Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: Some embodiments include methods, and systems of machining using a beam of photons. In some embodiments, a machining method to remove material in a machined region may include reducing transparency of the region to at least a predefined wavelength by irradiating the region with a first beam of photons to induce generation of free electrons in the region; and machining the region with a second beam of photons having the predefined wavelength. Other embodiments are described and claimed.

Abstract: A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.

Abstract: A system and method for illuminating an elongated field of view of a linear or high aspect ratio area image sensor comprises providing illumination with an elongated field shape with a plurality of discrete light sources and projecting the illumination toward an object to be imaged; wherein the illumination projected on the object is substantially spatially invariant in intensity and angular distribution along the elongated field shape on the object.

Abstract: A new architecture for machine vision system that uses area sensor (or line sensor), with telecentric imaging optics compound with telecentric illumination module is described. The illumination module may include a bright field illumination source and/or a dark field illumination source. The telecentric imaging optics includes an upper imaging module having an aperture stop and a lower imaging module positioned between the upper imaging module and object, such that the light source and the aperture stop are located in the back focal plane of the lower imaging module. The lower imaging module images the illumination source into a plane of an aperture stop of the upper imaging module. The optical axis of the upper imaging module is offset with respect to the lower imaging module. The optical axis of the telecentric illumination module is offset with respect to the axis of the lower imaging module in the opposite direction.

Abstract: A method for laser drilling of holes in a substrate (44) with varying simultaneity including operating a laser (22) to produce a single output beam (24) whose pulses have a total energy, dividing the single output beam into plural beams (41) to an extent which varies over time and applying the plural beams to plural hole drilling locations (209, 210, 212, 214, 216, 218, 220, 222) on the substrate including simultaneously drilling first parts of multiple holes using corresponding ones of the plural beams having a pulse energy which is a first fraction of the total energy and thereafter drilling at least one second part of at least one of the multiple holes using at least one of the plural beams each having a pulse energy which is at least a second fraction of the total energy, the second fraction being different from the first fraction.

Abstract: An optical system including a plurality of selectably directable mirrors (38) each arranged to direct a laser beam (41) to a selectable location within a field, a plurality of mirror orientation sensors (45) operative to sense the orientation of the plurality of selectably directable mirrors and to provide mirror orientation outputs and an automatic calibration subsystem (47) for automatically calibrating the plurality of selectably directable mirrors, the automatic calibration subsystem including a target (40) being operative to provide an optically visible indication of impingement of a laser beam thereon; the target being rewritable and having optically visible fiducial markings (54, 56), a target positioner (42) for selectably positioning the target, an optical sensor (44) operative to view the target following impingement of the laser beam thereon and to provide laser beam impingement outputs and a correlator (36) operative to provide a calibration output.

Abstract: A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.

Abstract: An apparatus and method for automatically inspecting and repairing printed circuit boards includes an inspection functionality automatically inspecting printed circuit boards and providing a machine readable indication of regions thereon requiring repair. An automatic repair functionality employs the machine readable indication to repair the printed circuit boards at some of the regions thereon requiring repair. An automatic repair reformulation functionality automatically reinspects the printed circuit boards following an initial automatic repair operation, and provides to the automatic repair functionality a reformulated machine readable indication of regions thereon requiring repair.

Abstract: A method of exposing a pattern on a light sensitive surface comprises forming a spatially modulated light beam including a rectangular matrix pattern of rows and columns of image data over a surface, wherein the spatially modulated light beam is operable to expose contiguous sub-exposure areas of the surface, each sub-exposure area associated with a datum of the image data, aligning one of the rows or columns of the spatially modulated light beam with a scan direction and the other one of the rows and columns of the spatially modulated light beam with a cross-scan direction for exposing the surface, shearing at least one portion of the modulated light beam with respect to a second portion of the modulated light beam in a cross scan direction by an amount less than a center to center distance between two sub-exposure areas in a cross scan direction, exposing the surface in the scan direction with the sheared spatially modulated light beam, and overlapping exposed sub-areas in the cross scan direction as a resu

