Abstract: There is provided a copper foil provided with a carrier providing excellent chemical resistance against the copper flash etching solution during the formation of the wiring layer on the surface of the coreless support and excellent visibility of the wiring layer due to high contrast to the antireflective layer in image inspection after copper flash etching. The copper foil provided with a carrier comprises a carrier; a release layer provided on the carrier; an antireflective layer provided on the release layer and composed of at least one metal selected from the group consisting of Cr, W, Ta, Ti, Ni and Mo; and an extremely-thin copper layer provided on the antireflective layer; wherein at least the surface adjacent to the extremely-thin copper layer of the antireflective layer comprises an aggregate of metal particles.

Abstract: A glass carrier-attached copper foil is provided that can achieve a desired circuit mounting board that reduces separation of a copper layer at the cut edge even if the copper foil is downsized to dimensions enabling mount of a circuit, and has an intended circuit pattern with a fine pitch. The glass carrier-attached copper foil includes a glass carrier, a release layer, and a copper layer with a thickness of 0.1 to 3.0 ?m. The glass carrier has, at least on its surface having the copper layer thereon, a plurality of flat regions each having a maximum height Rz of less than 1.0 ?m as measured in accordance with JIS B 0601-2001 and a rough region having a maximum height Rz of 1.0 to 30.0 ?m as measured in accordance with JIS B 0601-2001. The rough region has a pattern of lines that define the flat regions.

Abstract: Provided is a production method with which it is possible to produce beta zeolite at high purity by suppressing the generation of impurities by a seed crystal addition method that can reduce the environmental burden as much as possible, without using an organic structure-directing agent. This method for producing beta zeolite having a step that mixes and heats an organic-compound-free reaction mixture comprising a silica source, alumina source, alkali source, and water with beta zeolite seed crystals, wherein (I) beta zeolite synthesized without using an organic structure-directing agent and having 90% or more by volume of particles 10 ?m or less in diameter in the particle size distribution by a laser diffraction scattering-type particle size distribution measurement method is used, (III) acid-treated zeolite in which the SiO2/Al2O3 ratio is 150 or less is prepared by (II) contact treatment with an acidic aqueous solution, and the acid-treated zeolite is used as the beta zeolite seed crystals.

Abstract: There is provided with a metal foil-releasable resin layer composite comprising a metal foil and a releasable resin layer on at least one surface of the metal foil, wherein the releasable resin layer includes 100 parts by mass, in total, of (A) 50 to 95 parts by mass of a nonpolar resin, (B) 4 to 40 parts by mass of a thermosetting resin, and (C) 1 to 25 parts by mass of a release agent, wherein the mass ratio (A/B) of the nonpolar resin (A) to the thermosetting resin (B) is 55/45 to 96/4. The metal foil-releasable resin layer composite can achieve release with significantly low release strength between the metal foil and the releasable resin layer without damage of the releasable resin layer and can withstand hot pressing.

Abstract: A resin composition for use in a dielectric layer of a capacitor is provided that can control a decrease in capacitance or dielectric constant at high temperature and ensure high dielectric characteristics and high adhesion of the composition to a circuit. The resin composition contains a resin component containing an epoxy resin, a diamine compound, and a polyimide resin; and a dielectric filler composed of a metal oxide containing at least two elements selected from the group consisting of Ba, Ti, Sr, Pb, Zr, La, Ta, and Bi. The content of the dielectric filler is 60 to 85 parts by weight on the basis of 100 parts by weight of solid content in the resin composition.

Abstract: A method of manufacturing a multilayer wiring board is disclosed, the method being capable of reinforcing the multilayer wiring layer and thereby improving the reliability of connection and the flatness on the surface of the multilayer wiring layer. The method includes providing a laminated sheet having a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer at the side opposite to the laminate sheet, while interposing the second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board.

Abstract: A polishing liquid contains permanganate ions, a weak acid, and a soluble salt of the weak acid. The polishing liquid preferably has a pH of 0.5 to 6.0 at 25° C. before commencement of polishing. When a 0.1 mol/L aqueous solution of sodium hydroxide is added to 100 mL of the polishing liquid having been adjusted to pH 3.0 to 4.0 at 25° C., the amount of the sodium hydroxide aqueous solution necessary to raise the pH of the polishing liquid by 0.5 is preferably 0.1 to 100 mL. The weak acid is preferably acetic acid.

