Patents Assigned to Mitsui
  • Patent number: 6664364
    Abstract: There are herein disclosed a transparent optical material containing at least one selenium atom, a plastic lens comprising the transparent optical material, and methods for preparing them. In addition, there are also disclosed novel selenium-containing compounds represented by the following formulae (1), (2) and (4) which are useful for the transparent optical material and the plastic lens: wherein symbols are as defined in the specification.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: December 16, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Koju Okazaki, Mamoru Tanaka, Shiro Honma, Hiroyuki Morijiri, Yoshinobu Kanemura, Masahiko Kusumoto
  • Patent number: 6663325
    Abstract: A transport system for a spherical object. The transport system has a supply of a first fluid and a passageway for communication of a spherical object in a path between an inlet and an outlet. At least part of the passageway is bounded by a first tube having a first annular wall with at least one opening through the first annular wall. The first tube guides flow of a spherical object in the first fluid from the inlet towards the outlet. The transport system further includes a source of vacuum in communication with the passageway through the at least one opening through the first annular wall. The source of vacuum produces a low pressure region which causes the first fluid in the passageway to be drawn from the passageway through the at least one opening through the first annular wall. The transport system further includes a supply of a second fluid which is in communication with a spherical object moving between the inlet and the outlet.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: December 16, 2003
    Assignees: Mitsui High-Tec, Inc., Nippon Pneumatics/Bluidics System Co., Ltd., Ball Semiconductor Inc.
    Inventors: Shuho Kai, Takashi Kanatake, Tashirou Arai, Kiyoshi Horii
  • Patent number: 6664425
    Abstract: 1,3-Bis(3-aminophenoxy)benzene effective, for example, as a raw material for highly heat-resistant polyimide is produced industrially at a high yield by a reaction between 1,3-difluorobenzene and an alkali metal salt of 3-aminophenol.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: December 16, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Naoki Tomoshige, Yasuhiro Nukii, Masaru Wada, Koju Okazaki, Hidetoshi Hayashi
  • Publication number: 20030227177
    Abstract: A latch device for a vehicle tailgate comprises a latch/ratchet mechanism, an open mechanism, a lock mechanism, and, an actuator for switching the lock mechanism to an unlocked state and a locked state. The lock mechanism includes a lock lever turning about a lock shaft. The actuator includes an output shaft which turns the lock lever through the lock shaft. The lock shaft is structured so that manual operational access is possible through a service hole in the tailgate or the vehicle body for turning the lock lever. One end of the output shaft penetrates a housing of the actuator to be connected to the lock shaft, and the other end of the output shaft is exposed to the outside through a shaft hole of the housing, and the manual access is applied to the other end of the output shaft.
    Type: Application
    Filed: September 18, 2002
    Publication date: December 11, 2003
    Applicant: Mitsui Kinzoku Kogyo Kabushiki Kaisha
    Inventors: Yosuke Matsuda, Miki Ogino
  • Publication number: 20030229223
    Abstract: A protected 2′-deoxycytidine is purified by precipitating the protected 2′-deoxycytidine represented by general formula (3) in the form of a hydrated crystal from a solution containing the protected 2′-deoxycytidine and water, and by recovering the protected 2′-deoxycytidine: 1
    Type: Application
    Filed: June 4, 2003
    Publication date: December 11, 2003
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Hiroki Ishibashi, Kiyoteru Nagahara, Yasushi Fukuiri, Yasuko Matsuba
  • Patent number: 6660406
    Abstract: There are provided an electrodeposited copper foil with carrier that can be used for manufacturing a printed wiring board that excels in the finished accuracy of the resistor circuit in comparison with a conventional printed wiring board with resistor circuits, and a method for manufacturing such a printed wiring board with resistor circuits.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: December 9, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Takuya Yamamoto, Takashi Kataoka, Naotomi Takahashi
  • Publication number: 20030223175
    Abstract: A control method wherein sliding of a sliding door by a powered sliding device is started after sounding an annunciation buzzer when an operating switch is operated, but when a remote control transmitter integrally having an ignition key is operated, the sliding of the sliding door by the powered sliding device is started without operating the annunciation buzzer.
