Abstract: A CMOS image sensor comprises an array of pixels. A column of the pixel array is coupled to a readout column. The readout column is couple to a readout circuitry (RC) that reads out image data from the pixel array. The RC comprises a sampling switch which is coupled to a 1-column successive approximation register (SAR) analog-to-digital converter (ADC). The 1-column SAR ADC comprises a differential comparator, a local SAR control, and a digital-to-analog converter (DAC). The sampling switch is coupled between a readout column and a non-inverting input of the differential comparator. An image readout method reads one pixel with two conversions through the RC. The RC is operated by the local SAR control to set the DAC based on comparator output, and upon which a reset digital value is obtained and stored. An overall reduced algorithm calculation is achieved herein.

Abstract: A time-of-flight pixel array comprises multiple pixel cells. The pixel cell comprises a light collection region, a light shielded region, and a deep trench isolation (DTI) structure that encircles the light collection region to prevent light from entering the light shielded region. Photogate in the light collection region is disposed above a photodiode to accumulate the photo-generated electrical charges. A doped region disposed near the photogate collects the attracted charges. The doped region extends to the light shielded region and transfers the collected charges to a floating diffusion through a shutter transistor also in the light shielded region. DTI or similar structures are deployed to the entire pixel array to prevent light from exchanging between different light collection regions and light from entering the light shielded regions of all pixel cells. Interference between the shielded regions of different pixel cells is also minimized.

Abstract: A touch screen display includes a diffuser screen, a projector, a camera, an infrared (IR) light source, and a controller. The diffuser screen has a front surface and a rear surface. The projector is disposed to project images onto the rear surface of said diffuser screen, and the images are visible to a user through the diffuser screen. The camera is disposed behind the diffuser screen and aimed to capture images of a pointer near the front surface of the diffuser screen. The IR light source is disposed to direct IR light toward the rear surface of the diffuser screen, so the rays of incident IR light form an acute angle with respect to the rear surface of the diffuser screen, and so that any of the incident IR light reflected off the rear surface of the diffuser screen does not enter the camera.

Abstract: Packaged photosensor ICs are made by fabricating an integrated circuit (IC) with multiple bondpads; forming vias from IC backside through semiconductor to expose a first layer metal; depositing conductive metal plugs in the vias; depositing interconnect metal; depositing solder-mask dielectric over the interconnect metal and openings therethrough; forming solder bumps on interconnect metal at the openings in the solder-mask dielectric; and bonding the solder bumps to conductors of a package. The photosensor IC has a substrate; multiple metal layers separated by dielectric layers formed on a first surface of the substrate into which transistors are formed; multiple bondpad structures formed of at least a first metal layer of the metal layers; vias with metal plugs formed through a dielectric over a second surface of the semiconductor substrate, interconnect metal on the dielectric forming connection shapes, and shapes of the interconnect layer coupled to each conductive plug and to solder bumps.

Abstract: A method of manufacturing an optical spacer includes dispensing thermal glue within a mold; pressing the thermal glue using an optical spacer substrate to generate an optical spacer including an aperture; and, releasing the mold from the optical spacer. The thermal glue may be cured prior to releasing the mold from the optical spacer.

Abstract: An image sensor pixel array comprises a plurality of image pixel units to gather image information and a plurality of phase detection auto-focus (PDAF) pixel units to gather phase information. Each of the PDAF pixel units includes two of first image sensor pixels covered by a shared micro-lens. Each of the image pixel units includes four of second image sensor pixels adjacent to each other, wherein each of the second image sensor pixels is covered by an individual micro-lens. A coating layer is disposed on the micro-lenses and forms a flattened surface across the whole image sensor pixel array to receive incident light.

Abstract: A camera module has light-field camera(s) and high resolution camera(s), the light-field camera(s) have multiple-lens arrays above an image sensor. The light-field camera(s) have a lens element at a same level as a lens element of the high resolution camera, the lens elements bearing apertures. The multiple-lens array of the light-field camera is above the image sensor at a same level as a flat transparent plate of the high resolution camera. The cameras lens cubes are made simultaneously by bonding molded lens plates and spacer plates, the lens plates and spacer plates including an upper lens plate having upper light-field camera lens elements and upper high resolution camera lens elements with applied apertures, multiple spacer plates, a microlens plate bearing an array of microlenses in the light-field cameras, the microlens plate being flat and transparent in areas of the high resolution camera.

