Abstract: A multi string controller with independent current setting for each string is designed for solid state lighting applications. This controller can regulate multiple channels of LEDs. Each string may have a different forward voltage and current setting. A constant buck regulator is also integrated inside this controller to regulate the total current, which is fed into the LED output channels. The circuit also contains a feedback loop in order to precisely control the current passing through each string and is immune to transient conditions.

Abstract: A system and method for resolving the angle of the transmitter and the angle of the receiver when determining vehicle position using light based communication (LBC) signals. Each vehicle includes an LBC system having light emitting diodes (LEDs) and receiver photodiodes capable of sending and receiving pulsed light binary messages. Each LBC system has a controller coupled to the transmitter diodes and receiver diodes. The controller includes a processor configured to resolve the angle of the transmitter and the angle of the receiver. The angle of the receiver may be determined using a single digital message received at a first receiver and a second receiver on a receiving vehicle. The angle of the transmitter may be determined using a first digital message and a second digital message received at a same receiver on the receiving vehicle.

Abstract: Various embodiments may relate to an illuminating device including a lens unit, a housing part and a lighting assembly. The lighting assembly is arranged in a cavity defined by the lens unit and the housing part. The lens unit includes a plurality of micro lens structures, a plurality of locating structures are arranged between the plurality of micro lens structures on one side of the lens unit facing to the lighting assembly, and the locating structures at least partially pass through the lighting assembly to positionally fixed the lighting assembly in relation to the lens unit. Various embodiments may further relate to a method for manufacturing the illuminating device.

Abstract: An illuminating device includes a pump radiation source for emitting pump radiation as a beam bundle, a phosphor element for converting the pump radiation into conversion light, and a lens system between the pump radiation source and the phosphor element, which is penetrated by the pump beam bundle, wherein the lens system has a focus and the phosphor element is arranged at the focus, and wherein furthermore a lens of the lens system has a scattering means which scattering means the pump beam bundle penetrates and is widened at the same time, so that the pump beam bundle is incident on the phosphor element in a manner widened around a focus point.

Abstract: Methods for producing wavelength converters are described. The methods include sintering a mixture consisting essentially of first particles and second particles to form a sintered article. In embodiments the first particles consist essentially of particles of ?-SiAlON or precursors thereof, and the second particles consist essentially one or more sintering aids or precursors thereof. In embodiments the sintered article has a density that is greater than or equal to about 90% of a theoretical bulk density of the mixture, and is configured to convert primary light incident thereon to secondary light, wherein the secondary light exhibits a peak with a full width half maximum of greater than 0 to about 60 nanometers (nm) within a wavelength range of about 495 nm to about 600 nm.

Abstract: The individual configuration of beacons in lighting systems is to be simplified. Therefore, a lighting system with a lighting device and a beacon arranged in or at the lighting device is provided. The lighting system comprises a sensor device for acquiring an environmental parameter relating to an environment of the lighting system. Moreover, the beacon is formed to automatically configure itself based on the environmental parameter.

Abstract: A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.

Abstract: An optoelectronic assembly comprising an optoelectronic component, which comprises a specularly reflective surface and comprising a radiation cooler in direct physical contact with the optoelectronic component. The radiation cooler is arranged above the specularly reflective surface.

Abstract: According to the present disclosure, a method for operating an illumination apparatus is provided. The method has at least two light-emitting devices, which are arranged next to one another separated by a gap and each have a multiplicity of light-emitting elements, by individually driving all light-emitting elements of each light-emitting device, measuring a gap width of the gap and/or a luminance in the gap, and controlling or regulating in each case a luminance of one or more of the light-emitting elements which are arranged directly at the gap in dependence on the gap width and/or on the luminance in the gap.

Abstract: A semiconductor device includes a semiconductor chip including an active region provided to generate radiation; a radiation exit face extending parallel to a main plane of extension of the active region; a molding directly adjoins at least one side face of the semiconductor device at least one back of the semiconductor chip remote from the radiation exit face; a mounting surface provided to mount the semiconductor device; and a spacer projecting beyond the radiation exit face in a vertical direction extending perpendicular to the radiation exit face.

Abstract: Various embodiments disclosed herein include a method for determining the position of a computing device. The method may include obtaining, by the computing device, an image of a subset of luminaries from a plurality of luminaires located in an indoor environment, in which each subset grouping of luminaires in the plurality of luminaires is uniquely identifiable. The computing device may then compare the subset of luminaires to a database storing each uniquely identifiable subset grouping of luminaires in the plurality of luminaires, in which the database includes position information for each luminaire in the plurality of luminaires, and determine the position of the computing device based on the comparison of the subset of luminaries to the database.

Abstract: An optoelectronic semiconductor chip includes an active region arranged between a first semiconductor layer and a second semiconductor layer and generates or receives electromagnetic radiation, the first semiconductor layer electrically conductively connects to a first contact, the first contact is formed on a front side of the chip next to the active region, the second semiconductor layer electrically conductively connects to a second contact, the second contact is arranged on the front side of the chip next to the active region, and an electrically insulating separating layer that electrically insulates a rear side of the chip from the active region of the semiconductor chip, and an electrically insulating separating layer includes at least one first separating layer having at least one atomic layer or at least one molecular layer and is deposited by atomic layer deposition or molecular layer deposition.

