Abstract: A printed circuit board includes a printed wiring board including an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. A semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. Conductive members filled in the through-holes connect the element terminals and the wiring. The insulative substrate has elasticity in which an elongation percentage of the insulative substrate is 20% or more. The wiring is formed from a conductive polymer or an elastic conductive paste in which conductive particles are mixed into a resin material.

Abstract: A wavelength conversion member manufacturing method includes: providing the wavelength conversion member having an upper surface, the wavelength conversion member including a phosphor portion, and a light-transmissive portion configured to transmit fluorescence from the phosphor portion; and forming, in the wavelength conversion member, at least one depressed portion each having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above more than once to form a plurality of continuous machining marks at different processing depths.

Abstract: Provided are a chlorosilicate fluorescent material having high light emission efficiency, a method for producing the same, and a light emitting device. In certain embodiments, the chlorosilicate fluorescent material has a chemical composition comprising Ca, Eu, Mg, Si, O, and Cl, wherein when a molar ratio of Si in 1 mol of the chemical composition is set as 4, the chlorosilicate fluorescent material comprises Ca in a molar ratio range of 7.0 or more and 7.94 or less, Eu in a molar ratio range of 0.01 or more and 1.0 or less, Ca and Eu in a total molar ratio range of 7.70 or more and 7.95 or less, Mg in a molar ratio range of 0.9 or more and 1.1 or less, and Cl in a molar ratio range of more than 1.90 and 2.00 or less.

Abstract: A light-emitting device includes: a package having an upper surface and defining a recess including an opening located at the upper surface; a light-emitting element disposed on a surface that defines a bottom of the recess of the package; and a sealing member disposed in the recess of the package and covering the light-emitting element. The upper surface of the sealing member includes a flat region. The flat region includes at least a region located above the light-emitting element. The flat region is located below the upper surface of the package.

Abstract: Provided is an oxide phosphor having a light emission peak wavelength of 800 nm or greater. The oxide phosphor has a composition containing Mg, Ga, O, and Cr, and optionally containing a first element M1, a second element M2, and a third element M3. When a total molar ratio of Ga, Cr, the second element M2, and the third element M3 per mole of the composition of the oxide phosphor is 2, the molar ratio of Mg or the molar ratio of a total of Mg and the first element M1 is in a range from 0.7 to 1.3, the molar ratio of O is in a range of 3.7 to 4.3, and the molar ratio of Cr is in a range greater than 0.02 and 0.3 or less. The oxide phosphor has a light emission peak wavelength in a range of 800 nm to 1600 nm in a light emission spectrum.

Abstract: A light-emitting device includes: a base portion; a first light-emitting element disposed on the base portion; a frame portion having inner lateral surfaces surrounding at least a portion of the base portion and extending upward further than the upper surface, wherein the frame portion includes: a first stepped portion extending partially along the one or more inner lateral surfaces in a first direction and having a width in a second direction perpendicular to the first direction in a top view, and a first metal film and a second metal film disposed on an upper surface of the first stepped portion, wherein the first metal film and the second metal film are separated from each other by a first boundary region that includes a portion that extends in the first direction; and a first protecting element disposed on the first and second metal films and spanning in the second direction.

Abstract: An upper surface of a lateral wall portion of a substrate includes a first upper surface portion exposed from a light-transmissive member in a first region, a second upper surface portion exposed from the light-transmissive member in a second region, and a third upper surface portion located between the first upper surface portion and the second upper surface portion in a second direction, and an upper surface of an outer peripheral portion of the light-transmissive member includes a first outer peripheral surface portion located in the first region. An area of the first upper surface portion of the lateral wall portion is greater than an area of the first outer peripheral surface portion of the outer peripheral portion of the light-transmissive member. A bonding member is disposed between the third upper surface portion of the lateral wall portion and the first lower surface portion of the light-transmissive member.

Abstract: A display driving circuit drives a display unit including a plurality of light-emitting elements connected along respective common lines and arranged in a matrix. The driving circuit includes one or more element drivers for driving the plurality of light-emitting elements of the display unit, a memory that stores lighting period information indicating a lighting period in which each light-emitting element is lit by the one or more element drivers, an element lighting period controller that outputs the lighting period information stored in the memory to each element driver, a switching unit that selects each common line based on the lighting period information stored in the memory, and a common line lighting period controller that is interposed between the memory and the switching unit and controls a lighting period in which each common line is activated according to the lighting period information.

Abstract: The light-emitting device includes a light-emitting element including an element portion, and an electrode disposed on a lower surface of the element portion, a wavelength conversion member disposed on an upper surface and a lateral surface of the element portion, a light-transmissive member disposed on an upper surface of the wavelength conversion member, and a light reflective member disposed on the lower surface of the element portion and a lower surface of the wavelength conversion member. A lateral surface of the wavelength conversion member is exposed from the light-transmissive member, and a thickness of the light-transmissive member is larger than a thickness of the wavelength conversion member.

