Patents Assigned to OmniVision Technologies
  • Systems and methods for resuming capture of a base image of an object by a mobile scanner
    Patent number: 8705145
    Abstract: Systems and methods resume capture of a base image from an object by a mobile scanner operated by a user. An indication of an overlap area on a base image displayed within a computer display is received. A scan image is received from the mobile scanner positioned on the object at a location corresponding to the overlap area. A match between a segment of the scan image and a corresponding segment of the base image is determined, where the match defines a location and orientation of the mobile scanner relative to the base image. An indication that the scan has resumed is made to the user when the match is found, and images that are subsequently received from the mobile scanner are stitched to the base image based upon the determined location and orientation. The partially formed base image and the scanner image are concurrently displayed to the user.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: April 22, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventors: Jizhang Shan, Weihua Xiong, Zhipeng Deng
  • Signal demodulation method
    Patent number: 8699629
    Abstract: A signal demodulation method is disclosed, which includes: obtaining a complete transmission code word; calculating estimated values of three non-differential phases of the transmission code based on a majority logic; identifying a most unreliable phase among three non-differential phases and determining the other two reliable phases to obtain their determination values; calculating determination values of the rest two phases based on the two determined phases; and looking up in tables based on determination values of the four phases to obtain incoming bits. The demodulation method of the present invention is capable of sufficiently reducing the effect of noise on signal and effectively improving the signal demodulation performance.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: April 15, 2014
    Assignee: Omnivision Technologies (Shanghai) Co., Ltd.
    Inventor: Yun Zhang
  • Random estimation analog-to-digital converter
    Patent number: 8698666
    Abstract: A random estimation analog-to-digital converter for converting a first analog signal into a digital signal includes a random bit generator, a digital-to-analog converter, a summer, an M-bit analog-to-digital converter, and a digital combiner. The random bit generator generates random least significant bits (LSBs) and the digital-to-analog converter then converts the random LSBs into a second analog signal. The summer subtracts the second analog signal from the first analog signal in the analog domain. The M-bit analog-to-digital converter then converts the modified first analog signal into the most significant bits (MSBs) of the digital image signal. The digital combiner combines the random LSBs with the MSBs in the digital domain to generate the digital signal. In one example, the random LSBs are extra bits that are beyond the maximum resolution of the M-bit analog-to-digital converter.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: April 15, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventors: Guangbin Zhang, Jiangtao Kuang
  • Ground contact structure for a low dark current CMOS pixel cell
    Patent number: 8686477
    Abstract: Pixel array structures to provide a ground contact for a CMOS pixel cell. In an embodiment, an active area of a pixel cell includes a photodiode disposed in a first portion of an active area, where a second portion of the active area extends from a side of the first portion. The second portion includes a doped region to provide a ground contact for the active area. In another embodiment, the pixel cell includes a transistor to transfer the charge from the photodiode, where a gate of the transistor is adjacent to the second portion and overlaps the side of the first portion.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: April 1, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventors: Sohei Manabe, Jeong-Ho Lyu
  • Double-sided image sensor formed on a single semiconductor wafer die
    Patent number: 8686342
    Abstract: An example double-sided image sensor includes a semiconductor die, a photodetector, a charge-to-voltage converter, and support circuitry. The semiconductor die has a first side and a second side that is opposite the first side. The photodetector is disposed within the semiconductor die on the first side for accumulating an image charge in response to light incident on the first side. The charge-to-voltage converter is disposed within the semiconductor die on the first side. The transfer gate is also disposed on the first side of the semiconductor die between the photodetector and the charge-to-voltage converter to transfer the image charge from the photodetector to the charge-to-voltage converter. Support circuitry of the image sensor is disposed within the semiconductor die on the second side and is electrically coupled to the charge-to-voltage converter.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: April 1, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventors: Xiao Ying Hong, Dominic Massetti
  • Optical device with electrically variable extended depth of field
    Patent number: 8687040
    Abstract: A system and method for providing an optical device with a variable extended depth-of-field (EDOF). The optical device includes an optically transparent liquid crystal layer, an optically transparent phase mask, optically aligned with the liquid crystal layer and separated therefrom by an optically transparent substrate, an optically transparent index-matching layer, disposed adjacent to one surface of the phase mask, and having a refractive index substantially matching that of the phase mask; and a pair of electrodes for generating an electric field acting on said liquid crystal layer to change the depth of field of the imaging system in proportion to the amplitude of a signal applied to the electrodes.