Abstract: An apparatus and method for automatically inspecting and repairing printed circuit boards includes an inspection functionality automatically inspecting printed circuit boards and providing a machine readable indication of regions thereon requiring repair. An automatic repair functionality employs the machine readable indication to repair the printed circuit boards at some of the regions thereon requiring repair. An automatic repair reformulation functionality automatically reinspects the printed circuit boards following an initial automatic repair operation, and provides to the automatic repair functionality a reformulated machine readable indication of regions thereon requiring repair.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A method for scanning a surface with a number of different illumination configurations, the method comprises capturing a plurality of images in a sequential manner during a single sweep, each image including one or more lines of pixels, sequentially altering an illumination configuration used to capture the plurality of images according to a predefined sequence of illumination configurations and shifts of the relative position of the imaging unit for capturing each of the plurality of images, and repeating the sequence of illumination configurations settings and associated image capture positions until a desired area of the surface is scanned, wherein said predefined shift is between 10 pixels and less then one pixel.

Abstract: An inspection system includes a CMOS integrated circuit having integrally formed thereon an at least two dimensional array of photosensors and providing an inspection output representing an object to be inspected. A defect analyzer is operative to receive the inspection output and to provide a defect report.

Abstract: A method of scanning a pattern on a surface, the method comprises forming a first spatially modulated light beam including a pattern for writing on a surface; splitting the first spatially modulated light beam into a plurality of sub-beams; altering a spatial relationship between the plurality of sub-beams, thereby forming a second spatially modulated light beam; and canning the surface with the second spatially modulated light beam.

Abstract: A method of exposing a pattern on a light sensitive surface comprises forming a spatially modulated light beam including a rectangular matrix pattern of rows and columns of image data over a surface, wherein the spatially modulated light beam is operable to expose contiguous sub-exposure areas of the surface, each sub-exposure area associated with a datum of the image data, aligning one of the rows or columns of the spatially modulated light beam with a scan direction and the other one of the rows and columns of the spatially modulated light beam with a cross-scan direction for exposing the surface, shearing at least one portion of the modulated light beam with respect to a second portion of the modulated light beam in a cross scan direction by an amount less than a center to center distance between two sub-exposure areas in a cross scan direction, exposing the surface in the scan direction with the sheared spatially modulated light beam, and overlapping exposed sub-areas in the cross scan direction as a resu

Abstract: Apparatus for optical inspection includes an illumination assembly, including multiple parallel rows of light sources for emitting light and illumination optics associated with each row for directing the light onto an object under inspection. The multiple parallel rows include at least a first row with first illumination optics including a first array of prisms that are configured to reflect the light emitted by the light sources in the first row, and at least a second row with second illumination optics including a second array of prisms that are configured to refract the light emitted by the light sources in the second row. An imaging assembly is configured to capture an image of the object under illumination by the multiple parallel rows of the light sources.

Abstract: A system and method of repairing electrical circuits including employing a laser and at least one laser beam delivery pathway for laser pre-treatment of at least one conductor repair area of a conductor formed on a circuit substrate and employing the laser and at least part of the at least one laser beam delivery pathway for application of at least one laser beam to a donor substrate in a manner which causes at least one portion of the donor substrate to be detached therefrom and to be transferred to at least one predetermined conductor location.

Abstract: A method of controlling the illumination angle onto a target, including, illuminating onto the target with light from at least two light sources of pre-selected wavelengths; wherein each point on the target is illuminated by light from the light sources with a respective maximal illumination angle relative to a main illumination axis extending from substantially the center of the at least two light sources to the target, selecting a dichroic filter that transmits light from the at least two light sources as a function of the angle of incidence upon the filter, positioning the dichroic filter between the at least two light sources and the target to limit the transfer of light to light of the pre-selected wavelengths; and wherein the dichroic filter is selected to limit the maximal illumination angle illuminating each point on the target.

Abstract: A method for imaging a body, including scanning the body so as to generate a tomographic image thereof, and analyzing the tomographic image to determine a location of a region of interest (ROI) (38) within the body. The method includes providing single photon counting detector modules (40), each of the modules being configured to receive photons from a respective direction and to generate a signal in response thereto. The method further includes coupling each of the modules to a respective adjustable mount (54), adjusting each of the adjustable mounts so that the direction of the module coupled thereto is aligned with respect to the location so as to receive radiation from the ROI, operating each of the modules to receive the photons from the ROI, and, in response to the signal generated by each of the modules, generating a single photon counting image of the ROI.