    Type: Application
    Filed: August 4, 2003
    Publication date: December 4, 2003
    Applicant: Mitsui Kinzoku Kogyo Kabushiki Kaisha
    Inventor: Kazuhito Yokomori
  • Publication number: 20030225244
    Abstract: The present invention provides a novel salt useful as an active species in an organic reaction and represented by the following chemical formula (1): 1
    Type: Application
    Filed: June 11, 2003
    Publication date: December 4, 2003
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Tadahito Nobori, Masahiro Kouno, Toshiaki Suzuki, Kazumi Mizutani, Shinji Kiyono, Yoshiho Sonobe, Usaji Takaki
  • Publication number: 20030225217
    Abstract: Disclosed is a thermosetting powder coating composition comprising (A) a glycidyl group-containing acrylic resin obtained by (co)polymerizing monomers containing an ethylenically unsaturated monomer having a glycidyl group and/or a &bgr;-methylglycidyl group, (B) a polycarboxyl curative, and (C) an alcohol adduct of a styrene/maleic anhydride copolymer. Also disclosed are a cross-linked cured film of the composition and a process for preparing the composition. According to the invention, blending efficiency and dispersibility of the components of a powder coating, particularly those between the resin component and the curative component, are improved without changing a conventional production process of a powder coating, i.e., a process consisting of melt blending, cooling solidification, pulverization and sieving, and thereby a thermosetting powder coating composition, which is capable of forming a cross-linked cured film improved in appearance properties (high gloss, etc.
    Type: Application
    Filed: May 28, 2003
    Publication date: December 4, 2003
    Applicant: Mitsui Chemical, Inc.
    Inventors: Mitsuyuki Mizoguchi, Yoshiharu Hirose
  • Publication number: 20030222462
    Abstract: A vehicle door latch device comprises a latch body, a latch provided in a recess of a latch body, and a ratchet provided in the recess. The latch body has a tongue part which comes into contact with an outer peripheral part of the latch, and a contact pin which comes into contact with the latch. The tongue part applies a first external force in an anti-rotational direction of the latch to the latch by contact with the outer peripheral part of the latch, and the contact pin applies a second external force in a axial direction of the latch shaft to the latch by contact with the latch. The tongue part comes into contact with the outer peripheral part when the latch is over-rotated exceeding a full-latched position.
    Type: Application
    Filed: September 23, 2002
    Publication date: December 4, 2003
    Applicant: Mitsui Kinzoku Kogyo Kabushiki Kaisha
    Inventor: Ian Bruce
  • Patent number: 6657849
    Abstract: A capacitor, which has a pair of conductive foils each having a dielectric layer on its surface, wherein the dielectric layers are attached to one another. In one process for its production, a capacitor is formed by applying a first dielectric layer onto a surface of a first conductive foil; applying a second dielectric layer onto a surface of a second conductive foil; and then attaching the first and second dielectric layers to one another. The resulting capacitor exhibits excellent void resistance.
    Type: Grant
    Filed: August 24, 2000
    Date of Patent: December 2, 2003
    Assignee: Oak-Mitsui, Inc.
    Inventors: John A. Andresakis, Edward C. Skorupski, Scott Zimmerman, Gordon Smith
  • Patent number: 6656589
    Abstract: A polyamide resin pellet for a miniature part, comprising a polyamide resin (A) whose melting point as measured by DSC is in the range of 280 to below 330° C., which has an average volume of 0.001 to 21 mm3, the average volume determined by randomly sampling 50 pellets, measuring the weight and specific gravity of each of the pellets and dividing the weight by the specific gravity. The polyamide resin pellet exhibits low water absorption and is excellent in moldability, mechanical strength characteristics and heat resistance. Further, it has specified average volume, configuration, average diameter and average length, so that, in an injection molding, plasticization is smoothly effected to thereby enable obtaining a molded item or article which exhibits low dispersion of weight and strength and has excellent hue. The polyamide resin pellet is especially suitable for use in a molding material for forming miniature parts for motor vehicles and electrical or electronic equipments.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: December 2, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yoshimasa Ogo, Tadayoshi Shiomura
  • Patent number: 6656601
    Abstract: The adhesive ethylene copolymer composition of the invention comprises a specific long-chain branched ethylene/&agr;-olefin copolymer (or this copolymer and its graft-modified product) and a tackifier (or a specific ethylene/vinyl acetate copolymer), and has specific density, MFR, crystallinity and graft quantity. The composition containing the tackifier can form a layer having good adhesive force to polystyrene resins, ABS resin, polyacrylonitrile resins and ethylene/vinyl acetate copolymer saponified resins even in an atmosphere of high temperatures. The composition containing the ethylene/vinyl acetate copolymer can form a layer having good adhesive force to polyester resins, polycarbonate resins, polyvinylidene chloride resins and ethylene/vinyl acetate saponified resins even in an atmosphere of high temperatures. The other adhesive ethylene copolymer composition of the invention comprises a blend of a graft-modified linear ethylene/&agr;-olefin copolymer and an olefin elastomer.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: December 2, 2003
    Assignee: Mitsui Chemicals Inc.
