite compound thereof, and a cutting edge which is formed at a ridge portion of the tool body and includes a portion of the hard coating located at the ridge portion, a laser peening step of directly irradiating the hard coating with a pulsed laser having a pulse width of 100 ps or less to apply compressive residual stress to the hard coating and a surface region of the tool body.

Abstract: A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: µm) to an elastic modulus (unit: GPa) at 100° C. is 50 or more in the insulating layer, and the circuit layer has an elastic modulus at 100° C. of 100 GPa or less.

Abstract: Provided is a heat flow switching element that has a larger change in thermal conductivity, has excellent thermal responsiveness, and is capable of directly detecting a temperature change. The heat flow switching element according to the present invention includes: a heat flow control element part 10 including an N-type semiconductor layer 3, an insulator layer 4 laminated on the N-type semiconductor layer, and a P-type semiconductor layer 5 laminated on the insulator layer; and thermosensitive element parts 11A and 11B joined to the heat flow control element part. In addition, the thermosensitive element parts include: a thin-film thermistor portion made of a thermistor material; and a pair of counter electrodes formed facing each other on an upper side and/or a lower side of the thin-film thermistor portion, and the thin-film thermistor portion is laminated on an upper side and/or a lower side of the heat flow control element part.

Abstract: A black material of the present invention consists of a zirconium nitride powder containing yttrium. The amount of the yttrium is 1.0% by mass to 12.0% by mass with respect to a total 100% by mass of the zirconium nitride powder and the yttrium. In a transmission spectrum obtained from a dispersion in which the concentration of the zirconium nitride powder containing yttrium is 50 ppm, assuming that the light transmittance at a wavelength of 550 nm is denoted by X1, and the light transmittance at a wavelength of 365 nm is denoted by X2, X1 is 7.5% or less, X2 is 25% or more, and X2/X1 is 3.5 or more.

Abstract: This punched-workpiece with the insulating film includes a punched-workpiece having a cut surface, a plating layer formed on at least the cut surface of the punched-workpiece, and an insulating film formed on the surface of the plating layer.

Abstract: Provided is a surface-coated cutting tool including a complex carbonitride layer on the tool body, wherein a ratio of crystal grains having a NaCl type face-centered cubic structure is 80 area % or more, xavg and yavg satisfy 0.60?xavg?0.90 and 0.000?yavg?0.050, respectively, a composition of the Ti—Al complex carbonitride layer being represented by (Ti1-xAlx)(CyN1-y), the xavg being an average of x that is an Al content in a total content of Al and Ti, and the yavg being an average of y that is a C content in a total content of C and N, the crystal grains having the NaCl type face-centered cubic structure include crystal grains in which the x repeatedly increases and decreases, the crystal grains include 10 to 40 area % of crystal grains G1 having an average distance of 40 to 160 nm and crystal grains Gs having an average distance of 1 to 7 nm.

Abstract: Provided is an inorganic filler powder (3) having a structure in which at least a portion of the surface of inorganic particles (1) having a particle size of 1 ?m or more is covered with inorganic microparticles (2) having a particle size of 10 nm or more and less than 0.1 ?m, in which the coverage ratio of the surface of the inorganic particles (1) by the inorganic microparticles (2) is 30% or greater.

Abstract: A surface coated cutting tool includes a tool substrate; and a hard coating layer on the tool substrate. The hard coating layer includes, in sequence from the tool substrate toward a surface of the tool, a titanium carbonitride inner layer, a titanium nitride lower intermediate layer, a titanium carbonitride upper intermediate layer, a titanium oxycarbonitride bonding auxiliary layer, and an aluminum oxide outer layer. Titanium nitride grain boundaries in the lower intermediate layer and titanium carbonitride grain boundaries in the upper intermediate layer are continuous from titanium carbonitride grain boundaries in the inner layer. The texture coefficient TC(422) of titanium carbonitride in the inner layer and the upper intermediate layer is 3.0 or more, and the texture coefficient TC(0 0 12) of ?-aluminum oxide in the outer layer is 5.0 or more.

Abstract: A heat-exchange pipe that is excellent in heat-exchange property in which a metal porous body is not easily dropped off form a metal pipe; which is provided with the metal pipe and the metal porous body made by joining a plurality of metal fibers bonded to an inner-wall surface of the metal pipe; at least some of the metal fibers in the metal porous body are partially bonded to the inner-wall surface of the metal pipe along a length direction, bended on the inner-wall surface of the metal pipe, and extend to leave from the inner-wall surface.

Abstract: A bonded body is a bonded body in which a first metal member is bonded to a second metal member, where the first metal member is formed of a material having a hardness higher than that of the second metal member. The bonded body has a structure in which the second metal member is inserted into a protruded and recessed portion formed on a bonding surface of the first metal member, and the bonded body has a region in which the first metal member is in direct contact with the second metal member, and a gap between the first metal member and the second metal member is filled with a resin material.

Abstract: There is provided a thermoelectric conversion material in which a first layer containing Mg2SixSn1-x (here, 0<x<1) is directly joined to a second layer containing Mg2SiySn1-y (here, 0<y<1), where x/y is set within a range of more than 1.0 and less than 2.0. There is also provided a thermoelectric conversion element including the thermoelectric conversion material and electrodes each joined to one surface and the other surface of the thermoelectric conversion material. There is also provided a thermoelectric conversion module including terminals each joined to the electrodes of the thermoelectric conversion element.

Abstract: A superconductivity stabilizing material used for a superconducting wire and which is formed of a copper material containing at least one of additive elements selected from Ca, Sr, Ba, and rare earth elements in a range of 3 ppm by mass or more and 100 ppm by mass or less in total, with a remainder being Cu and unavoidable impurities, in which the total concentration of the unavoidable impurities, excluding O, H, C, N, and S which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, the half-softening temperature thereof is 200° C. or lower, the Vickers hardness thereof is 55 Hv or more, and the residual resistance ratio (RRR) thereof is 50 or more and 500 or less.

Abstract: Any metal having a low ?-ray emission, the metal being any one of tin, silver, copper, zinc, or indium, wherein an emission of an ?-ray after heating the metal at 100° C. in an atmosphere for six hours is 0.002 cph/cm2 or less. Any metal of tin, silver, copper, zinc and indium each including lead as an impurity is dissolved to prepare a hydrosulfate aqueous solution of the metal and lead sulfate is precipitated and removed in the solution. The lead sulfate is precipitated in the hydrosulfate aqueous solution by adding a lead nitrate aqueous solution including lead having an ?-ray emission of 10 cph/cm2 or less to the hydrosulfate aqueous solution, from which the lead sulfate has been removed, and, at the same time, the solution is circulated while removing the lead sulfate to electrowinning the metal using the hydrosulfate aqueous solution as an electrolytic solution.

Abstract: A pure copper sheet of the present invention has a composition including 99.96 mass % or more of Cu, 10.0 mass ppm or less of a total content of Pb, Se, and Te, 3.0 mass ppm or more of a total content of Ag and Fe, and inevitable impurities as a balance, in which an average crystal grain size of crystal grains on a rolled surface is 10 ?m or more, an aspect ratio of the crystal grain on the rolled surface is 2.0 or less, and an average crystal grain size of the crystal grains on the rolled surface after a pressure heat treatment performed under conditions of a pressure of 0.6 MPa, a heating temperature of 850° C., and a retention time at the heating temperature of 90 minutes is 500 ?m or less.