Abstract: An imaging system for imaging a range of field points over on- and off-axis fields includes an image sensor for capturing image data, and first and second optical elements that are spaced apart and cooperate to image light at the image sensor. The first and second optical elements are configured to jointly modify phase of the light transmitted therethrough such that point-spread functions (“PSFs”) corresponding to the range field points are substantially uniform over on- and off-axis fields.

Abstract: A wafer-level lens system includes a first substrate, a first lens having a planar surface in contact with the first substrate and a concave aspheric surface, a second substrate, a second lens having a convex aspheric surface facing the first lens and a planar surface in contact with the second substrate, a third lens having a planar surface in contact with the second substrate and a concave aspheric surface, a third substrate, a fourth lens having a convex aspheric surface facing the third lens and a planar surface in contact with the third substrate, and a fifth lens having a planar surface in contact with the third substrate and a concave aspheric surface.

Abstract: Embodiments of a process including depositing a sacrificial layer on the surface of a substrate over a photosensitive region, over the top surface of a transfer gate, and over at least the sidewall of the transfer gate closest to the photosensitive region, the sacrificial layer having a selected thickness. A layer of photoresist is deposited over the sacrificial layer, which is patterned and etched to expose the surface of the substrate over the photosensitive region and at least part of the transfer gate top surface, leaving a sacrificial spacer on the sidewall of the transfer gate closest to the photosensitive region. The substrate is plasma doped to form a pinning layer between the photosensitive region and the surface of the substrate. The spacing between the pinning layer and the sidewall of the transfer gate substantially corresponds to a thickness of the sacrificial spacer. Other embodiments are disclosed and claimed.

Abstract: An apparatus includes an image sensor with a frontside and a backside. The image sensor includes an active circuit region and bonding pads. The active circuit region has a first shape that is substantially rectangular. The substantially rectangular first shape has first chamfered corners. A perimeter of the frontside of the image sensor has a second shape that is substantially rectangular. The second substantially rectangular shape has second chamfered corners. The bonding pads are disposed on the frontside of the image sensor. The bonding pads are disposed between the first chamfered corners and the second chamfered corners. The first shape is disposed inside the second shape.

Abstract: An image projector includes a light source for displaying light and a diffusing screen coupled to an in-plane vibrator. The diffusing screen is positioned to receive the display light from the light source and generate phase-modulated display light. The image projector also includes a collimating element positioned to receive the phase-modulated display light. The image projector further includes a display panel positioned to receive the phase-modulated display light after being collimated by the collimating element. The display panel is configured to generate a projectable image using the phase-modulated display light.

Abstract: Embodiments of the invention relate to a camera assembly including a rear-facing camera and a front-facing camera operatively coupled together (e.g., bonded, stacked on a common substrate). In some embodiments of the invention, a system having an array of frontside illuminated (FSI) imaging pixels is bonded to a system having an array of backside illuminated (BSI) imaging pixels, creating a camera assembly with a minimal size (e.g., a reduced thickness compared to prior art solutions). An FSI image sensor wafer may be used as a handle wafer for a BSI image sensor wafer when it is thinned, thereby decreasing the thickness of the overall camera module. According to other embodiments of the invention, two package dies, one a BSI image sensor, the other an FSI image sensor, are stacked on a common substrate such as a printed circuit board, and are operatively coupled together via redistribution layers.

Abstract: A near-eye display system includes (a) a near-eye display device, having a display and capable of providing, to a pupil of a user, an image from the display superimposed on an ambient scene, and (b) a fixture for coupling the near-eye display device to a holder mounted to the user, wherein the fixture has a plurality of degrees of freedom for alignment of the display device with respect to the pupil.

Abstract: A near-eye display device includes (a) a display unit having a liquid-crystal-on-silicon (LCOS) display and a first polarizing beam splitter interface for (i) reflecting illumination light from an illumination module towards the liquid-crystal-on-silicon display and (ii) transmitting display light from the LCOS display based on the illumination light, and (b) a viewing unit having an imaging objective that forms an image of the LCOS display for the pupil based on the display light, and a second polarizing beam splitter interface for (i) reflecting reflected display light from the imaging objective towards the pupil and (ii) transmitting ambient light from an ambient scene towards a pupil, the second polarizing beam splitter interface and the first polarizing beam splitter interface being orthogonal to a common plane.

Abstract: A system for attaching a device to a glasses frame includes a spring clip that applies pressure to two sides of the glasses frame, and a magnet for attaching the device thereto. The device may attach directly to the magnet, or via a slide-on attachment piece. The spring clip may include a spring arm having distal ends that assist the spring clip in applying pressure to the glasses frames.

