Abstract: In a nonvolatile memory, the select gates (144S) are formed from one conductive layer (e.g. polysilicon or polyside), and the wordlines (144) interconnecting the select gates are made from a different conductive layer (e.g. metal). The wordlines overlie an interlevel dielectric (310) formed over control gates (134). The dielectric thickness can be controlled to reduce the capacitance between the wordlines and the control gates. In some embodiments, the floating gates (120) are fabricated in a self-aligned manner using an isotropic etch of the floating gate layer.

Abstract: In a nonvolatile memory, the select gates (144S) are formed from one conductive layer (e.g. polysilicon or polyside), and the wordlines (144) interconnecting the select gates are made from a different conductive layer (e.g. metal). The wordlines overlie an interlevel dielectric (310) formed over control gates (134). The dielectric thickness can be controlled to reduce the capacitance between the wordlines and the control gates. In some embodiments, the floating gates (120) are fabricated in a self-aligned manner using an isotropic etch of the floating gate layer.

Abstract: A memory charge storage node (120.1, 120.2, 120.3) is at least partially located in a trench (124). The memory comprises a transistor including a source/drain region (170) present at a first side (124.1) but not a second side (124.2) of the trench. Before forming conductive material (120.3) providing at least a portion of the charge storage node, a blocking feature (704) is formed adjacent to the second side (124.2) to block the conductive material (120.3). The blocking feature can be dielectric left in the final structure, or can be a sacrificial feature which is removed after the conductive material deposition to make room for dielectric. The blocking features for multiple trenches in a memory array can be patterned using a mask (710) comprising a plurality of straight strips each of which runs through the memory array in the row direction. The charge storage node has a protrusion (120.

Abstract: A method of correcting a lithographic process is provided. A physical vapor deposition process (PVD) is performed to deposit a film on a wafer. The asymmetrical deposition of the film on the sidewalls of an opening is related to the change of target consumption in the PVD process. Therefore, the positional shift in an overlay mark may change each time. However, a formula relating target consumption with the degree of positional shift can be derived. The formula is recorded by a controller system. A compensation value can be obtained from the controller system and fed back in a subsequent lithographic process. Thereafter, a photoresist layer is formed on the film and a lithographic process is performed to pattern the photoresist. Since the compensation value can be fed back in the lithographic process via the controller system to correct for the positional shift in the overlay mark resulting from target consumption in the PVD process, errors in measuring the overlay mark can be reduced.

Abstract: In a memory cell (110) having multiple floating gates (160), the select gate (140) is formed before the floating gates. In some embodiments, the memory cell also has control gates (170) formed after the select gate. Substrate isolation regions (220) are formed in a semiconductor substrate (120). The substrate isolation regions protrude above the substrate. Then select gate lines (140) are formed. Then a floating gate layer (160) is deposited. The floating gate layer is etched until the substrate isolation regions are exposed. A dielectric (164) is formed over the floating gate layer, and a control gate layer (170) is deposited. The control gate layer protrudes upward over each select gate line. These the control gates and the floating gates are defined independently of photolithographic alignment. In another aspect, a nonvolatile memory cell has at least two conductive floating gates (160).

Abstract: An ONO-type inter-poly insulator is formed by depositing intrinsic silicon on an oxidation stop layer. In one embodiment, the oxidation stop layer is a nitridated top surface of a lower, and conductively-doped, polysilicon layer. In one embodiment, atomic layer deposition (ALD) is used to precisely control the thickness of the deposited, intrinsic silicon. Heat and an oxidizing atmosphere are used to convert the deposited, intrinsic silicon into thermally-grown, silicon dioxide. The oxidation stop layer impedes deeper oxidation. A silicon nitride layer and an additional silicon oxide layer are further deposited to complete the ONO structure before an upper, and conductively-doped, polysilicon layer is formed. In one embodiment, the lower and upper polysilicon layers are patterned to respectively define a floating gate (FG) and a control gate (CG) of an electrically re-programmable memory cell.

