Patents Assigned to QUALCOMM MEMS Technologies
  • ELECTROMECHANICAL DEVICE WITH OPTICAL FUNCTION SEPARATED FROM MECHANICAL AND ELECTRICAL FUNCTION
    Publication number: 20130069958
    Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.
    Type: Application
    Filed: October 10, 2012
    Publication date: March 21, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventor: QUALCOMM MEMS TECHNOLOGIES, INC.
  • METHODS AND APPARATUS FOR HYBRID HALFTONING OF AN IMAGE
    Publication number: 20130069968
    Abstract: This disclosure provides methods, apparatus, and computer programs encoded on computer storage media for tone based halftoning of digital images. By exploiting knowledge of local image features and tone levels, the halftoning method may be adaptively switched between error-diffusion and mask-based dithering with reduced boundary artifacts. By further utilizing a smart quantization error clipping scheme, artifacts inherent to the method of error diffusion are also reduced. The method consistently generates higher quality halftone images for both still and video applications when compared to conventional methods.
    Type: Application
    Filed: March 16, 2012
    Publication date: March 21, 2013
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Jeho Lee, Manu Parmar, Jennifer Lee Gille
  • HYBRID VIDEO HALFTONING TECHNIQUES
    Publication number: 20130069974
    Abstract: This disclosure provides techniques related to halftoning video images for display on an electronic device. The techniques include adaptively selecting, on a pixel-by-pixel basis, between a mask-based dithering (MBD) and an error diffusion (ED) halftoning technique. The ED technique may be selected for halftoning pixels of an input frame of data having either a temporal change rate metric (CRM) or a spatial CRM exceeding a respective threshold. Where both the temporal CRM and spatial CRM are less than the respective thresholds, halftoning may be performed by the technique that produces a halftone value closer to a comparison halftone value of a comparison frame. The comparison frame may be a preceding frame, or an immediately preceding frame.
    Type: Application
    Filed: May 24, 2012
    Publication date: March 21, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Jeho Lee, Manu Parmar, Jennifer Lee Gille
  • METHOD AND SYSTEM FOR WRITING DATA TO MEMS DISPLAY ELEMENTS
    Publication number: 20130063335
    Abstract: Charge balanced display data writing methods use write and hold cycles of opposite polarity during selected frame update periods. The transitions between voltages of opposite polarity are sufficiently brief that the display elements do not change state. A release cycle may be provided to reduce the chance that a given display element will become stuck in an actuated state.
    Type: Application
    Filed: November 8, 2012
    Publication date: March 14, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventor: Qualcomm Mems Technologies, Inc.
  • BACKPLATE INTERCONNECT WITH INTEGRATED PASSIVES
    Publication number: 20130063415
    Abstract: This disclosure provides systems, methods and apparatus for manufacturing display devices having electronic components mounted within a display device package. In one aspect, the electronic component connects to the exterior of the display device through pads that run below a seal that holds a substrate and a backplate of the display device together. In another aspect the electronic components also connect to an electromechanical device within the display device, as well as connecting to pads that are external to the display device.
    Type: Application
    Filed: September 9, 2011
    Publication date: March 14, 2013
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Ravindra V. Shenoy, Marc Maurice Mignard, Manish Kothari, Clarence Chui
  • Methods for characterizing the behavior of microelectromechanical system devices
    Patent number: 8395371
    Abstract: Various methods are described to characterize interferometric modulators or similar devices. Measured voltages across interferometric modulators may be used to characterize transition voltages of the interferometric modulators. Measured currents may be analyzed by integration of measured current to provide an indication of a dynamic response of the interferometric modulator. Frequency analysis may be used to provide an indication of a hysteresis window of the interferometric modulator or mechanical properties of the interferometric modulator. Capacitance may be determined through signal correlation, and spread-spectrum analysis may be used to minimize the effect of noise or interference on measurements of various interferometric modulator parameters.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: March 12, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventor: Alok Govil
  • Method of creating MEMS device cavities by a non-etching process
    Patent number: 8394656
    Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer.
    Type: Grant
    Filed: July 7, 2010
    Date of Patent: March 12, 2013
    Assignee: Qualcomm MEMS Technologies, Inc.
    Inventors: Chun-Ming Wang, Jeffrey Lan, Teruo Sasagawa
  • HIGH AREA STACKED LAYERED METALLIC STRUCTURES AND RELATED METHODS
    Publication number: 20130057557
    Abstract: This disclosure provides implementations of high surface area stacked layered metallic structures, devices, apparatus, systems, and related methods. A plurality of stacked layers on a substrate may be manufactured from a plating bath including a first metal and a second metal. A modulated plating current can deposit alternate first metal layers and alloy layers, the alloy layers including the first metal and the second metal. Gaps between the alloy layers can be formed by selectively etching some portions of the first metal layers to define a stacked layered structure. Stacked layered structures may be useful in applications to form capacitors, inductors, catalytic reactors, heat transfer tubes, non-linear springs, filters, batteries, and heavy metal purifiers.
