Abstract: A system and method for verifying defects in electrical circuit patterns including supplying a plurality of like electrical circuit patterns to a defect verification assembly after identification of candidate defects at an automated inspection assembly; verifying selected candidate defects as being one of: an actual defect, other than an actual defect; and marking a candidate defect in response to a recurrence of a given candidate defect at substantially corresponding locations on at least two electrical circuit patterns.

Abstract: A method for aligning an image to be recorded by a direct image scanner on an upper layer of a printed circuit board with an image recorded on a lower layer thereof, the method comprising: visually imaging a portion of the image on the lower layer; and recording a pattern on the upper layer, referenced to coordinates of the visual image of the portion.

Abstract: This invention discloses an electrical circuit inspection system including an optical subsystem for optically inspecting an electrical circuit and providing an inspection output identifying more than two different types of regions and an analysis subsystem for analyzing the inspection output, the analyzing including comparing the inspection output with a computer file reference identifying more than two different types of regions. A method for inspecting an electrical circuit inspection is also disclosed.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A system for unveiling embedded targets in printed circuit board substrates includes a micro-machining device, a sensor, and a controller. The micro-machining device removes portions of an opaque layer overlaying an alignment target in a general region in which the target should be located, and the sensor senses whether the alignment target is located at selected locations where portions of the opaque layer have been removed. In response to sensing the presence or absence of an alignment target at the selected locations, the controller directs the micro-machining device to remove additional portions of the opaque layer.

Abstract: Illuminator apparatus for illuminating a workpiece during visual testing thereof, the illuminator comprising: a source of illumination that illuminates a portion of the workpiece with on-axis illumination centered at a first angular direction and having a first intensity and with off-axis illumination having a second intensity; and an optical viewing system, that views said portion of the workpiece and accepts light reflected from the workpiece over a range of angular directions, centered at a second angular direction, said range of angular directions defining said on-axis illumination, wherein said first intensity and second intensity art separately adjustable and wherein the first angular direction is different from the second angular direction.

Abstract: An illumination system including at least one reflector subtending an angle with respect to a location on a surface of an article, and first and second light sources, the first and second light sources each providing a light output, the light outputs from both of the first and second light sources being directed to impinge on the location on the surface of an article within the angle, at least one of the light outputs being reflected by the reflector.

Abstract: Apparatus for electrical testing of electrical circuits includes an array of probes arranged for selective engagement with portions of electrical circuits to be tested, testing circuitry associated with the array of probes for sensing electrical characteristics of the electrical circuits engaged by the array of probes, and control circuitry associated with the array of probes for causing engagement between selected ones of the array of probes with selected ones of the portions of electrical circuits to be tested. The array of probes includes at least two static probe assemblies arranged in a fixed array, and the static probe assemblies include a selectively positionable probe element and a probe element positioner. The apparatus is employed to test electrical circuits during fabrication.

Abstract: A laser micromachining system improve the utilization of laser energy by using multiple spectral components or time-altered pulses.

Abstract: An illumination system including at least one reflector subtending an angle with respect to a location on a surface of an article, and first and second light sources, the first and second light sources each providing a light output, the light outputs from both of the first and second light sources being directed to impinge on the location on the surface of an article within the angle, at least one of the light outputs being reflected by the reflector.

Abstract: An illumination system including at least one reflector subtending an angle with respect to a location on a surface of an article, and first and second light sources, the first and second light sources each providing a light output, the light outputs from both of the first and second light sources being directed to impinge on the location on the surface of an article within the angle, at least one of the light outputs being reflected by the reflector.

Abstract: Surface dimension and footprint dimension values are determined by scanning a printed circuit board with a laser. Exposed substrate parts of the printed circuit board fluoresce significantly, emitting detectable luminance, while conductors do not. Conductors reflect the laser light much more strongly than the exposed substrate, especially at the substantially flat part of the top surface. Luminescence and reflectivity collectors provide signals indicative of the footprint and surface dimensions. This cross-sectional information is used in making adjustment determinations in the manufacturing process, and also decisions relating to repair or discard operations.

Abstract: Apparatus for electrical testing of electrical circuits includes an array of probes arranged for selective engagement with portions of electrical circuits to be tested, testing circuitry associated with the array of probes for sensing electrical characteristics of the electrical circuits engaged by the array of probes, and control circuitry associated with the array of probes for causing engagement between selected ones of the array of probes with selected ones of the portions of electrical circuits to be tested. The array of probes includes at least two static probe assemblies arranged in a fixed array, and the static probe assemblies include a selectively positionable probe element and a probe element positioner. The apparatus is employed to test electrical circuits during fabrication.

Abstract: A binary map of an object having edges is produced by first producing a digital grey scale image of the object with a given resolution, and processing the grey scale image to produce a binary map of the object at a resolution greater than said given resolution. Processing of the grey scale image includes the step of convolving the 2-dimensional digital grey scale image with a filter function related to the second derivative of a Gaussian function forming a 2-dimensional convolved image having signed values. The location of an edge in the object is achieved by finding zero crossings between adjacent oppositely signed values. Preferably, the zero crossings are achieved by an interpolation process that produces a binary bit map of the object at a resolution greater than the resolution of the grey scale image.