Abstract: An improved method of forming conductive features and a semiconductor device formed by the same are disclosed. In an embodiment, a method includes forming a metal line extending through a first dielectric layer, the metal line being electrically coupled to a transistor; selectively depositing a sacrificial material over the metal line; selectively depositing a first dielectric material over the first dielectric layer and adjacent to the sacrificial material; selectively depositing a second dielectric material over the first dielectric material; removing the sacrificial material to form a first recess exposing the metal line; and forming a metal via in the first recess and electrically coupled to the metal line.

Abstract: An imaging apparatus includes: an image sensor that captures a subject image to generate image data; a depth measurer that acquires depth information indicating a depth to a subject in an image indicated by the image data; a detector that acquires subject detection information on a region where the subject is located in the image; and a recognizer that recognizes a subject region having a shape along the subject in the image, based on the depth information and the subject detection information.

Abstract: The present disclosure describes a method that includes forming a fin protruding from a substrate, the fin including a first sidewall and a second sidewall formed opposite to the first sidewall. The method also includes depositing a shallow-trench isolation (STI) material on the substrate. Depositing the STI material includes depositing a first portion of the STI material in contact with the first sidewall and depositing a second portion of the STI material in contact with the second sidewall. The method also includes performing a first etching process on the STI material to etch the first portion of the STI material at a first etching rate and the second portion of the STI material at a second etching rate greater than the first etching rate. The method also includes performing a second etching process on the STI material to etch the first portion of the STI material at a third etching rate and the second portion of the STI material at a fourth etching rate less than the third etching rate.

Abstract: A distance measurement method is provided. The distance measurement method includes obtaining an image of a target device, the image of the target device including a target object of a first color and a background object of a second color, the first color being different from the second color; processing the image of the target device to obtain a processed image, the processed image including a processed target object of a third color and a processed background object of a fourth color; detecting a contour of the processed target object of the third color; calculating an area encircled by the contour; and calculating a distance between a camera and the target device upon determination of the area encircled by the contour.

Abstract: A semiconductor device includes a substrate and two fins protruding from the substrate. Each fin includes two source/drain (S/D) regions and a channel region. Each fin includes a top surface that remains flat across the S/D regions and the channel region. The semiconductor device also includes a gate stack engaging each fin at the respective channel region, a first dielectric layer on sidewalls of the gate stack, a first epitaxial layer over top and sidewall surfaces of the S/D regions of the two fins, and a second epitaxial layer over top and sidewall surfaces of the first epitaxial layer.

Abstract: In an image processing method, a detection image and a marked image are obtained. An image segmentation model is applied to segment a first segmented image from the detection image. The first segmented image is corrected according to the marked image to obtain a second segmented image. A size of the second segmented image is adjusted to obtain an adjusted segmented image. The adjusted segmented image is used as a standard segmented image of the detection image. The method improves accuracy of image segmentation and recognition.

Abstract: A semiconductor device may include a substrate, which includes a logic cell region including first and second active regions and a test region including dummy regions, first and second active patterns provided on the first and second active regions, respectively, a dummy pattern provided on each of the dummy regions, a device isolation layer disposed in trenches defining each of the dummy pattern and the first and second active patterns, a contact pattern provided on the dummy pattern, a gate electrode provided to cross the dummy regions, a gate contact coupled to the gate electrode, and a metal layer on the gate contact. The metal layer may include two test lines provided on the test region and respectively coupled to the contact pattern and the gate contact. A top surface of the first active pattern may be lower than a top surface of the dummy pattern.

Abstract: A method is used to automatically generate a picture-text description file containing text(s) and picture(s), including: acquiring a text material related to a target object; acquiring, according to information of the target object, a plurality of picture materials related to the target object; extracting first feature information of the picture materials and second feature information of the text material; determining, according to the first feature information and the second feature information, one or more picture materials that are matched with the text material; and combining the text material with one or more matching picture materials to generate the picture-text description file of the target object. The method improves matching between texts and the corresponding pictures.

Abstract: A semiconductor package includes a package substrate, an interposer provided on the package substrate, a plurality of semiconductor devices on the interposer to be spaced apart from each other, the semiconductor devices being electrically connected to the package substrate through the interposer, and a molding layer on the interposer covering the semiconductor devices and exposing upper surfaces of the semiconductor devices, the molding layer including at least one groove extending in one direction between the semiconductor devices, the groove having a predetermined depth from an upper surface of the molding layer.

Abstract: The present disclosure provides a vehicle control method, an apparatus, an electronic device and a vehicle, which relates to a technical field of artificial intelligence, such as automatic driving, intelligent transportation and computer vision, etc. The specific implementation solution is that: when passing a traffic light intersection, a vehicle can acquire a traffic light image of the intersection at a driving direction of the vehicle, identify the traffic light image, determine a first light color of a target traffic light corresponding to a lane on which the vehicle is located; and acquire light color change information of the target traffic light latest recorded; determine remained duration of the first light color according to the light color change information, then determine a driving strategy at the intersection of the vehicle according to the first light color and the remained duration of the first light color.

