Patents Assigned to OmniVision Technologies
  • Patent number: 9030584
    Abstract: A process including forming an a backside-illuminated (BSI) image sensor in a substrate, the image sensor including a pixel array formed in or near a front surface of the substrate and one or more circuit blocks formed in the substrate near the pixel array, each circuit block including at least one support circuit. An interconnect layer is formed on the front surface of the substrate that includes a dielectric within which are embedded traces and vias, wherein the traces and vias electrically couple the pixel array to at least one of the one or more support circuits. An isolation trench is formed surrounding at least one of the one or more circuit blocks to isolate the pixel array and other circuit blocks from noise generated by the at least one support circuit within the circuit block surrounded by the isolation trench. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: May 12, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventor: Tiejun Dai
  • Publication number: 20150123172
    Abstract: An image sensor pixel for use in a high dynamic range image sensor includes a first photodiode, a plurality of photodiodes, a shared floating diffusion region, a first transfer gate, and a second transfer gate. The first photodiode is disposed in a semiconductor material. The first photodiode has a first light exposure area and a first doping concentration. The plurality of photodiodes is also disposed in the semiconductor material. Each photodiode in the plurality of photodiodes has the first light exposure area and the first doping concentration. The first transfer gate is coupled to transfer first image charge from the first photodiode to the shared floating diffusion region. The second transfer gate is coupled to transfer distributed image charge from each photodiode in the plurality of photodiodes to the shared floating diffusion region.
    Type: Application
    Filed: November 1, 2013
    Publication date: May 7, 2015
    Applicant: OmniVision Technologies, Inc.
    Inventors: Gang Chen, Duli Mao, Dajiang Yang, Zhibin Xiong, Dyson H. Tai
  • Patent number: 9024964
    Abstract: A novel method for driving a display device includes the steps of receiving video data of a first type, converting the video data to data of a second type, dithering the data of the second type to form dithered pixel data, and outputting the dithered pixel data. The step of converting the video data to data of a second type includes inserting dither bits indicative of a particular dithering scheme into the data of the second type. An example display driver circuit includes an input for receiving video data, a data converter coupled to receive the video data and operative to convert the video data into pixel data to be written to pixels of a display, and a ditherer operative to receive the pixel data and to dither the pixel data to generate dithered pixel data. The video data is data of a first type, and the pixel data is data of a second type, different from the first type. In the disclosed example, the first type of data includes a binary data word, and the second type of data includes a compound data word.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: May 5, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventor: Sunny Yat-san Ng
  • Publication number: 20150116562
    Abstract: An apparatus includes an image sensor partitioned into N image sensor regions. The image sensor is attached to a circuit board. A lens array having including N lenses is disposed proximate to the image sensor. Each one of the N lenses is arranged to focus a single image onto a respective one of the N image sensor regions. A spacer structure is stacked between to the lens array and the circuit board to separate the lens array from the image sensor, wherein the spacer structure surrounds a perimeter around all of the N image sensor regions and N lenses such that none of the spacer structure is disposed between any of the N lenses and N image sensor regions of the image sensor.
    Type: Application
    Filed: October 28, 2013
    Publication date: April 30, 2015
    Applicant: Omnivision Technologies, Inc.
    Inventors: Tsung-Wei Wan, Wei-Ping Chen, Jui-Yi Chiu
  • Publication number: 20150108507
    Abstract: A backside illuminated image sensor includes a semiconductor layer having a back-side surface and a front-side surface. The semiconductor layer includes a pixel array region including a plurality of photodiodes configured to receive image light through the back-side surface of the semiconductor layer. The semiconductor layer also includes a peripheral circuit region including peripheral circuit elements for operating the plurality of photodiodes that borders the pixel array region. The peripheral circuit elements emit photons. The peripheral circuit region also includes a doped semiconductor region positioned to absorb the photons emitted by the peripheral circuit elements to prevent the plurality of photodiodes from receiving the photons.
    Type: Application
    Filed: October 17, 2013
    Publication date: April 23, 2015
    Applicant: OmniVision Technologies, Inc.
    Inventors: Qingfei Chen, Qingwei Shan, Yin Qian, Dyson H. Tai
  • Patent number: 9013797
    Abstract: A lens, such as a lens for use in a wafer-level camera, is made by forming a polymeric material with at least one master to form a pre-final lens. The pre-final lens forms a majority of a final volume of the lens. The pre-final lens is allowed to harden, during which it may sag or shrink. An aliquot of polymeric material is added to the lens and formed with the same master with a spacer, or with a second master, to form a first surface layer that provides correction between the pre-final lens shape and a final desired lens shape. In an embodiment, the surface layer has similar or identical index of refraction to the pre-final lens. In an embodiment the lens is formed on a substrate. In an embodiment, a send master, or master pair, are used to form a lens having upper and lower curvature, with a second aliquot of polymeric material forming a second surface layer on a surface of the lens opposite to the first surface layer.