Abstract: A NVM including a substrate, a control gate layer, a charge storage layer, a tunneling layer, a charge barrier layer, a gate dielectric layer and a first doping region is described. The control gate layer is disposed in a first trench of the substrate; the charge storage layer is disposed between the sidewall of the first trench and the control gate layer; the tunneling layer is disposed between the sidewall of the first trench and the charge storage layer; the charge barrier layer is disposed between the charge storage layer and the control gate layer; the gate dielectric layer is disposed between the bottom of the first trench and the control gate layer; and the first doping region is disposed in the substrate at one side of the control gate layer.

Abstract: A clock generator is provided that is compatible with both DDR1 and DDR2 applications. The internal YCLK signal is turned on only when an active read or write occurs on the integrated circuit memory, even though the main chip clock is always running. A circuit block within the clock generator detects when a read or write is active and initiates a YCLK signal on the next falling edge of the internal clock. Two separate mechanisms are used for determining when to terminate the YCLK. One mechanism is a timer path and the other is a path determined by DDR1 and DDR2 control signals. The timer path is strictly time based and is the same for DDR1 and DDR2 parts or modes of operation. The other signal path is different for DDR1 and DDR2 operating modes. A DDR1 control signal turns off YCLK at the next rising edge of the internal clock, and a DDR2 control signal turns off YCLK at the next falling edge of the internal clock.

Abstract: An equalization circuit for a pair of resistive-capacitive data lines includes primary and secondary equalization circuits attached at both ends of the data line pair. A primary equalization circuit at one end of the data line pair receives a primary control signal, and a secondary equalization circuit at the other end of the data line pair receives a secondary control signal, which is different than the primary control signal. The equalization devices in the primary equalization circuit are attached near the read and write amplifiers and operate normally since all the information is available as to whether or not the corresponding data line pair should be equalized. The additional equalization devices in the secondary equalization circuit placed at the other end of the data line pair receive a simpler control signal that lacks the information as to whether or not any particular data line pair is being equalized.

Abstract: A widened contact area (170X) of a conductive feature (170) is formed by means of self-alignment between an edge (170E2) of the conductive feature and an edge (140E) of another feature (140). The other feature (“first feature”) is formed from a first layer, and the conductive feature is formed from a second layer overlying the first layer. The edge (170E2) of the conductive feature is shaped to provide a widened contact area. This shaping is achieved in a self-aligned manner by shaping the corresponding edge (140E) of the first feature.

Abstract: A deep trench capacitor disposed in a deep trench in a substrate is provided. The deep trench capacitor includes a bottom electrode disposed in the substrate surrounding a bottom of the deep trench; a first conductive layer disposed in the deep trench; a capacitor dielectric layer disposed between a lower surface of the deep trench and the first conductive layer; a second conductive layer disposed in the deep trench and above the first conductive layer; a collar oxide layer disposed between an upper surface of the deep trench and the second conductive layer; a third conductive layer disposed in the deep trench and above the second conductive layer; an isolation structure disposed in parts of the third conductive layer, the second conductive layer and the substrate; and an isolation layer disposed below the isolation structure and in parts of the second conductive layer and the substrate.

Abstract: A memory device that includes a semiconductor substrate, and an array of memory cells, each cell being electrically isolated from adjacent cells and including an island formed from the substrate, the island having a top portion and at least one sidewall portion, and being spaced apart from other islands by a bottom surface on the substrate, a capacitor formed contiguous with the sidewall portion, and a transistor formed on the top portion of the island, the transistor including a gate oxide layer formed on a surface of the top portion, a gate formed on the gate oxide layer, and a first and a second diffused regions formed in the top portion, the first diffused region being spaced apart from the second diffused region.

