Abstract: In this fuel cell electrode catalyst layer, a catalyst is supported on a carrier comprising inorganic oxide particles. The fuel cell electrode catalyst layer is provided with a porous structure. When a mercury penetration method is used to measure the pore size distribution of the porous structure, a peak is observed in the range spanning from 0.005 ?m to 0.1 ?m inclusive, and a peak is also observed in the range spanning from over 0.1 ?m to not more than 1 ?m. When P1 represents the peak intensity in the range spanning from 0.005 ?m to 0.1 ?m inclusive, and P2 represents the peak intensity in the range spanning from over 0.1 ?m to not more than 1 ?m, the value of P2/P1 is 0.2-10 inclusive. It is preferable that the inorganic oxide be tin oxide.

Abstract: Provided is a method of manufacturing a circuit board involves: preparing a composite laminate including a support, a release layer, and a multilayered circuit board; disposing the composite laminate on a stage such that one face of the composite laminate is put into tight contact with the stage; and releasing the support or the multilayered circuit board from the release layer such that the support or the multilayered circuit board forms a convex face with a curvature radius of 200 to 5000 mm while the face of the composite laminate is kept in tight contact with the stage. The method according to the present invention can prevent the occurrences of defects, for example, breaking in the support and cracking and wire disconnections in the multilayered circuit board in manufacturing of circuit boards, such as coreless circuit boards, and ensure stable release of the support or the multilayered circuit board.

Abstract: Disclosed is a tin oxide containing antimony and at least one element A selected from the group consisting of tantalum, tungsten, niobium, and bismuth. The antimony and the at least one element A selected from the group consisting of tantalum, tungsten, niobium, and bismuth are preferably dissolved in a solid state in tin oxide. The ratio of the number of moles of the element A to the number of moles of antimony, i.e., [(the number of moles of the element A/the number of moles of antimony)], is preferably 0.1 to 10.

Abstract: Provided is a sputtering target having extremely low occurrence of arcing or nodules, and a method for manufacturing such a sputtering target. A flat plate-shaped or cylindrical target material (3, 13) is obtained by processing a material composed of an oxide sintered body. In doing so, a grindstone having a specified grade is used to perform rough grinding of a surface of the material that will become a sputtering surface (5, 15) one or more times in accordance to the grade of the grindstone, after which zero grinding is performed one or more times so that the surface roughness of the sputtering surface (5, 15) has an arithmetic mean roughness Ra of 0.9 ?m or more, a maximum height Rz of 10.0 ?m or less, and RzJIS roughness of 7.0 ?m or less. A sputtering target (1, 11) is obtained by bonding the obtained target material (3, 13) to a backing body (2, 12) by way of a bonding layer (4, 14).

Abstract: Provided is a new catalyst structure for exhaust gas treatment including an upper catalyst layer and a lower catalyst layer, in which the catalyst structure can sufficiently exhibit functions as a three way catalyst while maintaining gas diffusibility. Proposed is a catalyst structure including a substrate, an upper catalyst layer, and a lower catalyst layer, the catalyst structure having a first peak or a second peak at a pore volume diameter of 10 nm to 50 nm and a pore volume diameter of 50 nm to 100 nm, respectively, in the logarithmic differential pore volume distribution analyzed by a mercury intrusion porosimeter.

Abstract: There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.

Abstract: A method of manufacturing a multilayer wiring board is disclosed, the method being capable of separating a substrate without large local warpage of the multilayer wiring layer and thereby improving the reliability of connection in the multilayer wiring layer. This method includes providing a laminated sheet having, in sequence, a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer while interposing a second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board.

Abstract: A method of manufacturing a multilayer wiring board is disclosed, the method being capable of reinforcing the multilayer wiring layer and thereby improving the reliability of connection and the flatness on the surface of the multilayer wiring layer. The method includes providing a laminated sheet having a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer at the side opposite to the laminate sheet, while interposing the second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board.

Abstract: Proposed is a phosphor capable of effectively inhibiting the occurrence of adverse influence of a sulfur-based gas while improving water resistance of the phosphor and effectively inhibiting the corrosion of a metallic member. A phosphor is proposed, which includes particles or a layer provided on the surface of a sulfur-containing phosphor, which contains sulfur in a host material, and containing a crystalline metal borate containing an IIA-Group element, boron, and oxygen.