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: April 21, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventors: Dennis J. Gallagher, Regis S. Fan
  • Patent number: 9013973
    Abstract: The present invention discloses a carrier frequency acquisition method and apparatus in which the structure of a transmission frame includes a short training sequence, the method including: delaying a received short training sequence by L sampling points and multiplying the delayed short training sequence with the original short training sequence to obtain a new sequence; delaying the new sequence by D sampling points and conjugate multiplying the delayed new sequence with the original new sequence; accumulating the results of the conjugate multiplication; and evaluating a phase from the result of the accumulation to estimate carrier frequency offset. With the above method, the present invention is capable of greatly improving the acquisition range of carrier frequency offset while requiring a simple set of hardware.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: April 21, 2015
    Assignee: Omnivision Technologies (Shanghai) Co. Ltd.
    Inventor: Yun Zhang
  • Patent number: 9007504
    Abstract: Circuitry to reduce signal noise characteristics in an image sensor. In an embodiment, a bit trace line segment is located between neighboring respective segments of a source follower power trace and an additional trace which is to remain at a first voltage level during a pixel cell readout time period. In another embodiment, for each such trace segment, a smallest separation between the trace segment and the respective neighboring other one of such trace segments is substantially equal to or less than some maximum length to provide for parasitic capacitance between the bit line trace and one or more other traces.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: April 14, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventors: Sohei Manabe, Jeong-Ho Lyu
  • Patent number: 9000500
    Abstract: An image sensor includes an array of pixels, with at least one pixel including a photodetector formed in a substrate layer and a transfer gate disposed adjacent to the photodetector. The substrate layer further includes multiple charge-to-voltage conversion regions. A single photodetector can transfer collected charge to a single charge-to-voltage conversion region, or alternatively multiple photodetectors can transfer collected charge to a common charge-to-voltage conversion region shared by the photodetectors. An implant region formed when dopants are implanted into the substrate layer to form source/drain implant regions is disposed in only a portion of each transfer gate while each charge-to-voltage conversion region is substantially devoid of the implant region.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: April 7, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventors: Hung Q. Doan, Eric G. Stevens
  • Patent number: 9002122
    Abstract: A codec includes an encoder having a quantization level generator that defines a quantization level specific to a block of values (e.g., transform coefficients), a quantizer that quantizes the block of transform coefficients according to the block-specific quantization level, a run-length encoder, and an entropy encoder. The quantization level is defined to result in at least a predetermined number (k) of quantized coefficients having a predetermined value. The amount of data compression by the encoder is proportional to (k). The codec also includes a decoder having entropy and run-length decoding sections whose throughputs are proportional to (k). The decoder takes advantage of this increased throughput by further decoding coefficients in parallel using a plurality of decoding channels. Methods for encoding and decoding data are also disclosed. The invention is well-suited to quantization, entropy, and/or run-length-based codecs, such as JPEG.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: April 7, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventor: Xuanming Du
  • Patent number: 8994832
    Abstract: An apparatus includes analog-to-digital (A/D) conversion circuitry coupled to a pixel array. The A/D conversion circuitry includes a voltage ramp generator and a set of column A/D conversion circuits. The voltage ramp generator generates a single slope voltage ramp in a first state and a multiple slope voltage ramp in a second state. The set of column A/D conversion circuits is coupled with the voltage ramp generator. The apparatus further includes calibration circuitry coupled with the set of column A/D conversion circuits and operable to determine digital calibration data to adjust digital image data. The calibration circuitry provides analog calibration data that spans a calibration range to the set of column A/D conversion circuits instead of the analog image data from the pixel array being provided to the set of column A/D conversion circuits.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: March 31, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventors: Zheng Yang, Guangbin Zhang, Yuanbao Gu
  • Patent number: 8987841
    Abstract: A CMOS (Complementary Metal Oxide Semiconductor) pixel for sensing at least one selected from a biological, chemical, ionic, electrical, mechanical and magnetic stimulus. The CMOS pixel includes a substrate including a backside, a source coupled with the substrate to generate a background current, and a detection element electrically coupled to measure the background current. The stimulus, which is to be provided to the backside, affects a measurable change in the background current.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: March 24, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventors: Manoj Bikumandla, Dominic Massetti
  • Patent number: 8988558
    Abstract: Image overlay in a mobile device is described. In one embodiment an imaging system of a mobile communications device includes a first camera having a control interface to a controller and a data interface to the controller, a second camera having a data interface to the first camera, and a processor to combine an image from the second camera received through the second camera data interface with an image from the first camera and to send the combined image to the controller through the data interface.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: March 24, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventors: Sheaufoong Chong, Xiaodong Luo
  • Patent number: 8988566
    Abstract: An apparatus includes an image sensor including N image sensor regions arranged thereon. N lens structures are included in a lens array disposed proximate to the image sensor. Each one of the N lens structures is arranged to focus a single image onto a respective one of the N image sensor regions. The N lens structures include a first lens structure having a red color filter, a second lens structure having a green color filter, and a third lens structure having a blue color filter. Each one of the N lens structures includes a glass wafer and a lens formed on the glass wafer. Each one of the red color filter, the green color filter, and the blue color filter is one of coated on the glass wafer underneath the lens and coated over the lens on the glass wafer.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: March 24, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventors: Chia-Ching Wang, Jau-Jan Deng, Yun-Chiang Hsu
  • Publication number: 20150076330
    Abstract: A CMOS photodiode device for use in a dual-sensitivity imaging pixel contains at least two areas of differential doping. Transistors are provided in electrical contact with these areas to govern operation of signals emanating from the photodiode on two channels, each associated with a different sensitivity to light. A plurality of such photodiodes may be incorporate into a shared arrangement forming a single pixel, in order to enhance the signals.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 19, 2015
    Applicant: OmniVision Technologies, Inc.
