Abstract: A light source device includes an electronic component and a substrate. The electronic component includes first and second electrodes exposed at a lower surface. The first electrode includes first and second parts separated from each other by a separation region on the lower surface of the electronic component. The substrate includes a basal member and a first and second wiring layers disposed on an upper surface of the basal member. The electronic component is mounted to the substrate so that upper surfaces of the first and second wiring layers respectively face the first and second electrodes. The substrate includes a first region at a position overlapping the separation region as seen in a top view. Solder wettability of the substrate in the first region is lower than solder wettability of the substrate in at least regions of the first wiring layer facing the first and second parts of the first electrode.
Abstract: An optical device comprises: at least one first reflecting surface disposed so as to reflect first light that has a light distribution having an optical axis parallel to a first axis, to an arc-shaped first region surrounding the first axis; and a second reflecting surface and a third reflecting surface that are disposed such that the second reflecting surface and the third reflecting surface meet each other on the first axis, and such that the first reflecting surface is disposed between the second reflecting surface and the third reflecting surface.
Abstract: A light-emitting device includes: a mounting base; a plurality of light-emitting elements mounted on or above the mounting base; a plurality of light-transmissive members respectively disposed on upper surfaces of the plurality of light-emitting elements; a plurality of light guide members respectively covering lateral surfaces of the plurality of light-emitting elements; a plurality of antireflective films respectively disposed on upper surfaces of the plurality of the light-transmissive members; and a covering member covering lateral surfaces of the plurality of antireflective films.
Abstract: A method for manufacturing a light emitting device includes placing a light emitting element on a releasable base material so that a first face of the light emitting element is in contact with the releasable base material. An entire area of the first face is a first area. A wavelength converting material is provided on the releasable base material to cover an entirety of the light emitting element. The releasable base material is removed. A first electrically conductive material covers the first electrode and the wavelength converting material. An entire area of the first electrically conductive material viewed in a height direction is a second area larger than the first area. A second electrically conductive material covers the second electrode and the wavelength converting material. An entire area of the second electrically conductive material viewed in the height direction is a third area larger than the first area.
Abstract: A method of manufacturing a light emitting device includes: providing a semiconductor stack including a first semiconductor layer and a second semiconductor layer; forming light emitting cells by forming grooves in column and row directions; exposing a portion of the first semiconductor layer from the second semiconductor layer in each light emitting cell; forming a first insulation layer having a first hole on the light emitting cells and the grooves; forming a wiring electrode to be in electrical connection with the first semiconductor layer at the first hole in each light emitting cell; forming a second hole in the first insulation layer; forming a second electrode to be in electrical connection with the second semiconductor layer at the second hole; thinning the first semiconductor layer; and exposing the first insulation layer from the first semiconductor layer at the grooves while roughening the surface of the first semiconductor layer.
Abstract: An electronic component package includes: a metal plate; a metal wall that is disposed on the metal plate; a metal frame that is disposed on the metal plate so as to be opposed to the metal wall; a through hole that is formed in the metal wall; an opening hole that is formed in the metal frame so as to be opposed to the through hole; and a lead that is hermetically sealed with a sealing portion provided in the through hole, and that is inserted into the opening hole and the through hole. The metal frame includes: a side plate that is opposed to the metal wall; a bent portion that is connected to the side plate and has a round shape; and a welding portion that is connected to the bent portion and to which a lid member is to be bonded.
August 6, 2018
Date of Patent:
January 14, 2020
SHINKO ELECTRIC INDUSTRIES CO., LTD., NICHIA CORPORATION
Abstract: A light emitting device includes: a light emitting element; a first reflecting member containing reflecting particles, and covering the upper surface of a base while exposing a light extraction surface of the light emitting element; a first cover member having a lower concentration of reflecting particles than the first reflecting member and covering the first reflecting member and a portion of lateral surfaces of the light emitting element while exposing the light extraction surface of the light emitting element; a second cover member covering a portion of the lateral surfaces of the light emitting element; a second reflecting member surrounding the second cover member in a top view and contacting the second cover member and the first reflecting member; the second reflecting member having a narrow-width portion being in contact with the first reflecting member and a wide-width portion located above the narrow-width portion in a cross-sectional view.