Abstract: A system and method for determining and correcting for imaging device motion during an exposure is provided. According to various embodiments of the present invention, multiple sets of image pixels are defined on an image sensor, where each set of pixels is at least partially contained in the output image area of the image sensor. Signals from each set of image pixels are read out once or more during an exposure, motion estimates are computed using signal readouts from one or more sets of image pixels, and signal readouts from one or more sets of the image pixels are processed to form the final output image.

Abstract: Embodiments of the invention describe an enclosure for an image capture system that includes an image capture unit and a solid state die to provide focusing capabilities for a lens unit of the image capture unit. The enclosure may electrically couple the solid state die to the image capture unit and/or other system circuitry. The enclosure may further serve as EMI shielding for the image capture system.

Abstract: An example image sensor system includes an image sensor having a first terminal and a host controller coupled to the first terminal. Logic is included in the image sensor system, that when executed transfers analog image data from the image sensor to the host controller through the first terminal of the image sensor and also transfers one or more digital control signals between the image sensor and the host controller through the same first terminal.

Abstract: A wafer-level lens system includes a first substrate, a first lens having a planar surface in contact with the first substrate and a concave aspheric surface, a second substrate, a second lens having a convex aspheric surface facing the first lens and a planar surface in contact with the second substrate, a third lens having a planar surface in contact with the second substrate and a concave aspheric surface, a third substrate, a fourth lens having a convex aspheric surface facing the third lens and a planar surface in contact with the third substrate, and a fifth lens having a planar surface in contact with the third substrate and a concave aspheric surface.

Abstract: A method for testing an electronic memory while the memory is in use includes: (a) detecting an access to the electronic memory at a test address, (b) saving, in a register subsystem, write data written to the electronic memory at a location corresponding to the test address, (c) comparing the write data to data read from the electronic memory at the location corresponding to the test address to determine whether the memory has a fault, and (d) generating an error signal if the memory has a fault.

Abstract: A membrane and lens assembly includes a flexible membrane mounted with a supporting structure, such as a plurality of spacers, a frame, a ring, a plate or a surface plate. At least one first lens mounts with a first side of the membrane. At least one actuator varies a characteristic of the membrane, such as membrane shape, position or tautness, to reposition the lens. In a related method of lens replication, a flexible membrane is attached to a ring and stretched with the ring. Lenses are replicated on one or both sides of the stretched membrane.

Abstract: An example image sensor includes a plurality of pixels arranged in an array of columns and rows, a row driver, and a control logic circuit. The row driver is coupled to pixels in a row of the array to provide a variable driving voltage to drive transistors included in the pixels of the row. The control logic circuit is coupled to provide one or more control logic signals to the row driver. The row driver adjusts a magnitude of the driving voltage in response to the one or more control logic signals.

Abstract: A step-up converter includes an input coupled to receive a first voltage potential and an output coupled to output a second voltage potential higher than the first voltage potential. The step-up converter also includes an array of capacitance charge pumps. Each of the capacitance charge pumps in the array includes switches to be modulated to individually run each of the capacitance charge pumps by selectively connecting each of the capacitance charge pumps to the input and the output. The step-up converter further includes a control module coupled to the switches of each of the capacitance charge pumps and configured to modulate the switches at a substantially fixed frequency. The control module modulates the switches of selected capacitance charge pumps in the array in response to a current draw on the output. The step-up converter may be included in an image sensor.

Abstract: Embodiments of the invention describe providing image focusing capabilities for a lens unit of an image capture system by disposing a solid state die over the lens unit. The solid state die may include a plurality of electrodes to receive a voltage or electric signal to generate an electric field. The refractive index of the solid state die will change in response to the generated electric field to focus the image or scene captured by the lens unit. The solid state die is mounted to a folded flexible printed circuit board in a housing or a molded housing having electrodes on its inner wall.

Abstract: An imaging system for generating flexibly oriented electronic images includes an image sensor having a square pixel array, imaging optics for forming an optical image on at least a portion of the square pixel array, wherein the portion is within an image circle of the imaging optics and includes at least two rectangular sub-portions differing from each other in aspect ratio and/or orientation, and a processing module capable of generating an electronic image from each of the at least two rectangular sub-portions. An imaging method for generating electronic images of flexible orientation, using a square image sensor pixel array, includes forming an optical image on at least a portion of the square image sensor pixel array, selecting, according to a desired orientation, a rectangular sub-portion of the at least a portion of the square image sensor pixel array, and generating a final electronic image from the sub-portion.

Abstract: Embodiments of an image sensor including a pixel array with a plurality of pixels arranged into rows and columns. Control circuitry coupled to the pixels in each row, and an analog-to-digital converter is coupled to the pixels in each column of the pixel array. Each analog-to-digital converter includes a ramp comparator, and a variable current source coupled to the ramp comparator to provide a variable bias current to the ramp comparator. The bias current can adjusted during reading of a row of pixels according to a dynamic bias current profile that maintains at least a specified margin between the random noise of the pixels and an acceptable noise level. Other embodiments are disclosed and claimed.