Abstract: A rare earth aluminate sintered compact including rare earth aluminate phosphor crystalline phases and voids, wherein an absolute maximum length of 90% or more by number of rare earth aluminate phosphor crystalline phases is in a range from 0.4 ?m to 1.3 ?m, and an absolute maximum length of 90% or more by number of voids is in a range from 0.1 ?m to 1.2 ?m.

Abstract: A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.

Abstract: A light-emitting device includes a support including a wall portion; a light-emitting element placed on the support and surrounded by the wall portion in a plan view; a first light-transmissive member having a first outer surface and a second outer surface, which is located above the first outer surface and is located inside the first outer surface in the plan view, and covering the light-emitting element and the wall portion; and a light-shielding member covering the first light-transmissive member. The first outer surface and the second outer surface are exposed from the light-shielding member, and a surface roughness of the first outer surface is rougher than a surface roughness of the second outer surface.

Abstract: Provided are a light emitting device capable of reducing glare, a headlight, and a vehicle including the same. The light emitting device comprises: a light emitting element having a light emission peak wavelength in a range of 400 nm or more and 490 nm or less; and a wavelength conversion member including a first fluorescent material having a light emission peak wavelength in a range of 480 nm or more and less than 580 nm and a second fluorescent material having a light emission peak wavelength in a range of 580 nm or more and 680 nm or less and having a composition different from that of the first fluorescent material, wherein the light emitting device emits light having a first luminance ratio Ls/L that is 0.

Abstract: An LED light source includes a board, a holder, an LED, a fastener, a lens, a supporter, and an adhesive. The board has a first surface. The holder is arranged on or above the first surface. The LED is arranged on or above the first surface. The fastener fastens the LED to the first surface. The lens has an exterior shape larger than the LED as viewed in a plan view, and is arranged on or above an LED upper surface to refract LED light so as to direct the light outward. The supporter is arranged on an exterior with respect to the LED as viewed in a plan view on a lens surface facing the first surface. The supporter is held by the holder for positioning of the lens at a predetermined position on the first surface. The adhesive bonds the supporter and the board together.

Abstract: A method for manufacturing a circuit board includes: preparing a first substrate and a second substrate, wherein: the first substrate comprises a convex post member formed at a top surface of the first substrate, and the second substrate including a first surface and a second surface opposite to the first surface, and comprising: a first metal layer formed on at least the first surface, and an opening through which a top surface of the post member is uncovered in a plan view; bonding at least a portion of a top surface of the first substrate excluding the post member and the second surface of the second substrate so that the top surface of the post member is uncovered through the opening; and forming a circuit pattern by removing a first portion of the first metal layer.

Abstract: A light-emitting device includes a light-emitting element and a phosphor that absorbs at least a portion of light from the light-emitting element and emits light. The phosphor includes two or more types of phosphors each having a light emission peak wavelength in a different range. The two or more types of phosphors are selected from the group consisting of a first phosphor having a light emission peak wavelength within a first range of 700 nm to less than 800 nm, a second phosphor having a light emission peak wavelength within a second range of 800 nm to less than 1100 nm, and a third phosphor having a light emission peak wavelength within a third range of 1100 nm to less than 1500 nm.

Abstract: Provided is an electrode active material for a fluoride ion battery. The electrode active material includes a metal composite oxide including: a first metal atom comprising at least one selected from the group consisting of Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Ca, In, and Sb; a second metal atom comprising at least one selected from the group consisting of Mg, Sr, Ba, and Na; a third metal atom comprising at least one selected from the group consisting of Be, Al, Si, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Zr, Nb, Mo, Ru, Rh, Pd, Ag, Sn, Hf, Ta, W, Re, Os, Ir, Pt, and Au; and at least one non-metal atom selected from the group consisting of O, F, N, S, and Cl, the at least one non-metal atom comprising at least an oxygen atom.

Abstract: A light emitting module includes two light emitting devices, each including: a package, a plurality of semiconductor laser elements mounted in the package, and one or more light-reflective members, mounted in the package and reflecting laser light emitted from the plurality of laser elements; and a mounting substrate having a mounting surface on which the two light emitting devices are mounted. The two light emitting devices are mounted on the mounting surface of the mounting substrate with an orientation different from each other by 180 degrees.

Abstract: A method of producing a composite substrate includes: providing a layered body including: a base layer formed of a composite material containing diamond and a metal, the base layer having a first surface, and a second surface opposite to the first surface, and a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and directly bonding an insulating layer to the upper surface of the flat layer.

Abstract: Provided is a light-emitting device, a light fixture, and a street light with a further reduced insect-attracting effect. A light-emitting device includes a light-emitting element having an emission peak wavelength within a range from 400 nm to 490 nm; and a first phosphor having an emission peak wavelength within a range from 570 nm to 680 nm, wherein the light-emitting device has a correlated color temperature of 1950 K or less, an average color rendering index Ra of 51 or greater, and a full width at half maximum of an emission peak having a maximum light emission intensity in an emission spectrum of the light-emitting device of 110 nm or less, and the light-emitting device emits light having an insect-attracting index I of 0.

