Abstract: Described are anionic surfactants which are made by (1) reacting maleic acid, fumaric acid, itaconic acid or mixtures thereof with at least one selected epoxy-capped poly(oxyalkylated) alcohol in the presence of a peroxy-type free radical initiator to form a carboxylic acid group-containing addition product and (2) neutralizing said addition product with a sufficient amount of a neutralizing agent to convert at least a major proportion of said carboxylic acid groups to salt groups. These surfactants exhibit excellent surface activity as well as being highly soluble in caustic solutions.

Abstract: Multi-layer circuitry incorporating electronic elements is disclosed. The circuitry comprises a plurality of layers including a metal or alloy substrate formed with a recess on one surface. An electronic element is positioned within the recess and a second electronic element is positioned on the surface. Also, a first dielectric material layer is disposed on the surface. Further, a first layered conductive circuit pattern overlies the first dielectric material layer so as to provide circuitry over a substantial portion of the substrate. The first circuit pattern is electrically connected to the first electronic element. The first circuit pattern also has a cavity therein for receiving the second electronic element. A second layered conductive pattern overlies at least a portion of the first layered conductive circuit pattern and the second electronic element and is electrically connected to the second electronic element.

Abstract: The present invention is directed to electronic packages. A heat dissipating pad positioned over the electrically active face of an electronic device transfers heat from the device to the electronic package or to an external heat sink. A dielectric electrically isolates the heat dissipating pad from the electronic device.

Abstract: The present invention relates to copper-iron-nickel composite materials having utility in electronic applications because of their low coefficients of expansion and high thermal conductivities. Composite materials in accordance with the present invention consist essentially of about 10% to 80% copper and the balance iron plus nickel with the ratio of iron to nickel being in the range of from about 1.5:1 to about 2.0:1. Preferred composite materials have an iron to nickel ratio in the range of from about 1.6:1 to about 1.9:1.

Abstract: A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive circuit patterns disposed therebetween. A ceramic cover having at least one cavity adapted for receiving a semiconductor die is sealed to the multi-layer circuit device. Electrical leads are connected to the semiconductor device and extend outward from the package for connection to the conductive circuit pattern within the multi-layer circuit.

Abstract: Aqueous pyrithiones and a process and composition for providing reduced discoloration of these pyrithiones using an alkali metal or alkaline earth metal salt of 1-hydroxyethane-1,1-diphosphonic acid.

Abstract: The present direct invention is directed to a sealing glass composite comprising a low melting point sealing glass matrix mixed with a particulate additive to increase the effective coefficient of thermal expansion of the resulting sealing glass composite. The sealing glass matrix is in the lead borate family and the particulate additive is preferably calcium fluoride. For extreme bonding conditions, a small amount of copper oxide is dissolved into the glass matrix.

Abstract: A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.

Abstract: Tetraalkylpiperidinyl substituted uracil derivatives are disclosed which can be represented by the formula ##STR1## wherein each R' is independently an alkyl radical, n is 1 or 2 and R is a substituted or unsubstituted aliphatic radical, cycloaliphatic radical, aromatic radical or aromatic-aliphatic radical.These derivatives are useful as UV light stabilizers in synthetic resins.

Abstract: The present invention relates to an iron-nickel alloy containing from about 30% to about 60% nickel, from about 0.001% to about 0.15% nitrogen, at least one element selected from the group consisting of from about 1% to about 10% molybdenum and from about 0.001% to about 2% aluminum and the balance essentially iron. The alloys demonstrate improved resistance to intermetallic compound formation, improved glass to metal sealing properties, and improved wirebonding performance. The alloys of the present invention have particular utility as a lead frame material for semiconductor packages.