    Inventors: Jeong-Ho Lyu, Sohei Manabe
  • Publication number: 20150076322
    Abstract: A photosensor has a masking layer having an opening over a central photodiode and a first adjacent photodiode, the first adjacent photodiode covered by the masking layer and located sufficiently near the central photodiode that at least some light admitted through the opening over the central photodiode reaches the first adjacent photodiode through the central photodiode. The photosensor also has a second adjacent photodiode; the second adjacent photodiode covered by the masking layer and located sufficiently near the first adjacent photodiode that at least some light admitted through the opening over the central photodiode is capable of reaching the second adjacent photodiode through the first adjacent photodiode. Circuitry is provided for reading the photodiodes and generating a blue, a green, and a red channel signal by processing signals read from the photodiodes.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 19, 2015
    Applicant: OmniVision Technologies, Inc.
    Inventor: Chin-Poh Pang
  • Publication number: 20150077856
    Abstract: An optical mold including a spacer cavity portion, a lens cavity portion and a flow stop control portion for allowing optical lens material to flow between the spacer cavity portion and the lens cavity portion and an optical lens array formed therefrom. The optical mold may further include a pedestal located within the spacer cavity portion for supporting the mold during a puddle dispensing process. A method for using the optical mold including the spacer cavity portion, the lens cavity portion, and the flow cavity portion, and optionally the pedestal.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 19, 2015
    Applicant: OmniVision Technologies, Inc.
    Inventors: Huiyan Neo, Regis Sh-Louen Fan, Chia-Yang Chang
  • Patent number: 8981512
    Abstract: A pixel array includes a plurality of photodiodes disposed in a semiconductor layer and arranged in the pixel array. A color filter layer is disposed proximate to the semiconductor layer. Light is to be directed to at least a first one of the plurality of photodiodes through the color filter layer. An optical shield layer is disposed proximate to the color filter layer. The color filter layer is disposed between the optical shield layer and the semiconductor layer. The optical shield layer shields at least a second one of the plurality of photodiodes from the light.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: March 17, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventors: Gang Chen, Jin Li, Duli Mao, Dyson H. Tai
  • Patent number: 8982238
    Abstract: An example method of multi-target automatic exposure and gain control based on pixel intensity distribution includes capturing a series of digital images with an image sensor. As the series of digital images are captured, exposure time and/or gain are adjusted to adjust a mean intensity value of the digital images until a target mean intensity value is reached. The method includes dynamically selecting the target mean intensity value from a plurality of target mean intensity values based on a relative number of pixels, in each captured digital image, that have an intensity value that falls outside a range of intensity values.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: March 17, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventors: Chengming Liu, Jizhang Shan, Donghui Wu
  • Patent number: 8982269
    Abstract: A mechanical assembly for fine focus of a wafer-level camera module includes a threaded lens acceptor for mounting with a wafer-level compatible image sensor and a complimentary threaded lens base for mounting with a wafer-level lens stack. In a method of forming a wafer-level camera with a mechanical fine focus assembly, the lens base and the lens acceptor rotationally couple to join the lens stack with the sensor, and to adjust z-height of the camera module to achieve optimal focus. The camera module is secured at the optimal focus position.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: March 17, 2015
    Assignee: OmniVision Technologies, Inc.
    Inventor: Kirk Tecu