Abstract: A method of manufacturing a surface light source includes providing an intermediate structure body that includes a composite board including a supporting member and a wiring layer disposed on the supporting member and includes a plurality of light-emitting elements disposed apart from each other on the wiring layer of the composite board, disposing a plurality of covering members apart from each other to cover upper surfaces and lateral surfaces of the light-emitting elements and portions of the composite board around the light-emitting elements, disposing a light-shielding member such that a gap between the covering members is filled, removing the covering members to form a plurality of hole portions, and disposing a light-transmissive member in the hole portions.

Abstract: A method of producing a SmFeN-based rare earth magnet, the method including: dispersing a SmFeN-based anisotropic magnetic powder including Sm, Fe, La, W, R, and N, wherein R is at least one selected from the group consisting of Ti, Ba, and Sr, using a resin-coated metal media or a resin-coated ceramic media to obtain a dispersed SmFeN-based anisotropic magnetic powder; mixing the dispersed SmFeN-based anisotropic magnetic powder with a modifier powder to obtain a powder mixture; compacting the powder mixture in a magnetic field to obtain a magnetic field compact; pressure-sintering the magnetic field compact to obtain a sintered compact; and heat-treating the sintered compact.

Abstract: A light emitting element includes: an n-side semiconductor layer made of a nitride semiconductor; a p-side semiconductor layer made of a nitride semiconductor; and an active layer disposed between the n-side semiconductor and the p-side semiconductor layer and having a multi-quantum well structure in which a plurality of nitride semiconductor well layers and a plurality of nitride semiconductor barrier layers are alternately stacked, wherein the light emitting element includes, between at least one of the plurality of well layers and the barrier layer disposed adjacent thereto on the p-side semiconductor side: a first layer and a second layer disposed successively from the well layer side.

Abstract: A method of producing a SmFeN-based rare earth magnet, the method including: dispersing a SmFeN-based anisotropic magnetic powder comprising Sm, Fe, and N using a resin-coated metal media or a resin-coated ceramic media to obtain a dispersed SmFeN-based anisotropic magnetic powder; mixing the dispersed SmFeN-based anisotropic magnetic powder with a modifier powder to obtain a powder mixture; compacting the powder mixture in a magnetic field to obtain a magnetic field compact; pressure-sintering the magnetic field compact to obtain a sintered compact; and heat treating the sintered compact.

Abstract: A light emitting device includes: a base including: a first lead including: a first A surface, a first B surface opposite to the first A surface, and a first C surface located between the first A surface and the first B surface and defining at least one first protrusion, a second lead separated from the first lead, and a resin body covering the first C surface and holding the first lead and the second lead; a light emitting element disposed on the first A surface; and a protecting member disposed continuously on at least a portion of the first A surface and in at least a portion of a gap between the first protrusion and the resin body. In a cross-sectional view, the first protrusion extends from a first end portion of the first A surface at a second lead side toward the second lead.

Abstract: A light source device includes light sources arranged on a substrate in a matrix, and a reflective member. The reflective member includes first walls respectively surrounding the light sources, and defining first regions, and second walls located on an outer side of the first walls, and defining second regions each having an opening facing outside of the reflective member. The reflective member defines a pair of first sides parallel to one of a vertical direction and a lateral direction in a plan view, the pair of first sides being constituted by a part of the reflective member including at least one of the first walls and the first regions, and a second side inclined or curved with respect to the pair of first sides, the second side being constituted by a part of the reflective member including at least one of the second walls and the second regions.

Abstract: A method of manufacturing a laser light source includes: providing a submount, the submount having a principal surface on which a laser diode chip is to be fixed, and comprising a pair of lens supports each including an end surface, the end surfaces located at opposite sides with respect to an emission end surface of the laser diode chip; providing a lens having a bonding surface; performing adjustment such that end surfaces of the pair of lens supports of the submount are parallel to a reference plane; performing adjustment such that the bonding surface of the lens is parallel to the reference plane; and while maintaining the end surfaces of the pair of lens supports and the bonding surface of the lens so as to be parallel to the reference plane, bonding the end surfaces with the bonding surface of the lens using an inorganic bonding member.

Abstract: A light source unit includes: a display device configured to emit light having a substantially Lambertian light distribution and to display an image, the display device including a plurality of pixels arranged in a matrix configuration in a same plane, wherein pixels among the plurality of pixels located at an outermost perimeter are arranged so that straight lines connecting centers of the pixels located at the outermost perimeter do not form a rectangle; and an imaging optical system including: an input element on which light emitted from the display device is incident, and an output element on which light traveling via the input element is incident, light emitted from the output element forming a first image corresponding to the image. The imaging optical system is substantially telecentric at a first image side.

Abstract: A method of manufacturing a semiconductor element includes: providing a structure including: a semiconductor structure, a resin member, and a first insulation film; forming a cover member disposed continuously on a portion of the first insulation film; forming a resist film on the cover member, and removing a portion of the cover member; removing a portion of the first insulation film and a portion of the resin member; and removing a remaining portion of the cover member.