Abstract: A shot charge and wad structure includes a thick-walled plastic shot wad cup having integrally connected base and continuous sidewall portions which together define a shot pocket with an open end for receiving and supporting a charge of shot. The structure also includes a shot pellet charge in the shot pocket composed of tungsten and having a hardness generally at least equal to that of the gun barrel in which a shotshell containing the pellets is to be fired. An insert disk is disposed in the pocket below and in supporting relation to the charge of shot pellets in the pocket. The disk is composed of a material, such as aluminum, having a hardness sufficient to prevent any of the pellets in the charge thereof from embedding therein or in the base portion. Instead, the charge cleanly separates from the pocket of the cup upon firing of a shotshell containing the charge. The shot pocket can be either generally square or circular in cross-section.

Abstract: A package and process of assembling a package adapted for housing an electronic component. The package includes metallic base, lid and leadframe components sealed together with a thermoplastic material. The thermoplastic has an additive consisting essentially of a metal deactivator and a primary antioxidant grafted thereto without cross linking so as to maintain the thermoplastic properties.

Abstract: A process for producing an anhydrous alkali metal hydrosulfite comprises contacting hydrate crystals of an alkali metal hydrosulfite with an alkaline aqueous solution of a dehydrating agent having a pH of at least about 7. The slurry formed is maintained at or above the transition temperature to covert the hydrate crystals to anhydrous crystals of the alkali metal hydrosulfite. The process permits the conversion of hydrate crystals to produce anhydrous crystals of alkali metal hydrosulfite without substantial dissolving or decomposition of the alkali metal hydrosulfite.

Abstract: The present invention relates to composites having excellent combinations of bending strength, electrical conductivity, stress relaxation in bending and bend formability and having particular utility in electrical connector applications. The composites of the present invention have a core formed from a copper base alloy having an electrical conductivity of at least about 80% IACS and a clad formed from a copper-nickel alloy containing more than about 30% by weight nickel. Preferred composites are triclad composites formed from copper alloy C151 and MONEL 400 and having clad layer thicknesses of at least about 10%, most preferably at least about 20%, of the overall composite thickness.

Abstract: A process for making polyurethane polyacetal elastomers useful as binders in the fabrication of high energy explosives or propellants having low vulnerability to unwanted detonation. Also claimed is the elastomer product so produced.

Abstract: A flexible tape having a desired metal foil circuit pattern and a process for manufacturing such a tape. The starting tape comprises a non-metallic flexible substrate having a metal foil layer adhered thereto. The foil layer is patterned to form a desired circuit pattern and a pattern comprising bussing means. The foil is electroplated by connection of the electroplating circuitry to the bussing means. Thereafter, the tape is reduced in width by removing the bussing means and the underlying flexible substrate.

Abstract: This invention pertains to optical and electrical switching devices and to novel polymers containing pendant organic charge transfer moieties and useful in the fabrication of the switching devices.

Abstract: A non-erosive arcjet starting control system and method are provided in combination with an arcjet thruster which includes an anode, a cathode and a gap defined therebetween.

Abstract: A semi-wadcutter bullet useful for target practice includes a lead core partially contained and locked in a metal cup-shaped jacket. The lead core has a cylindrical body, a frusto-conical nose formed integral with the body and extending forwardly therefrom, and a forward-facing annular ledge formed on the body and surrounding a base of the nose. The metal jacket has a cylindrical sidewall with an annular rim portion thereon. The core body is seated within the jacket sidewall with the core nose protruding thereabove. The rim portion of the jacket sidewall is bent into overlying relation with the ledge on the core body so as to lock the jacket on the core body and define a forwardly-facing sharp profile for making clean cut holes in the target paper.

Abstract: The present invention is directed to several embodiments of a hermetically sealed semiconductor package. One embodiment is constructed from a substrate of a first copper alloy, a cover member of a second copper alloy and a lead frame of a third copper alloy. A low melting point sealing glass composite is disposed between the cover member and the substrate for sealing the lead frame therebetween. The third copper alloy is precipitation hardenable and has excellent softening resistance at glass sealing temperatures as compared with other conventionally used alloys. In another embodiment, a clad composite having a core of the third copper alloy and cladding layer of a copper alloy having a low oxidation rate may be advantageously used for the lead frame.