Abstract: A ceramic substrate including a base having a first surface, a second surface opposite to the first surface, and a through hole having a first opening diameter at the first surface and a second opening diameter at the second surface. The first opening diameter is larger than the second opening diameter. The ceramic substrate also includes at least one solid particle disposed in the through hole, and an electrically-conductive member disposed in the through hole. A thermal conductivity of the at least one solid particle is higher than a thermal conductivity of the electrically-conductive member. The electrically-conductive member is continuous between the first surface and the second surface.

Abstract: A bonded substrate includes a metal plate; a first ceramic; and a first metal body disposed between a first surface of the metal plate and a first surface of the first ceramic and disposed on 80% or more of a lateral surface continuous with the first surface of the first ceramic.

Abstract: An optical circuit capable of reducing a frequency variation of a light source caused by rotation is provided. The optical circuit includes a substrate, a laser light source formed on the substrate and including a first annular optical waveguide and a second annular optical waveguide that shares a part thereof with the first annular optical waveguide at one location, a first optical waveguide located on the substrate at a position separated from the laser light source and optically coupled to the laser light source, and a resonator optically coupled to the first optical waveguide.

Abstract: A light-emitting device includes a light source, a lens disposed above the light source, and a light-receiving element disposed at a position not intersecting with an optical axis of the lens and receiving external light via the lens. The lens includes a light adjustment part in a region overlapping the light-receiving element in a top view, and the light adjustment part for adjusting an amount of external light received by the light-receiving element.

Abstract: An illumination device includes a light-emitting device and a control device. The light-emitting device is configured to emit at least light of a first color temperature having a correlated color temperature in a range from 3500 K to 8000 K, the light having a melanopic ratio of a prescribed value within a variation range of the melanopic ratio in which a gap between a maximum value and a minimum value of the melanopic ratio at the first color temperature is 0.30 or more. The control device is configured to control the light emitted from the light-emitting device, within a predetermined amount of time, by varying the melanopic ratio of the light by 0.3 or more, and adjusting the correlated color temperature of the light in a range from 0 K to ±500 K with respect to the first color temperature.

Abstract: A light source device includes: a plurality of light source parts configured to emit light. Each of the light source parts comprises a light-emitting element and a light guiding member. the plurality of light-emitting elements are configured to emit light passing through the light guiding members from the light source parts in an array in an irradiated region. One or more of the plurality of light source parts are arranged in a placement region in a different arrangement from an arrangement of the light in the irradiated region.

Abstract: A method for manufacturing a semiconductor device include: providing a submount that has a first surface, a second surface located on a side opposite the first surface, and at least one lateral surface located between the first surface and the second surface, the submount including: a groove located at the second surface, a heat dissipation portion located at the second surface, at least one end face through channel located at the at least one lateral surface, and an electrode pattern on the first surface; physically joining the heat dissipation portion to a package substrate by a first joint material; and after the step of physically joining the heat dissipation portion to the package substrate, disposing a second joint material inside the at least one end face through channel to electrically connect the electrode pattern and the package substrate.

Abstract: A lighting apparatus includes light emitting elements having an emission peak wavelength of 400 to 510 nm, a first phosphor having an emission peak wavelength of 485 to 700 nm, a second phosphor having an emission peak wavelength of 510 to 590 nm, a third phosphor having an emission peak wavelength of 600 to 700 nm, and a color filter having transmittance for light with a wavelength of 600 to 730 nm that is 80% or more and transmittance for light with a wavelength of 410 to 480 nm that is 3% or more and 50% or less. The color filter transmits a part of light emitted from the first phosphor, at least a part of light emitted from the second phosphor, and at least a part of light emitted from the third phosphor. Light transmitted through the color filter is emitted to the outside.

Abstract: A method for manufacturing a light-emitting element includes: forming a semiconductor structure comprising a light-emitting layer on a first surface of a substrate, wherein the first surface comprising a plurality of protrusions and a second region; dividing the semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region of the substrate, wherein the second region is exposed from under the semiconductor structure in the exposed region; bonding a light-transmitting body to a second surface of the substrate that is opposite the first surface so as to form a bonded body, wherein the light-transmitting body comprises a fluorescer; forming a plurality of modified regions along the exposed region; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.

Abstract: A light source device includes a substrate and a light source. The light source includes a first light emission unit, a plurality of second light emission units, and a plurality of third light emission units arranged two-dimensionally on the substrate. The first light emission unit is arranged at a center among the light emission units, and includes a first light emission element having a first light emission face. The second light emission units surround the first light emission unit, and include a plurality of second light emission elements, respectively, each having a second light emission face. The third light emission units surround the second light emission units, and include a plurality of third light emission elements, respectively, each having a third light emission faces. The first light emission face and the second light emission faces all have the same areas. The third light emission faces have different areas.