    Type: Grant
    Filed: November 1, 2010
    Date of Patent: April 1, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventor: Paulo E. X. Silveira
  • Circuit configuration and method for time of flight sensor
    Patent number: 8686367
    Abstract: An apparatus includes a photodiode, a first and second storage transistor, a first and second transfer transistor, and a first and second output transistor. The first transfer transistor selectively transfers a first portion of the image charge from the photodiode to the first storage transistor for storing over multiple accumulation periods. The first output transistor selectively transfers a first sum of the first portion of the image charge to a readout node. The second transfer transistor selectively transfers a second portion of the image charge from the photodiode to the second storage transistor for storing over the multiple accumulation periods. The second output transistor selectively transfers a second sum of the second portion of the image charge to the readout node.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: April 1, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventor: Ashish A. Shah
  • Backside stimulated sensor with background current manipulation
    Patent number: 8680630
    Abstract: A CMOS (Complementary Metal Oxide Semiconductor) pixel for sensing at least one selected from a biological, chemical, ionic, electrical, mechanical and magnetic stimulus. The CMOS pixel includes a substrate including a backside, a source coupled with the substrate to generate a background current, and a detection element electrically coupled to measure the background current. The stimulus, which is to be provided to the backside, affects a measurable change in the background current.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: March 25, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventor: Manoj Bikumandla
  • Backside-illuminated (BSI) pixel including light guide
    Patent number: 8680454
    Abstract: Implementations of a pixel including a substrate having a front side, a back side, and a photosensitive region formed on or near the front side, a dielectric layer formed on the front side, and a metal stack having a bottom side and a top side, the bottom side being on the dielectric layer. A light guide is formed in the dielectric layer and the metal stack and extending from the front side of the substrate to the top side of the metal stack, the light guide having a refractive index equal to or greater than the refractive index of the substrate. Other implementations are disclosed and claimed.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: March 25, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventor: Manoj Bikumandla
  • Systems and Methods for Controlling Lighting Strength of a Camera System by Time-Matched Intermittent Illumination
    Publication number: 20140078278
    Abstract: A camera system with lighting strength control includes: an image sensor for capturing images of a scene; a light source for illumination of the scene; and a signal generator, in communication with the image sensor and the light source, for generation of (a) a first signal for controlling image capture by the image sensor and (b) a second signal for controlling a duty cycle of the light source. A method for controlling the lighting strength of a camera system, which includes an image sensor, an associated light source, and an associated signal generator, includes: (a) generating, using the signal generator, a first signal that controls image capture by the image sensor, and (b) generating, using the signal generator, a second signal that controls a duty cycle of the light source.
    Type: Application
    Filed: September 5, 2013
    Publication date: March 20, 2014
    Applicant: OmniVision Technologies, Inc.
    Inventor: Junzhao Lei
  • IMAGE BASED SYSTEMS FOR DETECTING INFORMATION ON MOVING OBJECTS
    Publication number: 20140078314
    Abstract: Systems and methods for generating images of an object having a known object velocity include imaging electromagnetic radiation from the object onto a sensor array of an imaging system, adjusting at least one of a shutter rate and a shutter direction of the imaging system in accordance with an image velocity of the image across the sensor array, and sampling output of the sensor array in accordance with the shutter rate and the shutter direction to generate the images. Systems and methods for generating images of an object moving through a scene include a first imaging system generating image data samples of the scene, a post processing system that analyzes the samples to determine when the object is present in the scene, and one or more second imaging systems triggered by the post processing system to generate one or more second image data samples of the object.
    Type: Application
    Filed: November 25, 2013
    Publication date: March 20, 2014
    Applicant: OmniVision Technologies, Inc.
    Inventors: Edward R. Dowski, Jr., Kenneth S. Kubala, Hans Brandon Wach
  • Image sensor with dual element color filter array and three channel color output
    Patent number: 8670052
    Abstract: A color image sensor includes a pixel array including a CFA overlaying an array of photo-sensors for acquiring a color image. The CFA includes first color filter elements of a first color overlaying a first group of the photo-sensors, second color filter elements of a second color overlaying a second group of the photo-sensors, and a plurality of filter stacks overlaying a third group of the photo-sensors. The first group generates first color signals of a first color channel and the second group generates second color signals of a second color channel. Each of the filter stacks includes a first stacked filter of the first color and a second stacked filter of the second color. A sensitivity of the filter stacks equals a product of sensitivities of the first and the second stacked filters and the filter stacks generate a third color channel.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: March 11, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventors: Hsin-Chih Tai, Yin Qian, Duli Mao, Vincent Venezia
  • Reinforcement structure for wafer-level camera module
    Patent number: 8665364
    Abstract: An example reinforcement structure for protecting a wafer-level camera module includes a top sheet element and a side sheet element. The top sheet element is to be disposed over a top surface of the camera module and includes a first opening for allowing light to pass through to the camera module. The side sheet element is coupled to the top sheet element for securing the reinforcement structure to a printed circuit board (PCB). A second opening in the side sheet element is included to allow an adhesive to be dispensed through the second opening to adhere the reinforcement structure to the camera module.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: March 4, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventors: Wei-Feng Lin, Wen-Jen Ho, Chi-Kuei Lee, Chen-Wei Tsai
  • DEVICE AND METHOD FOR REDUCING SPECKLE IN PROJECTED IMAGES
    Publication number: 20140055755
    Abstract: An image projector includes a light source for displaying light and a diffusing screen coupled to an in-plane vibrator. The diffusing screen is positioned to receive the display light from the light source and generate phase-modulated display light. The image projector also includes a collimating element positioned to receive the phase-modulated display light. The image projector further includes a display panel positioned to receive the phase-modulated display light after being collimated by the collimating element. The display panel is configured to generate a projectable image using the phase-modulated display light.
