Abstract: An RF receiver is disclosed. The RF receiver includes an analog-to-digital converter for converting an analog intermediate frequency band signal to a digital intermediate frequency band signal. A plurality of decimation units coupled in cascade for generating a decimated signal based on the digital intermediate frequency band signal are also included. The RF receiver further includes a signal processing unit for processing the decimated signal and a bypass path for feeding a bypass signal to the signal processing unit. The bypass signal is either the digital intermediate frequency band signal or an output signal from one of the decimation units which is not the last one of the cascade coupled decimation units. The signal processing unit is adapted to detect critical reception conditions based on the bypass signal and to adapt the processing of the decimated signal in accordance with detected critical reception conditions.

Abstract: A line-based one-dimensional system and method for video and graphic compression compresses an image data block that contains image data values from one or more neighboring pixels. The system and method involves compressing an image data sample of the image data block using multiple different compression techniques to generate multiple compression results, selecting one of the compression results, and compressing a next image data sample using the multiple different compression techniques and a compression error from the selected one of the compression results.

Abstract: A host controller is suitable for transferring data in transactions, each transaction being described by a transfer descriptor, and the transactions include split transactions. The transfer descriptor for a split transaction includes a bit which may be set to indicate whether the split transaction is a start split or a complete split transaction, and, once a transaction comprising split transactions has been started by a first split transaction, subsequent split transactions are generated automatically until the transaction is complete.

Abstract: In one embodiment, an integrated circuit, and method of manufacturing thereof, is provided. The integrated circuit contains an over-voltage protection element and an over-current protection element. The integrated circuit operates to provide enhanced and efficient ESD functionality. The over-current element of the instant disclosure includes a diffusion protection layer to enhance the lifetime of the over-current element and improve functionality.

Abstract: The present invention relates to an amplifier comprising a plurality of Doherty amplifier cells each Doherty amplifier cell comprising an input and an output respectively connected to an input and an output of the amplifier, a main amplifier stage, a peak amplifier stage and a signal combining circuit configured to combine signals from outputs of the main and peak amplifiers and provide a combined signal to the output of the Doherty amplifier cell. Each cell comprises a controllable splitter having an input (connected to the input of the Doherty amplifier cell. The controllable splitter is configured to receive a splitter control signal and modify an amplitude and phase of a signal at the input of the Doherty amplifier cell in response to the splitter control signal.

Abstract: A sensor senses a magnitude of a physical parameter of the sensor's environment. The sensor has first and second electrodes, and a material layer between them. The material has an electrical property, e.g., capacitance or resistance, whose value depends on the magnitude of the physical parameter. The first electrode is formed in a first layer, and the second electrode is formed in a second layer, different from the first layer. The first layer has a trench and an elevation next to the trench. The trench has a bottom wall and a side wall. The material is positioned on the bottom wall and on the side wall and on top of the elevation. The trench accommodates at least a part of the second electrode. The second electrode leaves exposed the material formed on top of the elevation.

Abstract: Consistent with an example embodiment, there is a semiconductor device, with an active device having a front-side surface and a backside surface; the semiconductor device of an overall thickness, comprises an active device with circuitry defined on the front-side surface, the front-side surface having an area. The back-side of the active device has recesses f a partial depth of the active device thickness and a width of about the partial depth, the recesses surrounding the active device at vertical edges. There is a protective layer of a thickness on to the backside surface of the active device, the protective material having an area greater than the first area and having a stand-off distance. The vertical edges have the protective layer filling the recesses flush with the vertical edges. A stand-off distance of the protective material is a function of the semiconductor device thickness and the tangent of an angle (?) of tooling impact upon a vertical face the semiconductor device.

Abstract: A method of transmitting routing information within a network is disclosed. Accordingly, in response to a change in preferred route from one node to another node within the network, the method includes providing a message comprising a digital word in which at least each node in the mesh network other than the one node and the another node is represented by a single binary bit. The binary bit associated with each node is set to one value if the node is in the preferred route and the other value if the node is not in the preferred route.

Abstract: Consistent with an example embodiment, there is a semiconductor device, having a topside surface and an underside surface, the semiconductor device comprises an active device of an area defined on the topside surface, the topside surface having a first area. A protective material is on to the underside surface of the semiconductor device, the protective material has an area greater than the first area. A laminating film attaches the protective material to the underside surface. The protective material serves to protect the semiconductor device from mechanical damage during handling and assembly onto a product's printed circuit board.