Abstract: Provided is a phosphor, which is excited by a wide band of visible light, capable of emitting near-infrared light of high intensity. The phosphor comprises a crystal phase represented by a formula (1): MCuSi2O6 (where M comprises one or more of Ba, Sr and Ca), and a crystal phase represented by a formula (2): MCuSi4O10 (where M comprises one or more of Ba, Sr and Ca), wherein a ratio ? of a diffraction peak intensity of MCuSi4O10 with respect to a diffraction peak intensity of MCuSi2O6 in an X-ray diffraction (XRD) pattern obtained by powder XRD measurement using CuK? rays is 0<??0.50.

Abstract: The objective of the invention is to provide an MSE-type zeolite production method such that an MSE-type zeolite can be produced in a comparatively short heating time by using inexpensive tetraethylammonium ion. The production method of the present invention comprises steps of: (1) mixing a silica source, an alumina source, an alkali source, tetraethylammonium ion, and water in such a manner as to yield a reaction mixture of the composition represented by the molar ratios indicated below: SiO2/Al2O3=between 10 and 100 inclusive (Na2O+K2O)/SiO2=between 0.15 and 0.50 inclusive K2O/(Na2O+K2O)=between 0.05 and 0.7 inclusive TEA2O/SiO2=between 0.08 and 0.20 inclusive H2O/SiO2=between 5 and 50 inclusive; (2) using the MSE-type zeolite as a seed crystal, and adding this seed crystal to the mixture at a proportion of 5 to 30% by mass with respect to the silica component in the reaction mixture; and (3) heating, under hermetic seal at a temperature of 100 to 200° C.

Abstract: A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.

Abstract: Disclosed is copper powder having an average primary particle size D of 0.15 to 0.6 ?m, having a ratio of D to DBET, D/DBET, of 0.8 to 4.0 wherein DBET is a sphere-equivalent average particle diameter calculated from a BET specific surface area, and having no layer for preventing agglomeration on the surface thereof. The copper powder is suitably produced by a method which includes a step of mixing (1) hydrazine and (2) a reactant mixture including a monovalent or divalent copper source and a liquid medium which includes water and an organic solvent having water miscibility and capable of reducing the surface tension of water, to reduce the copper source to form copper particles.

Abstract: A material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. Copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the composite elastic modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.

Abstract: There is a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween, wherein an unoccupied region without the soluble adhesive layer is provided within a facing area where the reinforcing sheet faces the multilayer laminate; allowing a liquid capable of dissolving the soluble adhesive layer to infiltrate the unoccupied region to dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced to generate no large local warpage, thereby improving the reliable connection and the surface flatness (coplanarity) of the multilayer wiring layer. The used reinforcing sheet can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.

Abstract: There is provided a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet having openings on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween; contacting or infiltrating the soluble adhesive layer with a liquid capable of dissolving the soluble adhesive layer through the openings to thereby dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the position of the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced so as to generate no large local warpage, thereby improving the reliable connection in the multilayer wiring layer and the flatness (coplanarity) on the surface of the multilayer wiring layer. The reinforcing sheet having finished its role can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.

Abstract: Provided is a novel negative electrode for nonaqueous electrolyte secondary batteries, which is capable of improving cycle characteristics and is also capable of suppressing aggregation of active material particles in a slurry. The negative electrode active material for nonaqueous electrolyte secondary batteries contains silicon and has a D50 of 0.1 ?m to 5 ?m, and an amount of water measured at 120° C. to 300° C. by the Karl-Fischer method (referred to as “amount of water”) per specific surface area (referred to as “CS”), that is, the amount of water/CS, of 0.1 to 80 ppm/(m2/cc).

Abstract: There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.

Abstract: A novel silver-coated copper powder, particularly a silver-coated copper powder particle having a dendritic shape, having increased electrical conductivity with no need to increase the silver content is provided. The silver-coated copper powder is composed of a silver-coated copper particle coated with a silver layer containing silver or a silver alloy, including a silver-coated copper particle having a dendritic shape, containing nitrogen (N) in the silver layer, and having a nitrogen (N) content of 0.2 to 10.0 parts by mass with respect to 100 parts by mass of the silver content.

Abstract: Proposed is a novel negative electrode for nonaqueous electrolyte secondary batteries in which the battery capacity does not decrease even when charging and discharging are repeated. Proposed is a silicon-containing negative electrode active material for nonaqueous electrolyte secondary batteries, comprising negative electrode active material particles which are provided with a surface layer containing carbon and titanium or aluminum on the entirety or a portion of the surface of the active material.