Abstract: Provided is a mordenite zeolite which can be produced without using an organic structure-directing agent, and has superior multivalent metal cation exchange capability. The mordenite zeolite according to the present invention containing silicon, a divalent metal M and aluminum in a skeletal structure, wherein the mordenite zeolite has the following atomic ratios in the state of Na-form. The mordenite zeolite preferably has a BET specific surface area of 250 m2/g or more and 500 m2/g or less and a micropore volume of 0.07 cc/g or more and 0.25 cc/g or less in the state of Na-form or H-form. Si/(M+Al)=5 or more and 10 or less, M/(M+Al)=0.1 or more and less than 1, and Na/(M+Al)=1 or more and less than 2.

Abstract: A catalyst powder according to the present invention is a catalyst powder that includes: a core portion that contains ceria and zirconia; and a surface layer portion that is located on the core portion and contains ceria and zirconia. The ratio (M2/M1) is 0.30 or more and 0.95 or less, the ratio (M2/M1) being the ratio of a mole fraction M2 (mol %) of cerium in the surface layer portion measured using X-ray photoelectron spectroscopy to a mole fraction M1 (mol %) of cerium in the entire powder. It is preferable that the ratio (M4/2/M3/1) between M3/1 and M4/2 is 1.1 or more and 5.0 or less, wherein M3/1 (=M3/M1) represents the ratio between a mole fraction M3 (mol %) of zirconium in the entire powder and a mole fraction M1 (mol %) of cerium in the entirety of the powder, and M4/2 (=M4/M2) represents the ratio between a mole fraction M4 (mol %) of zirconium measured using X-ray photoelectron spectroscopy and a mole fraction M2 (mol %) of cerium measured using X-ray photoelectron spectroscopy.

Abstract: Provided is a substrate/oriented apatite-type composite oxide film complex which is suitable as a solid electrolyte for a battery, a sensor, a separation membrane, or the like, and can be produced inexpensively. Proposed is a substrate/oriented apatite-type composite oxide film complex provided with an oriented apatite-type composite oxide film on a substrate, wherein a film thickness of the oriented apatite-type composite oxide film is 10.0 ?m or less, a degree of orientation (Lotgering method) thereof is 0.6 or more, and a material of the substrate at a side on which at least the oriented apatite-type composite oxide film is formed is a metal, an alloy, a ceramic, or a composite material thereof.

Abstract: There is provided a copper foil with a carrier particularly suitable for a circuit forming process for removing a carrier after laser drilling and desmear treatment, in detail, a copper foil with a carrier having high heat press resistance (heat resistance) of the carrier, laser drilling performance, corrosion resistance of the carrier against the desmear treatment, corrosion resistance of a release layer against the desmear treatment, and carrier release strength. The copper foil with a carrier comprises a carrier comprising at least one resin selected from polyethylene naphthalate (PEN) resins, polyethersulfone (PES) resins, polyimide resins, and polyphenylene sulfide resins; a silicon layer provided on the carrier, the silicon layer mainly containing silicon; a carbon layer provided on the silicon layer, the carbon layer mainly containing carbon; and an extremely thin copper layer provided on the carbon layer.

Abstract: Provided is a novel positive electrode active material capable of suppressing resistance and improving rate characteristics and cycle characteristics while enhancing lithium ionic conductivity, wherein the surface of particles composed of a spinel-type composite oxide containing Li, Mn, O, and two or more other elements is coated with a lithium ion conductive oxide such as LiNbO3. Proposed is a positive electrode active material for an all-solid-type lithium secondary battery, wherein the surface of present core particles composed of a spinel-type composite oxide containing Li, Mn, O, and two or more other elements is coated with an amorphous compound containing Li, A (A represents one or more elements selected from the group consisting of Ti, Zr, Ta, Nb, and Al), and O; and the molar ratio (Li/A) of Li relative to the A element in the surface, as obtained by XPS, is 1.0 to 3.5.