Abstract: A radio frequency communication device has data transmission means and data receiving means. The data transmission means comprise load modulating means being adapted to receive a radio frequency carrier signal emitted by another RF communication device and to modulate the RF carrier signal by means of load modulation in accordance with data to be sent. The data receiving means comprise a RF frequency carrier signal generator being adapted to emit a radio frequency carrier signal and load demodulating means being connected to an emission path of the radio frequency carrier signal and demodulating the radio frequency carrier signal when it has been load modulated by another RF communication device.

Abstract: A circuit is operable in a normal operating mode and a test mode. The circuit contains a privileged information supply circuit (12) coupled to the testable circuit (10). A test access circuit (19) provides access to the testable circuit (10). A test control circuit (18) controls switching of the test access circuit (19) to the test mode. A multiplex circuit (16) couples the privileged information supply circuit (12) to the testable circuit (10) for access to privileged information in the normal mode. In the test mode the shadow information supply circuit (14) is coupled to the testable circuit (10) instead.

Abstract: A functional unit of a device is associated with a secret. Data stored in a memory location of the device is encrypted using the secret. The memory location of the device is accessible to other functional units; but without knowledge of the secret, the stored encrypted data is useless. The sharing of the secret creates a secure path between memory locations and functional units of the device while maintaining a unitary memory architecture. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.

Abstract: A bipolar transistor is fabricated having a collector (52) in a substrate (1) and a base (57, 58) and an emitter (59) formed over the substrate. The base has a stack region (57) which is laterally separated from the emitter (59) by an electrically insulating spacer (71). The insulating spacer (71) has a width dimension at its top end at least as large as the width dimension at its bottom end and forms a ?-shape or an oblique shape. The profile reduces the risk of silicide bridging at the top of the spacer in subsequent processing, while maintaining the width of emitter window.

Abstract: In one embodiment, a communication apparatus is provided. The apparatus includes a near field communication circuit designed to update at least one event field, associated with a number of occurrences of at least one event, which converted from a first data coding format to a second data coding format and provided in an external communication message that is communicated automatically or in response to receiving an access command. Also included in the instant specification are communication systems, and methods of communicating.

Abstract: An integrated circuit and a method of making the same. The integrated circuit includes a semiconductor substrate. The integrated circuit also includes a relative humidity sensor on the substrate. The relative humidity sensor includes a first sensor electrode, a second sensor electrode, and a humidity sensitive layer covering the first and second electrodes. The integrated circuit further includes a thermal conductivity based gas sensor on the substrate. The thermal conductivity based gas sensor has an electrically resistive sensor element located above the humidity sensitive layer.

Abstract: Radio Frequency (RF) amplifier circuits are disclosed which may exhibit improved video/instantaneous bandwidth performance compared to conventional circuits. For example, disclosed RF amplifier circuits may employ a baseband decoupling network connected in parallel with a low-pass RF matching network of the amplifier circuit.

Abstract: A power transistor circuit uses first and second power transistors in differential mode. An inductor arrangement of inductors is formed by wire bonds between the drains. The transistors are in a mirrored configuration, and the inductor arrangement comprises wire bonds which extend between the drain connections across the space between the mirrored transistors.

Abstract: Embodiments of a semiconductor device, a circuit including a semiconductor device and a driver circuit, and a method for operating a semiconductor device are described. In one embodiment, a semiconductor device includes a substrate, a source region, a drain region, and a drain extension region formed in the substrate, and an insulation layer adjacent to the drain extension region. A gate layer and a field plate are formed one of within and on the insulation layer. The field plate is located adjacent to the drain extension region and is electrically insulated from the gate layer and the source region such that a voltage can be applied to the field plate independent from voltages applied to the gate layer and the source region. Other embodiments are also described.

Abstract: The present invention relates to a detection system for detecting movement of a movable object. The detection system comprises a light source (S) for emitting light, a reflecting unit (8) being arranged in functional connection with the movable object (6) and being adapted for reflecting the emitted light, at least one detector (D1 to D4) for detecting the reflected light and outputting detection signals for determining the movement of the movable object, an analogue-to-digital converter which includes at least one current source for obtaining a digital signal, and a common mode controller for outputting at least one common mode signal for controlling the at least one current source, wherein the digital signal which is indicative of the movement of the movable object in a predetermined direction being based on the output signal of the at least one detector and the at least one common mode signal.

Abstract: In a method for manufacturing an electronic device an integrated circuit (1) is arranged between two layers (2, 3) of a substrate, said integrated circuit (1) having at least one contacting surface, a hole (4) is formed in at least one substrate layer (3) above said at least one contacting surface, a conductive structure (5) is formed on a surface of said at least one substrate layer (3) facing away from the integrated circuit (1) and said conductive structure (5) is connected to said contacting surface by means of said hole (4).