Abstract: A diffractive optical element (DOE) comprises a first part comprising a first transparent non-conductive base and a first transparent conductive layer disposed on the first transparent non-conductive base and a second part comprising a second transparent non-conductive base and a second transparent conductive layer disposed on the second transparent non-conductive base. The first transparent conductive layer and the second transparent conductive layer have periodical patterns of thickness for diffracting light. Spacers separate the first part and the second part. The first part and the second part are positioned such that the first transparent conductive layer is facing the second transparent conductive layer. A first end of the first transparent conductive layer is electrically connected to a first terminal of a capacitance monitor, and a second end of the second transparent conductive layer is electrically connected to a second terminal of the capacitance monitor.

Abstract: A novel liquid crystal on silicon (LCoS) device includes an array of pixel electrodes having a highly reflective material formed thereon. In a particular embodiment, the pixel electrodes are aluminum and have silver pixel mirrors electroplated thereon. In a more particular embodiment, the LCoS device includes auxiliary circuitry facilitating the electroplating of the pixel mirrors.

Abstract: A CMOS image sensor comprises an array of pixels. A column of the pixel array is coupled to a readout column. The readout column is couple to a readout circuitry (RC) that reads out image data from the pixel array. The RC comprises two sampling switches which are coupled to a 2-column successive approximation register (SAR) analog-to-digital converter (ADC). The 2-column SAR ADC comprises a differential comparator, a local SAR control, and two digital-to-analog converters (DACs). The two sampling switches are coupled between two readout columns and two inputs of the differential comparator, respectively. An image readout method reads two pixels with three conversions through the RC. The RC is operated by the local SAR control to set the two DACs based on comparator output, and upon which a reset digital value is obtained and stored. An overall reduced algorithm calculation is achieved herein.

Abstract: An image sensor pixel array comprises a center region and two parallel edge regions, wherein the center region is between the two parallel edge regions. The center region comprises a plurality of image pixels disposed along first sub-array of rows and columns, wherein each of the plurality of image pixels comprises a first micro-lens (ML) formed at an offset position above a first light receiving element as a countermeasure for shortening of exit pupil distance of the image pixel in the center region, and each of the two parallel edge regions comprises a plurality of phase detection auto-focus (PDAF) pixels disposed along second sub-array of rows and columns, wherein each of the plurality of PDAF pixels comprises a second micro-lens (ML) formed at an alignment position above a second light receiving element; and at least one of the PDAF pixels is located at a distance away from center of the edge region to receive incident light along an injection tilt angle.

Abstract: A multiple camera imaging system comprises a first camera image sensor to obtain a first image of a scene and a second camera image sensor to obtain a second image. The system further comprises an image signal processor (ISP) to produce a first roughly-aligned image from the first image and a second roughly-aligned image from the second image. A feature point in the first roughly-aligned image is identified. A center of a search zone is created, which is a combination of the position of the feature point and an associated disparity value from the first and second roughly-aligned images. The search zone is created within the second roughly-aligned image. Candidate feature points are identified within the search zone, which is much smaller than the entire image. A best-matched feature point pair in the first roughly-aligned image and the second roughly-aligned image is then identified.

Abstract: Apparatuses and methods for data transmission in an image sensor are disclosed herein. An example data transmission circuit may include a plurality of transmission banks coupled in series with a first one of the plurality of transmission banks coupled to function logic, where each of the plurality of transmission banks are coupled to provide image data to a subsequent transmission bank in a direction toward the function logic in response to a clock signal, a plurality of delays coupled in series, wherein each of the plurality of delays is associated with and coupled to a respective transmission bank of the plurality of transmission banks, and wherein the clock signal is received by each of the plurality of transmission banks after being delayed by a respective number of delays of the plurality of delays in relation to the function logic.