Abstract: A method of processing a lead frame having at least one electrically conductive contact section includes forming a depression in the at least one electrically conductive contact section so that a first electrically conductive contact subsection and a second electrically conductive contact subsection are formed, which are delimited from one another by the depression, and forming a housing made of a housing material, which housing includes a housing frame that at least partially embeds the lead frame, formation of the housing including introduction of housing material into the depression so that a housing frame section formed by the housing material introduced into the depression is formed between the first and second electrically conductive contact subsections to mechanically stabilize the first and second electrical conductive contact subsections by the housing frame section.

Abstract: A method for manufacturing an opto-electronic component (100) is given, comprising a provision of a carrier (1) with at least one mounting surface (11), a generation of at least two vias (4) in the carrier (1) with electrically conducting contacts (12, 13) running through the vias (4), a provision of at least one light-emitting semiconductor chip (2), wherein the semiconductor chip (2) comprises a growth substrate (10) and a layer sequence (7) epitaxially grown thereon, a mounting of the at least one semiconductor chip (2) onto the at least one mounting surface (11) of the carrier (1), wherein the semiconductor chip (2) is connected in an electrically conducting manner to the contacts (12, 13) in the same method step during the mounting onto the mounting surface (11), an isolation of the carrier (1) along isolation lines (V), wherein an isolation line (V) runs through at least one of the vias (4), so that, after the isolation, the contacts (12, 13) form contact surfaces (5) at at least one side surface (1a) o

Abstract: A luminescent material mixture has a first luminescent material and a second luminescent material, wherein, under excitation with blue light, an emission spectrum of the first luminescent material has a relative intensity maximum in a yellowish-green region of the spectrum at a wavelength of greater than or equal to 540 nm and less than or equal to 560 nm and an emission spectrum of the second luminescent material has a relative intensity maximum in an orange-red region of the spectrum at a wavelength of greater than or equal to 600 nm and less than or equal to 620 nm.

Abstract: A semiconductor laser diode is specified, comprising a semiconductor layer sequence (1) with semiconductor layers applied vertically one above another with an active layer (11), which emits laser radiation via a radiation coupling-out surface during operation, wherein the radiation coupling-out surface is formed by a side surface of the semiconductor layer sequence (1), and a heat barrier layer (2) and a metallic contact layer (5) laterally adjacent to one another on a main surface (12) of the semiconductor layer sequence (1), wherein the heat barrier layer (2) is formed by an electrically insulating porous material (9). As a result, the heat arising during operation is conducted via the p-type electrode (5) to a heat sink (20) and the formation of a two-dimensional temperature gradient is avoided. A thermal lens in the edge emitter is thus counteracted. Furthermore, a method for producing a semiconductor laser diode and a semiconductor laser diode arrangement are specified.

Abstract: An optoelectronic component includes a light emitting semiconductor chip, including an emission side and comprising an underside, wherein the optoelectronic component is configured to emit light via the emission side, the optoelectronic component including an insulating layer, the light emitting semiconductor chip is embedded into the insulating layer, the light emitting semiconductor chip including two electrical contact locations, the contact locations face away from the emission side, a first and a second electrically conductive contact layer are provided, respectively, an electrically conductive contact layer electrically conductively connects to a contact location of the semiconductor chip, the electrically conductive contact layers are arranged in the insulating layer, the first electrically conductive contact layer adjoins a first side face of the optoelectronic component, and the second electrically conductive contact layer adjoins a second side face of the optoelectronic component.

Abstract: A luminaire for disinfecting a target surface includes a disinfecting light source, a non-disinfecting light source, a beam angle adjustor, a motion sensor, and a distance sensor. The radiance of the disinfecting light is calculated based on detected distance to a target surface and beam angle, and may be selected to achieve a predetermined irradiance of the target surface. If no motion is detected by the motion sensor then the disinfecting light source is set to ON and the non-disinfecting light source is set to OFF. If motion is detected and a beam intercept is not detected by the distance sensor then the disinfecting light source is set to DIM and the non-disinfecting light source is set to ON. If motion is detected and a beam intercept is detected then the disinfecting light source is set to OFF and the non-disinfecting light source is set to ON.

Abstract: Various implementations disclosed herein includes a method for operating lighting fixtures in horticultural applications. The method may include receiving a user input of a desired irradiance for a first color channel of one or more lighting fixtures that irradiates a plant bed, in which each of the one or more lighting fixtures comprises at least one light emitting diode (LED) array, determining, for each of the one or more lighting fixtures, a PWM setting of the first color channel such that each of the one or more lighting fixtures irradiate the plant bed at the desired irradiance based on calibration data stored in each of the one or more lighting fixtures, and applying, to each of the one or more lighting fixtures, the determined PWM setting of the first color channel.

Abstract: A solid state light source driver circuit that operates in either a buck convertor or a boost convertor configuration is provided. The driver circuit includes a controller, a boost switch circuit and a buck switch circuit, each coupled to the controller, and a feedback circuit, coupled to the light source. The feedback circuit provides feedback to the controller, representing a DC output of the driver circuit. The controller controls the boost switch circuit and the buck switch circuit in response to the feedback signal, to regulate current to the light source. The controller places the driver circuit in its boost converter configuration when the DC output is less than a rectified AC voltage coupled to the driver circuit at an input node. The controller places the driver circuit in its buck converter configuration when the DC output is greater than the rectified AC voltage at the input node.