Abstract: Disclosed is a method and apparatus with deep learning operations. A deep learning apparatus includes a processor, configured to support a plurality of different operation modes, including a systolic array having a plurality of multiplier accumulator (MAC) units, and a control circuit configured to respectively control, for each the plurality of different operation modes, select operations of the plurality of MAC units and data movements among the plurality of MAC units.

Abstract: A display panel and a display device are provided, the display panel has a first surface on a surface of the display panel, and includes a driving circuit layer, a light source array, an image sensor array, and a black matrix layer. The light source array includes a plurality of light sources, the image sensor array includes a plurality of image sensors, the black matrix layer includes first light-transmitting openings and second light-transmitting openings. The driving circuit layer includes light-transmitting portions, and each of the first light-transmitting openings is arranged corresponding to at least one of the light-transmitting portions, and a plane size of the first light-transmitting opening in a direction parallel to the surface of the display panel is smaller than a plane size of the light-transmitting portion in the direction parallel to the surface of the display panel.

Abstract: An inference computing apparatus comprises at least one processor and a memory with program instructions stored therein, the program instructions can be executed by the at least one processor to cause the inference computing apparatus to perform the following operations: receiving a first inference model from a model training apparatus, the first inference model being obtained through a model training by the model training apparatus based on a first training sample library, the first training sample library comprising training samples from historical data generated in a manufacturing stage; performing an inference computing on data to be processed generated in the manufacturing stage based on the first inference model to obtain the inference result which is sent to a user-side device; and evaluating performance of the first inference model to determine whether the first inference model needs to be updated, and if yes, updating the first inference model.

Abstract: According to one embodiment, a memory module includes: a memory die including a dynamic random access memory (DRAM) banks, each including: an array of DRAM cells arranged in pages; a row buffer to store values of one of the pages; an input/output (IO) module; and an in-memory compute (IMC) module including: an arithmetic logic unit (ALU) to receive operands from the row buffer or the IO module and to compute an output based on the operands and one of a plurality of ALU operations; and a result register to store the output of the ALU; and a controller to: receive, from a host processor, operands and an instruction; determine, based on the instruction, a data layout; supply the operands to the DRAM banks in accordance with the data layout; and control an IMC module to perform one of the ALU operations on the operands in accordance with the instruction.

Abstract: Methods and devices are provided for performing federated learning. A global model is distributed from a server to a plurality of client devices. At each of the plurality of client devices: model inversion is performed on the global model to generate synthetic data; the global model is on an augmented dataset of collected data and the synthetic data to generate a respective client model; and the respective client model is transmitted to the server. At the server: client models are received from the plurality of client devices, where each client model is received from a respective client device of the plurality of client devices; model inversion is performed on each client model to generate a synthetic dataset; the client models are averaged to generate an averaged model; and the averaged model is trained using the synthetic dataset to generate an updated model.

Abstract: Systems and methods for checking program code are disclosed. The method includes executing a first check of the program code, and making a first determination about the first check. Metadata is stored based on making the first determination. A second check of the program code is run based on the metadata, and a result of the second check is stored in memory. The program code is executed based on the second check. In some embodiments, the method for checking program code includes running a simulation of a check of the program code by a processing device; storing a result of the simulation in memory; executing the check of the program code outside of the simulation; making a determination about the check outside of the simulation; retrieving a result stored in the memory based on the determination; and executing the program code based on the check.

Abstract: Disclosed is an image analysis apparatus for analyzing a camera image. The image analysis apparatus for analyzing a camera image segments an input fisheye camera image into segmented images with a preset size field of view and superimposes the segmented images so that some regions overlap, performs dewarping on each of the segmented images, then combines the segmented images on which the dewarping is performed using a preset combination method, generates an analysis image, and detects objects included in the analysis image. In this case, the image analysis apparatus removes a result recognized as a duplicate from a detection result of the object by post-processing.

Abstract: A method for the automatic scheduling of tasks obtains data processing tasks and data sources. A job queue is formed based on the data processing tasks. The job tasks are extracted in order from the job queue. Computing resources are distributed based on the extracted job tasks. A result of the data processing task is obtained by the pre-trained model based on the data source. An electronic device and a computer readable storage medium applying the method are also provided.

Abstract: A method for welding a workpiece with a vision guided welding platform. The welding platform comprises a welding tool, and a camera for guiding the movement of the welding tool from a start point to an end point. The method includes the steps of adjusting a focal length of the camera such that a focal plane of the camera is located on a surface of the workpiece and obtaining a surface image of the workpiece. The method further includes the steps of determining a current focal length of the camera, determining a corrected pixel length of a pixel in the surface image and determining the number of pixels between the start point and the end point of each movement of the welding tool. Using the corrected pixel length, a distance between the start and end points is determined and the welding tool is guided to move therebetween.

Abstract: The invention relates to an apparatus for second offloads in a graphics processing unit (GPU). The apparatus includes an engine; and a compute unit (CU). The CU is arranged operably to: fetch execution codes; when each execution code is suitable to be executed by the CU, execute the execution code; and when each execution code is not suitable to be executed by the CU, generate a corresponding entry, and send a request with the corresponding entry to the engine for instructing the engine to allow a component inside or outside of the GPU to complete an operation in accordance with the corresponding entry.