Abstract: A method, comprising: providing a light emitting element including a semiconductor stack body and an electrode; providing a lightguide plate having a first surface and a second surface opposite to the first surface, wherein the second surface includes a plurality of recesses; arranging a light-transmitting member in each of the recesses; adjusting upper surfaces of the light-transmitting members to a uniform height; placing a wavelength conversion member on the light-transmitting member; placing the light emitting element on the wavelength conversion member with the electrode facing up; arranging a cover member that covers the light emitting element; removing the cover member until the electrode is exposed; and forming a wiring that electrically connects the light emitting elements together.
Abstract: Provided is a light emitting device that includes a light emitting element having a light emission peak wavelength ranging from 380 nm to 490 nm, and a fluorescent material excited by light from the light emitting element and emitting light having at a light emission peak wavelength ranging from 580 nm or more to less than 680 nm. The light emitting device emits light having a ratio R/B of a photon flux density R to a photon flux density B ranging from 2.0 to 4.0 and a ratio R/FR of the photon flux density R to a photon flux density FR ranging from 0.7 to 13.0, the photon flux density R being in a wavelength range of 620 nm or more and less than 700 nm, the photon flux density B being in a wavelength range of 380 nm or more and 490 nm or less, and the photon flux density FR being in a wavelength range of 700 nm or more and 780 nm or less.
September 16, 2019
January 9, 2020
Mika AMIYA, Kazushige FUJIO, Tomokazu SUZUKI
Abstract: A method of producing a positive electrode active material for a nonaqueous electrolyte secondary battery, the method includes preparing nickel-containing composite oxide particles having a ratio 1D90/1D10 of a 90% particle size 1D90 to a 10% particle size 1D10 in volume-based cumulative particle size distribution of 3 or less; obtaining a raw material mixture containing the composite oxide particles and a lithium compound and having a ratio of a total number of moles of lithium to a total number of moles of metal elements contained in the composite oxide in a range of 1 to 1.3; subjecting the raw material mixture to a heat treatment to obtain a heat-treated material; subjecting the heat-treated material to a dry-dispersion treatment to obtain a first dispersion; and bringing the first dispersion into contact with a liquid medium to obtain a second dispersion.
Abstract: A cylinder bore wall thermal insulator set in a groove-like cooling water channel of a cylinder block of an internal combustion engine including cylinder bores and for insulating all bore walls of all the cylinder bores or a part of the bore walls of all the cylinder bores includes bore wall insulating sections having an arcuate shape when viewed from above and for insulating a wall surface on the cylinder bore side of the groove-like cooling water channel and a supporting section made of synthetic resin and having a shape conforming to a shape of the groove-like cooling water channel in a setting position of the thermal insulator, the bore wall insulating sections being fixed to the supporting section. The bore wall insulating sections include rubber members, rear surface pressing members, and elastic members.
Abstract: A light emitting device includes a support member, a semiconductor laser element, a light reflecting member, and a wavelength conversion member. The support member has a base and a cap that includes a light extraction window from which light is extracted upward. The semiconductor laser element is disposed within a space defined by the base and the cap. The light reflecting member is disposed in the space at a position where light from the semiconductor laser element is reflected toward the light extraction window. The wavelength conversion member is disposed between the semiconductor laser element and the light reflecting member, and includes a support surface that supports the light reflecting member, and a light incidence surface on which the light emitted by the semiconductor laser element is incident. Part of the wavelength conversion member is fitted into the light extraction window.
Abstract: The method of manufacturing a light emitting element includes: temporarily fixing a semiconductor layer of a wafer including a base member and the semiconductor layer to a support base member by a double-sided tape having a loss tangent adapted to be increased by heating from an ordinary temperature; forming a cleavage starting portion for dividing the wafer into a plurality of light emitting elements at an ordinary temperature in the wafer; and singulating the wafer into a plurality of light emitting elements on the support base member while the double-sided tape is heated.
Abstract: A light emitting device includes: a mounting board; a plurality of light sources positioned on the mounting board; a light diffusion plate; a half mirror positioned between the light diffusion plate and the plurality of light sources; and a plurality of diffuse reflectors positioned between the mounting board and the light diffusion plate, and above at least part of each emission face of the plurality of light sources.