    Inventors: Hideshi Kawachi, Yuji Sawada, Haruhiko Tanaka
  • Patent number: 6657041
    Abstract: A production process of high molecular weight polysuccinimide having a weight average molecular weight of 40,000 or higher is disclosed, which comprises the following steps: 1) mixing and heating aspartic acid and an acidic catalyst to produce a liquid, low molecular weight polymer mixture, 2) separating the acidic catalyst to appropriate extent from the liquid, low molecular weight polymer mixture, thereby directly changing a polymer-containing phase from a liquid phase into a solid phase to produce a solid, low molecular weight polymer mixture, and 3) conducting solid-state polymerization on the thus-obtained solid, low molecular weight polymer mixture. This process can be practiced in a simple apparatus, and is free of problems such as formation of a highly viscous phase, excessive formation of foam, and formation of a reaction mixture into coherent mass.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: December 2, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Katsuhiko Machida, Susumu Fukawa, Shinji Ogawa, Toshio Katoh, Makoto Sukegawa, Yoshihiro Irizato
  • Publication number: 20030219960
    Abstract: An adhesive film for protecting the surface of a semiconductor wafer wherein the adhesive layer is formed on one surface of a substrate film, the substrate film comprising at least one layer which satisfies the following requisites (A) and at least one of (B) or (C):
    Type: Application
    Filed: January 10, 2003
    Publication date: November 27, 2003
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Hideki Fukumoto, Takanobu Koshimizu, Makoto Kataoka, Yoshihisa Saimoto
  • Patent number: 6652993
    Abstract: The object of the present invention is to provide a copper clad laminate with a copper-plated circuit layer, and a method for manufacturing a printed wiring board that excels the conventional ones in the aspect ratio of a circuit pattern when processed to a printed wiring board comprising a fine-pitch circuit. The object of the present invention is achieved by manufacturing a printed wiring board with the use of a copper clad laminate with a copper-plated circuit layer characterized by a copper-plated circuit layer and an outer-layer copper foil layer that satisfied the relationship in a case where a specific etchant is used, the R v value (Vsc/Vsp), which is the ratio of the dissolution rate (Vsp) of deposited copper that constitutes said copper-plated circuit layer to the dissolution rate (Vsc) of copper that constitutes said outer-layer copper foil layer, is 1.0 or more.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: November 25, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Takuya Yamamoto, Takashi Syoujiguchi
  • Patent number: 6652962
    Abstract: The invention provides a resin-coated composite foil characterized in that an organic insulating layer is disposed on an ultra-thin copper foil is disposed on a supporting metal layer through an intermediate organic release layer. The resin-coated composite foil is free from the peeling or blistering between the supporting metal foil and the ultra-thin copper foil during the production of a copper clad laminate.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: November 25, 2003
    Assignee: Mitsui Mining & Smelting Co. Ltd.
    Inventors: Tetsuro Sato, Tsutomu Asai, Kenichiro Iwakiri
  • Patent number: 6652725
    Abstract: An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: November 25, 2003
    Assignees: Mitsui Mining, Smelting Co., Ltd.
    Inventors: Kazuko Taniguchi, Makoto Dobashi, Hisao Sakai, Yasuji Hara
  • Patent number: 6647777
    Abstract: A pipe line for fluid to be detected is formed so that heat from a flow rate detector in which a thin-film heating element and a thin-film temperature sensing element are laminated on a first surface of a substrate through an insulating layer is transferred to and absorbed by the fluid. In the flow rate detector, the temperature sensing which is affected by the heat absorption of the fluid due to the heating of the thin-film heating element is executed by the thin-film temperature sensing element, and the flow rate of the fluid in the pipe line is detected on the basis of the temperature sensing result. A fin plate extending into the pipe line is joined to a second surface of the substrate of the flow rate detector by a joint member, and the fin plate extends so as to pass through the central portion on the circular section of the pipe line. The dimension of the fin plate in the direction of the pipe line is larger than the dimension L2 of the thickness.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: November 18, 2003
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Hirofumi Kotaka, Atsushi Koike, Kiyoshi Yamagishi, Toshiaki Kawanishi, Kenji Tomonari, Shinichi Inoue, Yukihiro Tochio, Hiromitsu Miyajima
  • Patent number: 6649699
    Abstract: A composition of tetrafluoroethylene/perfluoro(alkyl vinyl ether) having at least 4 wt % perfluoro(alkyl vinyl ether) and a melt flow rate of no greater than 4 g/10 min, and 5 to 30 wt % low molecular weight PTFE, has improved gas impermeability and also mechanical strength.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: November 18, 2003
    Assignee: DuPont Mitsui Fluorochemicals
    Inventor: Shinichi Namura