Abstract: A system for processing residual gas that includes a chamber having at least one baffle for increasing gas flow path, a residual gas inlet mechanism connected to the chamber for supplying residual gas to the chamber, at least one first gas inlet mechanism connected to the chamber for supplying inert gas to the chamber, at least one second gas inlet mechanism connected to the chamber for supplying a reactive gas to the chamber, and a gas outlet mechanism for connected to the chamber for outputting mixed gases from mixing the residual gas, inert gas and reactive gas and non-reacted residual gas, inert gas and reactive gas.

Abstract: A gate dielectric (150) for a gate (160) is formed by thermal oxidation simultaneously with as a dielectric on a surface of another gate (140). The dielectric thickness on the other gate is controlled by the dopant concentration in the other gate. The gates may be gates of different MOS transistors, or a select gate and a floating gate of a memory cell. Other features are also provided.

Abstract: A widened contact area (170X) of a conductive feature (170) is formed by means of self-alignment between an edge (170E2) of the conductive feature and an edge (140E) of another feature (140). The other feature (“first feature”) is formed from a first layer, and the conductive feature is formed from a second layer overlying the first layer. The edge (170E2) of the conductive feature is shaped to provide a widened contact area. This shaping is achieved in a self-aligned manner by shaping the corresponding edge (140E) of the first feature.

Abstract: In a memory cell (110) having multiple floating gates (160), the select gate (140) is formed before the floating gates. In some embodiments, the memory cell also has control gates (170) formed after the select gate. Substrate isolation regions (220) are formed in a semiconductor substrate (120). The substrate isolation regions protrude above the substrate. Then select gate lines (140) are formed. Then a floating gate layer (160) is deposited. The floating gate layer is etched until the substrate isolation regions are exposed. A dielectric (164) is formed over the floating gate layer, and a control gate layer (170) is deposited. The control gate layer protrudes upward over each select gate line. These the control gates and the floating gates are defined independently of photolithographic alignment. In another aspect, a nonvolatile memory cell has at least two conductive floating gates (160).

Abstract: A differential amplifier design and bias control technique of particular applicability for low voltage operation in which the threshold voltage of n-channel differential input transistors is controlled using substrate bias in order to allow a wider range of input signal levels. Further disclosed is a technique for controlling the substrate bias of the input transistors of a differential amplifier based on the level of the output of the amplifier in addition to a differential amplifier circuit capable of low voltage operation in which an additional bias current is introduced that enables the output pull-up current to be increased without increasing the pull-down current, as well as circuitry for optimizing the performance of the differential in both DDR-I and DDR-II operational modes.

Abstract: A method of fabrication deep trench capacitors includes forming a plurality of deep trenches in a substrate. A bottom electrode is formed in the substrate surrounding the bottom of each deep trench. A capacitor dielectric layer and a first conductive layer are formed at the bottom of each deep trench. A collar oxide layer is formed on the sidewall of the deep trench exposed by the first conductive layer. A second conductive layer fills each deep trench. An opening is formed in a region predetermined for an isolation structure between adjacent deep trenches, wherein the depth of the opening is greater than that of the isolation structure. An isolation layer is filled in the opening.

Abstract: Aluminum oxide is deposited by atomic layer deposition to form a high-k dielectric for the interpoly dielectric layer of a non-volatile memory device. The increased capacitive coupling can allow a thicker oxide layer to be used between the floating gate and the control gate, resulting in improved reliability and longer lifetime of the memory cells fabricated according to this invention.

Abstract: A dynamic random access memory (DRAM) cell is described, including a semiconductor pillar on a substrate, a capacitor on a lower portion of a sidewall of the pillar, and a vertical transistor on an upper portion of the sidewall of the pillar. The capacitor includes a first plate in the lower portion of the sidewall of the pillar, a second plate as an upper electrode at the periphery of the first plate, a third plate at the periphery of the second plate electrically connected with the first plate to form a lower electrode, and a dielectric layer separating the second plate from the first and third plates. A DRAM array based on the DRAM cell and a method for fabricating the DRAM array are also described.