    Type: Application
    Filed: August 23, 2012
    Publication date: February 27, 2014
    Applicant: OmniVision Technologies, Inc.
    Inventor: Chun-Sheng Fan
  • Pausing column readout in image sensors
    Patent number: 8659694
    Abstract: An image sensor includes a two-dimensional array of pixels having multiple column outputs and an output circuit connected to each column output. Each output circuit is configured to operate concurrent sample and read operations. An analog front end (AFE) circuit processes pixel data output from the output circuits and an AFE clock controller transmits an AFE clocking signal to the AFE circuit to effect processing of the pixel data. A timing generator outputs a column address sequence that is received by a column decoder. During one or more sample operations the timing generator suspends the column address sequence and subsequently during the one or more sample operations the AFE clock controller suspends the AFE clocking signal. The AFE clocking signal and the column address sequence resume at the end of the one or more sample operations.
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: February 25, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventors: John T. Compton, Jeffrey S. Gerstenberger, Ravi Mruthyunjaya
  • Trench transfer gate for increased pixel fill factor
    Patent number: 8658956
    Abstract: An image sensor provides high scalability and reduced image lag. The sensor includes a first imaging pixel that has a first photodiode region formed in a substrate of the image sensor. The sensor also includes a first vertical transfer transistor coupled to the first photodiode region. The first vertical transfer transistor can be used to establish an active channel. The active channel typically extends along the length of the first vertical transfer transistor and couples the first photodiode region to a floating diffusion.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: February 25, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventors: Vincent Venezia, Hsin-Chih Tai, Duli Mao, Howard E. Rhodes
  • BACKSIDE ILLUMINATED CMOS IMAGE SENSOR
    Publication number: 20140048898
    Abstract: A backside illuminated (BSI) CMOS image sensor is disclosed. The BSI CMOS image sensor includes: a substrate having a front side and a back side, the substrate including a photodiode formed therein, the photodiode being proximate the back side of the substrate; a metal shielding layer covering the back side of the substrate, the metal shielding layer including an opening formed therein, the opening being arranged in correspondence with the photodiode; and a light-absorbing layer formed on each side face of the opening. The light-absorbing layer coated on the side faces of the opening prevents the occurrence of photon cross-talk and hence improves imaging quality of the BSI CMOS image sensor.
    Type: Application
    Filed: July 18, 2013
    Publication date: February 20, 2014
    Applicant: OmniVision Technologies (Shanghai) Co., Ltd.
    Inventors: Xiaoai Fei, Jing Ye
  • CMOS pixel including a transfer gate overlapping the photosensitive region
    Patent number: 8653436
    Abstract: A pinned photodiode structure with peninsula-shaped transfer gate which decrease the occurrence of a potential barrier between the photodiode and the floating drain, prevents loss of full well capacity (FWC) and decreases occurrences of image lag.
    Type: Grant
    Filed: December 17, 2009
    Date of Patent: February 18, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventor: Hisanori Ihara
  • Missing code redistribution in pipeline analog to digital converter
    Patent number: 8648913
    Abstract: A stage of pipeline analog to digital converter (ADC) includes a multiplying digital to analog converter (MDAC) and a sub-analog to digital converter (sub-ADC). The sub-ADC includes a comparator and a random offset controller. The comparator is coupled to compare a first analog signal received by the stage with a reference signal. The random offset controller is coupled to the comparator to apply a random offset to an input of the comparator to randomly distribute errors by the sub-ADC in a digital output of the pipeline ADC.
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: February 11, 2014
    Assignee: OmniVision Technologies, Inc.
    Inventors: Liping Deng, Tie Jun Dai, Bi Yuan, Chien-Chen Chen
  • PAD DESIGN FOR CIRCUIT UNDER PAD IN SEMICONDUCTOR DEVICES
    Publication number: 20140035089
    Abstract: Embodiments of a semiconductor device that includes a semiconductor substrate and a cavity disposed in the semiconductor substrate that extends at least from a first side of the semiconductor substrate to a second side of the semiconductor substrate. The semiconductor device also includes an insulation layer disposed over the first side of the semiconductor substrate and coating sidewalls of the cavity. A conductive layer including a bonding pad is disposed over the insulation layer. The conductive layer extends into the cavity and connects to a metal stack disposed below the second side of the semiconductor substrate. A through silicon via pad is disposed below the second side of the semiconductor substrate and connected to the metal stack. The through silicon via pad is position to accept a through silicon via.
    Type: Application
    Filed: October 14, 2013
    Publication date: February 6, 2014
    Applicant: OmniVision Technologies, Inc.
    Inventors: Yin Qian, Dyson H. Tai, Keh-Chiang Ku, Vincent Venezia, Duli Mao, Wei Zheng, Howard E. Rhodes