Abstract: A light emitting device includes: a package having a light extraction face that has a light transmitting region, and including a base that has a mounting face; a first light emitting element disposed on the mounting face in the package and having a first emission face configured to emit divergent light, the first emission face being perpendicular to the mounting face of the base and parallel to the light extraction face; and a second light emitting element disposed on the mounting face in the package and having a second emission face configured to emit divergent light, the second emission face being perpendicular to the mounting face of the base and parallel to the light extraction face. The light emitted from the first light emitting element exits from the package through the light transmitting region.

Abstract: A light-emitting device includes: at least one light-emitting element comprising a semiconductor layered portion and configured to emit light that has a predetermined wavelength and includes a first polarization component and a second polarization component; and at least one polarized light control member in contact with the at least one light-emitting element. The at least one polarized light control member includes a first structure and a second structure that are positioned in order from a light-emitting element side. The first structure is configured to receive the light having the predetermined wavelength to generate near-field light. The second structure is configured to receive the near-field light and the light having the predetermined wavelength to emit light in which a proportion of the second polarization component is greater than a proportion of the first polarization component.

Abstract: A method of manufacturing a semiconductor element includes irradiating a laser beam on a wafer, which includes a sapphire substrate having a first face and a second face opposite the first face and a semiconductor structure disposed on the first face, from a second face side. The laser beam irradiated along a first direction parallel to the second face of the sapphire substrate is focused inside the sapphire substrate to thereby create a modified portion in the sapphire substrate along the first direction. The wafer is severed and separated into a number of semiconductor elements following the formation of a modified portion. In the step of forming a modified portion, the laser beam is focused closer to the second face than to the first face in a thickness direction of the sapphire substrate.

Abstract: The planar light source includes a light-emitting device including a light-emitting element provided with an element portion and an electrode disposed on a lower surface of the element portion, a wavelength conversion member disposed on an upper surface and a lateral surface of the element portion, a light-transmissive member disposed on an upper surface of the wavelength conversion member, and a first light reflective member disposed on lower surfaces of the element portion and the wavelength conversion member; a substrate; and a second light reflective member disposed on an upper surface of the substrate and provided with an opening. The light-emitting device is disposed on the upper surface of the substrate in the opening, and the upper surface of the substrate includes an exposed portion exposed from the light-emitting device in the opening. A thickness of the light-transmissive member is larger than a thickness of the wavelength conversion member.

Abstract: A light emitting module includes a light guide plate including a first face, a second face opposing the first face, and a through part penetrating between the first face and the second face, a light emitting device disposed in the through part on a second face side, a light transmissive member disposed on the light emitting device in the through hole on a first face side and between the light emitting device and a lateral wall of the through part, and a first light reflecting member disposed between an upper face of the light emitting device and the light transmissive member while being in contact with the upper face of the light emitting device.

Abstract: A light emitting device includes a substrate, a reflective resin layer, and a light emitting element. The reflective resin layer is disposed on the substrate and contains a first reflective material and a first resin. The reflective resin layer including first flat part having a first thickness, a second flat part having a second thickness smaller than the first thickness, and a protruded part having a third thickness larger than the first thickness. The light emitting element is disposed on the second flat part of the reflective resin layer, with a portion of a lateral face of the protruded part of the reflective resin layer being in contact with a portion of a lateral face of the light emitting element.

Abstract: A light emitting device includes: a base having a recess and a flat upper surface; a light emitting element disposed on the upper surface of the base and configured to emit light laterally from an emission end surface; and a reflective member disposed on the upper surface of the base to face the light emitting element with the recess located between part of the reflective member and the light emitting element in a top view, the reflective member having a reflective surface configured to reflect the light upward. At least a portion of the reflective surface overlaps with the recess in the top view. A lower end of the reflective surface is located lower than the upper surface of the base and higher than a bottom surface of the recess in a direction normal to the upper surface of the base.

Abstract: A light-emitting device includes: a heat dissipation member having a mounting surface; a frame body fixed to the heat dissipation member and having an upper surface; a submount supported by the mounting surface and having an upper surface and a lower surface; and a semiconductor laser element supported by the upper surface of the submount. The lower surface of the submount includes a first region bonded to the mounting surface and a second region facing the upper surface of the frame body and not bonded to the upper surface of the frame body.

Abstract: A method of manufacturing a light-emitting device includes: providing a light source including a first substrate and a light-emitting element coupled to the first substrate; and after the providing of the light source, forming one or more positioning holes in the first substrate at locations spaced apart from a light-emitting part of the light source by predetermined distances in a top plan view.

Abstract: A light source device includes: a plurality of light source parts configured to emit light, in which each of the light source parts includes a light-emitting element and a light guiding member, the plurality of light source parts are disposed in a circular, planar-shaped placement region and are arranged in (i) a combination of at least a rectangular grid and a triangular grid or (ii) a concentric circular pattern, and the plurality of light source parts are configured to emit the light in a matrix pattern in an irradiated region.

Abstract: A method of manufacturing a light source device includes: disposing bumps containing a first metal on a first substrate which is thermally conductive; disposing a bonding member on the bumps, the bonding member containing Au—Sn alloy; disposing a light emitting element on the bumps and the bonding member; and heating the first substrate equipped with the bumps, the bonding member, and the light emitting element.