Abstract: An image sensor module comprises: a substrate having a first side and second side, the first side being an opposite of the second side, an image sensor attached to the first side of the substrate, bonding wires to bond the image sensor to pads on the first side of the substrate, a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads, the protective structure having a dam and a lid, a cover glass disposed on the protective structure, and a set of solder balls attached to the second side of the substrate.

Abstract: An image sensor has an array of pixels configured in multiple blocks; each block coupled to a separate analog-to-digital converter (ADC) to provide digitized image data. The ADCs feed digitized images into an image RAM; and the image RAM feeds digitized images to an alignment buffer in a first pixel order. The alignment buffer provides digitized images to an image processor in a second pixel order different from the first pixel order. In an embodiment, the alignment buffer uses a multiport RAM. In another embodiment, the alignment buffer uses first and second alignment buffer RAMs, writing one alignment buffer RAM while reading the other alignment buffer RAM to provide image data to the image processor. In embodiments, the alignment buffer provides digitized images in an order selectable between a full resolution and a reduced resolution order, and selectable between a right-to-left and left-to-right order.

Abstract: An image sensor includes pixel circuitry with a photodiode to receive light and output a pixel signal. The image sensor also includes readout circuitry with a first sample and hold transistor coupled to the pixel circuitry, and a first capacitor coupled to the first sample and hold transistor to receive the pixel signal. A second sample and hold transistor is coupled to the pixel circuitry, and a second capacitor is coupled to the second sample and hold transistor to receive the pixel signal. A first output switch is coupled to output the pixel signal from the first capacitor, and a second output switch is coupled to output the pixel signal from the second capacitor. A boost transistor is coupled to connect the first output switch and the second output switch when the boost transistor is turned on.

Abstract: A multiple IC, buffered, image sensor has a first IC with pixels, selection transistors, and interconnect coupling selected pixels with first inter-die bond pads that convey image data to a second IC having logic and ADCs. The ADCs having inputs coupled to selected pixels and outputting through-silicon vias and inter-die bond pads to a third IC coupled to buffer raw image data in DRAM. A method includes capturing images with array pixel IC divided into sub-arrays each coupled to a separate, associated, ADC through inter-die bonds, scanning the sub-arrays and converting the image data to digital image data; and transferring the digital image data over inter-die bonds into buffers in DRAM.

Abstract: A ramp generator includes an integrator including a first stage having first and second inputs and first and second outputs, and a second stage including first and second transistors coupled between a power supply rail and ground. A node between the first and second transistors is coupled to the output of the integrator amplifier. A control terminal of the first transistor is coupled to the first output of the first stage, and a control terminal of the second transistor is coupled to the second output of the first stage. A first current flows from the output to ground during a ramp event in the ramp signal generated from the output. Trimming circuitry is coupled to the output of the integrator amplifier to provide a second current to the output of the integrator amplifier in response to trimming inputs. The second current substantially matches the first current.

Abstract: An image sensor includes a pixel array including a plurality of pixels. A bit line is coupled to a column of pixels of the pixel array. The bit line is separated in to a plurality of portions coupled to the column of pixels. The portions of the bit line are electrically isolated from one another. A readout circuit is coupled to a first portion of the bit line coupled to a first portion of rows of pixels from the column of pixels to read image data from the first portion of rows of pixels from the column of pixels. The readout circuit is further coupled to a second portion of the bit line coupled to a second portion of rows of pixels from the column of pixels to read image data from the second portion of rows of pixels from the column of pixels.

Abstract: An image sensor includes a pixel array including a plurality of pixels. Each pixel is coupled to generate image data in response to incident light. A bit line is coupled to a column of pixels of the pixel array and is separated into first and second portions. Each portion is coupled to a corresponding portion of rows of pixels of the pixel array. A readout circuit coupled to the bit line to read out the image data from the pixel array. The readout circuit includes a cascode device coupled between the first and second portions of the bit line. The cascode device is coupled to be biased to electrically separate the first and second portions of the bit line from one another such that a capacitance of each portion of the bit line does not affect a settling time of an other portion of the bit line.