Abstract: There is provided a copper foil having a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board. A surface-treated copper foil according to the present invention includes a copper foil and a silicon-based surface coating layer provided on at least one surface of the copper foil, the silicon-based surface coating layer being mainly composed of silicon (Si). The silicon-based surface coating layer has a carbon content of 1.0 to 35.0 atomic % and an oxygen content of 12.0 to 40.0 atomic % relative to a total content in 100 atomic % of carbon (C), oxygen (O) and silicon (Si) elements as measured by X-ray photoelectron spectroscopy (XPS).

Abstract: Provided is a novel exhaust gas purification catalyst, which uses a Cu-based delafossite oxide, capable of increasing the exhaust gas purification performance compared to the case of using the Cu-based delafossite oxide alone. Proposed is an exhaust gas purification catalyst comprising a delafossite-type oxide represented by a general formula ABO2 and an inorganic porous material, wherein Cu is contained in the A site of the general formula of the delafossite oxide, one or two or more elements selected from the group consisting of Mn, Al, Cr, Ga, Fe, Co, Ni, In, La, Nd, Sm, Eu, Y, V, and Ti are contained in the B site thereof, and Cu is contained in 3 to 30% relative to the total content (mass) of the delafossite-type oxide and the inorganic porous material.

Abstract: In order to provide a novel oriented apatite-type oxide ion conductor which can achieve an increase in area through suppression of crack generation and preferably can be manufactured more inexpensively by an uncomplicated process, an oriented apatite-type oxide ion conductor composed of a composite oxide represented by A9.33+x[T6?yMy]O26.00+z A in the formula is one kind or two or more kinds of elements selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Be, Mg, Ca, Sr, and Ba. T in the formula is an element including Si, Ge, or both of them. M in the formula is one kind or two or more kinds of elements selected from the group consisting of B, Ge, Zn, Sn, W, and Mo.

Abstract: The purpose of the present invention is to provide a beta zeolite which includes zinc and has a small particle size. This beta zeolite includes a silicon oxide and a zinc oxide, and has an average particle size of 50 to 100 nm at a cumulative frequency of 50% in a particle size distribution measured by scanning electron microscope observation.

Abstract: An exhaust gas purifying composition of the present invention contains zeolite that is BEA zeolite having an SiO2/Al2O3 molar ratio of greater than 25 and 600 or less and containing phosphorus. Furthermore, the exhaust gas purifying composition preferably contains zirconium in addition to phosphorus. Furthermore, the zeolite has an SiO2/Al2O3 molar ratio of from 30 to 150. The present invention provides an exhaust gas purifying composition having excellent HC adsorbability for exhaust gas purification in internal combustion engines such as gasoline engines.

Abstract: Disclosed is a method for readily and inexpensively producing zeolite without using an organic structure-directing agent (organic SDA). Specifically disclosed is a method whereby a gel containing a silica source, an alumina source, an alkaline source and water is reacted with zeolite seed crystals, to produce a zeolite with the same kind of skeletal structure as the zeolite. The gel used is a gel of a composition whereby, when a zeolite is synthesized from this gel only, the synthesized zeolite comprises at least one of the kinds of composite building units of the target zeolite.

Abstract: There is provided a surface-treated copper foil including a surface coating layer provided on at least one surface of a copper foil, the surface coating layer being mainly composed of silicon with a hydrogen content of 1 to 35 atomic % and/or a carbon content of 1 to 15 atomic %. This foil can be manufactured by forming a surface coating layer composed mainly of silicon with the above hydrogen and carbon contents on at least one surface of the copper foil by PVD or CVD. The present invention can provide a copper foil with a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board.

Abstract: Provided is a novel crystalline solid electrolyte which can be used as a dispersion medium when slurrying polar solvents such as NMP, acetone, and DMF, and for which a decrease in conductivity when the crystalline solid electrolyte is immersed in said solvents can be suppressed. Proposed is a crystalline solid electrolyte represented by Compositional Formula: LixSiyPzSaHaw (here, Ha includes one or two or more of Br, Cl, I, and F, and 2.4<(x?y)/(y+z)<3.3), in which the content of S is 55 to 73% by mass, the content of Si is 2 to 11% by mass, and the content of a Ha element is 0.02% by mass or more.