Abstract: A light emitting device includes: a base having an upper face; a light emitting element mounted on the upper face of the base; one or more bonding members disposed on the upper face of the base outward of the light emitting element; a light transmissive member bonded to a portion of the upper face of the base by the one or more bonding members; and a protective film that continuously covers the light emitting element, the upper face of the base, lateral faces of the one or more bonding members, and a lower face of the light transmissive member. A gap is located between the upper face of the base and the lower face of the light transmissive member and configured to allow a space in which the light emitting element is mounted to communicate with an outside of the light emitting device, wherein the gap is defined by the upper face of the base, the lower face of the light transmissive member, and the one or more bonding members.

Abstract: A method of producing a positive electrode active material for a nonaqueous electrolyte secondary battery, the method includes preparing nickel-containing composite oxide particles having a ratio 1D90/1D10 of a 90% particle size 1D90 to a 10% particle size 1D10 in volume-based cumulative particle size distribution of 3 or less; obtaining a raw material mixture containing the composite oxide particles and a lithium compound and having a ratio of a total number of moles of lithium to a total number of moles of metal elements contained in the composite oxide in a range of 1 to 1.3; subjecting the raw material mixture to a heat treatment to obtain a heat-treated material; subjecting the heat-treated material to a dry-dispersion treatment to obtain a first dispersion; and bringing the first dispersion into contact with a liquid medium to obtain a second dispersion.

Abstract: A light emitting module includes: a light source; and an optical member configured to control a distribution of light emitted from the light source. The optical member comprises an incident face on which the light from the light source is incident, and an output face through which the light incident on the incident face exits. In a plan view: the optical member is shaped to have a long axis and a short axis orthogonal to the long axis, and a central axis of the optical member passes through the light source, the incident face, and the output face, while being orthogonal to a long axis direction parallel to the long axis and a short axis direction parallel to the short axis.

Abstract: A light-emitting device includes a wiring substrate and a plurality of light-emitting elements arrayed on the wiring substrate along a first direction and each having a rectangular shape. The light-emitting elements each include a first portion, and a plurality of second portions disposed on either side of the first portion in the first direction. The first portion includes a first semiconductor layered body and an electrode. The second portions each include a second semiconductor layered body, and a reflective layer connected to the second semiconductor layered body. The first portion includes a first length section and a second length section. In the first length section, a length of the first semiconductor layered body in the first direction is a first length. In the second length section, a length of the first semiconductor layered body in the first direction is a second length shorter than the first length.

Abstract: A light emitting device includes: a first substrate; a light emitting element disposed on a first region of an upper surface of the first substrate; a light-transmissive member including disposed as a layer including a first portion that is located on an upper surface of the light emitting element and a second portion that is continuous with the first portion and is located on a second region of the upper surface of the first substrate; and a protrusion extending around the light emitting element. Part of the second portion of the light-transmissive member is located between the protrusion and the second region of the upper surface of the first substrate.

Abstract: A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 ?m or more and 0.3 ?m or less.

Abstract: This laser processing apparatus is for forming modified regions in an object, which includes a sapphire substrate having a C-plane as a main surface, along cutting lines by focusing laser light on the object, and is provided with a laser light source, a spatial light modulator, and a focusing optical system. The spatial light modulator performs aberration correction by a first aberration correction amount smaller than an ideal aberration correction amount when the modified region is formed along a first cutting line along an a-axis direction of the sapphire substrate, and performs aberration correction by a second aberration correction amount smaller than the ideal aberration correction amount and different from the first aberration correction amount when the modified region is formed along a second cutting line along an m-axis direction of the sapphire substrate.

Abstract: A planar light source includes a substrate, light sources, and at least one partitioning member. The partitioning member includes first wall parts, second wall parts, and partitioned regions. The first wall parts define first ridges extending in a first direction. The second wall parts define second ridges extending in a second direction. The partitioned regions each is surrounded by the first ridges and the second ridges in a plan view. the partitioned regions are arranged in the first and second directions. At least one first cut is defined on at least one of the first ridges. At least one second cut is defined on at least one of the second ridges. The at least one first cut and the at least one second cut are spaced apart from each other. At least one of the light sources is arranged in a corresponding one of the partitioned regions.

Abstract: A light-emitting device includes: a light-emitting element having a first surface as a light extraction surface, a second surface on an opposite side of the first surface, and a lateral surface connecting the first surface and the second surface and including an element electrode on the second surface; a substrate including a wiring member electrically connected to the element electrode; a light-transmissive member disposed above the first surface of the light-emitting element and allowing light from the light-emitting element to pass through; an inorganic member including a plurality of voids and disposed, on the substrate, on a lateral surface or lateral to the light-emitting element and on a lateral surface of the light-transmissive member; and a light-reflective member in contact with at least part of the inorganic member. A portion of the light-reflective member is impregnated in at least a portion of the plurality of voids.

Abstract: A method of producing a compound for bonded magnets, the method including: heat-curing a thermosetting resin and a curing agent having a ratio of the number of reactive groups of the curing agent to the number of reactive groups of the thermosetting resin of at least 2 but not higher than 11 to obtain an additive for bonded magnets; and kneading the additive for bonded magnets, magnetic powder, and a thermoplastic resin to obtain a compound for bonded magnets in which a filling ratio of the magnetic powder is at least 91.5% by mass.