Abstract: A light emitting device includes a package having a recess which includes a bottom surface having corners. The package includes a first electrode, a second electrode, and a resin portion. The first electrode is provided at a first part of the bottom surface. The second electrode is provided at a second part of the bottom surface. The resin portion is provided between the first electrode and the second electrode at a third part of the bottom surface. A protection element is provided on the bottom surface. A light reflective material covers the bottom surface except for an uncovered region to cover the protection element and the corners of the bottom surface and uncovers an uncovering region of the bottom surface. The uncovered region is defined by linear lines and curved lines connecting the linear lines. A light emitting element is provided in the uncovered region on the bottom surface.
Abstract: The light-emitting device includes a first light-emitting element having an emission peak wavelength of 430 nm or more and less than 490 nm, a second light-emitting element having an emission peak wavelength of 490 nm or more and 570 nm or less, a support body at which the first light-emitting element and the second light-emitting element are disposed, and a light-transmissive member containing a red phosphor and covering the first light-emitting element and the second light-emitting element. A content density of the red phosphor in the light-transmissive member in a space between the first and second light-emitting elements is higher in a part below an upper surface of the second light-emitting element than in a part above the upper surface thereof.
Abstract: Provided is a method for producing a ?-sialon fluorescent material, comprising preparing a composition containing a silicon nitride that contains aluminium, oxygen, and europium; heat-treating the composition at a temperature in a range of 1300° C. or more and 1600° C. or less to obtain a heat-treated product; subjecting the heat-treated product to a temperature-decrease of from the heat treatment temperature to 1000° C. as a first temperature-decrease step; and subjecting the heat-treated product to a temperature-decrease of from 1000° C. to 400° C. as a second temperature-decrease step. The first temperature-decrease step has a temperature-decrease rate in a range of 1.5° C./min or more and 200° C./min or less, and the second temperature-decrease step has a temperature-decrease rate in a range of 1° C./min or more and 200° C.
Abstract: A connector includes a first buffer member that includes a spiral-shaped wire, a second buffer member that has a substantially annular and flat plate-like shape capable of warping in a thickness direction, a collar member that includes a first flange facing a radially inner side of the first buffer member, and a second flange facing a radially inner side of the second buffer member, and a coupling member. A gap for allowing the second buffer member to move in a radial direction is formed between the second buffer member and a cylindrical portion. A distance between a position of a surface of the second flange and a position of a lowest end of the collar member is greater than a distance between a position of a surface of the first flange and the position of the surface of the second flange in a view in an axial direction.
January 26, 2018
January 2, 2020
Tadakatsu Kato, Sakae Mishina, Keiichi Yoshino, Koki Enami
Abstract: A light-emitting device includes a base member, conductor wiring on an upper surface of the base member, a reflective member covering the upper surfaces of the base member and the conductor wiring and having apertures to expose part of the upper surface of the base member and part of the upper surface of the conductor wiring, a plurality of light sources bonded to the part of the upper surface of the conductor wiring located in the apertures with bonding members, and a reflector that is disposed on the reflective member and includes a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the first surrounding portions, which respectively surround the light sources in a plan view. Each surrounding portion has inclined lateral surfaces that widen in an upward direction. An aperture in each second surrounding portion is smaller than an aperture in each first surrounding portion in the plan view.
Abstract: A method of manufacturing a light emitting device includes: mounting a light emitting element in a package in which a recess is defined, the light emitting element being mounted on a bottom surface defining the recess; forming a first reflecting layer by covering lateral surfaces defining the recess with a first resin containing a first reflecting material; forming a second reflecting layer covering the bottom surface defining the recess, wherein the step of forming the second reflecting layer comprises settling the second reflecting material in the second resin by a centrifugal force so as to form (i) a layer containing a second reflecting material on the bottom surface defining the recess, and (ii) a light-transmissive layer above the layer containing the second reflecting material; and disposing a phosphor-containing layer on the second reflecting layer and the light emitting element, the phosphor-containing layer comprising a third resin that contains a phosphor.