    Type: Application
    Filed: September 7, 2011
    Publication date: March 7, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Ravindra Vaman Shenoy, Philip Jason Stephanou, Ana Rangelova Londergan, Evgeni Petrovich Gousev
  • MECHANICAL LAYER AND METHODS OF MAKING THE SAME
    Publication number: 20130057558
    Abstract: This disclosure provides systems, methods and apparatus for controlling a mechanical layer. In one aspect, an electromechanical systems device includes a substrate and a mechanical layer positioned over the substrate to define a gap. The mechanical layer is movable in the gap between an actuated position and a relaxed position, and includes a mirror layer, a cap layer, and a dielectric layer disposed between the mirror layer and the cap layer. The mechanical layer is configured to have a curvature in a direction away from the substrate when the mechanical layer is in the relaxed position. In some implementations, the mechanical layer can be formed to have a positive stress gradient directed toward the substrate that can direct the curvature of the mechanical layer upward when the sacrificial layer is removed.
    Type: Application
    Filed: September 7, 2011
    Publication date: March 7, 2013
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Chuan Pu, Yi Tao, Chandra S. Tupelly, Kostadin D. Djordjev, Fan Zhong, Rihui He, Wenyue Zhang
  • System and method for power reduction when decompressing video streams for interferometric modulator displays
    Patent number: 8391630
    Abstract: A system and method for processing image data to be displayed on a display device, where the display device requires more power to be driven to display image data comprising particular spatial frequencies in one dimension than to be driven to display image data comprising the particular spatial frequencies in a second dimension. The method includes receiving image data and filtering the received image data such that the image data at particular spatial frequencies in a first dimension are attenuated more than the image data at particular spatial frequencies in a second dimension.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: March 5, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventor: Mithran Mathew
  • Conductive bus structure for interferometric modulator array
    Patent number: 8390547
    Abstract: Embodiments of an interferometric modulator are disclosed having various enhancements and features including a conductive bus. In certain embodiments, the interferometric modulator has a first conductive layer suspended over a second electrode layer. In certain embodiments, a second conductive layer is provided over the first conductive layer. One of the first and/or second conductive buses may further connect to the first electrode layer and/or the second electrode layer. Other disclosed features can be incorporated into embodiments of the interferometric modulator to improve response time, power consumption, and image resolution.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: March 5, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventors: Clarence Chui, Jeffrey B. Sampsell
  • System and method for false-color sensing and display
    Patent number: 8390916
    Abstract: A system and method for determining humidity based on determination of an offset voltage shift are disclosed. In one embodiment, a system for determining humidity comprises an electromechanical device comprising a first layer, a second layer, and a dielectric between the two layers, wherein the dielectric is spaced apart from at least one of the first and second layers in an unactuated state of the electromechanical device, and wherein the dielectric contacts both the first and second layers in an actuated state of the electromechanical device, a voltage source configured to apply, between the first and second layers, one or more voltages, and a processor configured to control the voltage source, to determine an offset voltage shift based on the applied voltages, and to determine information regarding humidity about the device based on the offset voltage shift.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: March 5, 2013
    Assignee: QUALCOMM MEMS Technologies, Inc.
    Inventor: Jeffrey B. Sampsell
  • PIEZOELECTRIC MICROPHONE FABRICATED ON GLASS
    Publication number: 20130051587
    Abstract: This disclosure provides systems, methods and apparatus for sense elements in an electromechanical microphone device. In one aspect, a piezoelectric sense element may include a glass substrate, electrode layers, piezoelectric layers, and elastic layers. The elastic layers may serve to modify the neutral plane of the piezoelectric sense element. Including an elastic layer or layers to modify the neutral plane of the piezoelectric sense element may serve to configure the sense element such that the piezoelectric layer generates a voltage in response to a sound wave or may serve to increase the sensitivity of the sense element.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Philip Jason STEPHANOU, David William BURNS
  • RELEASE ACTIVATED THIN FILM GETTER
    Publication number: 20130049143
    Abstract: This disclosure provides apparatuses, systems and methods for manufacturing electromechanical systems (EMS) devices having a means for removing and/or mitigating unwanted environmental stresses from within the device. In some implementations, an integrated getter layer that is exposed to an internal cavity of the electromechanical systems device can be configured to help remove and/or mitigate unwanted moisture from within an EMS device.
    Type: Application
    Filed: August 26, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventor: Jon B. Lasiter
  • DIE-CUT THROUGH-GLASS VIA AND METHODS FOR FORMING SAME
    Publication number: 20130050226
    Abstract: This disclosure provides systems, methods and apparatus for providing electrical connections through glass substrates. In one aspect, a through-glass via including a peripheral through-glass via hole and sidewall metallization is provided. Sidewall metallization can include multiple conductive lines facilitating increased interconnect density. In another aspect, one or more methods of forming peripheral through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a through-glass via hole, followed by sidewall metallization and dicing through the through-glass via hole.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Ravindra Vaman Shenoy, David William Burns, Kurt Edward Petersen
  • PIEZOELECTRIC MICROPHONE FABRICATED ON GLASS
    Publication number: 20130051586
    Abstract: This disclosure provides systems, methods and apparatus for glass-encapsulated microphones. In one aspect, a glass-encapsulated microphone may include a glass substrate, an electromechanical microphone device, an integrated circuit device, and a cover glass. The cover glass may be bonded to the glass substrate with an adhesive, such as epoxy, or a metal bond ring. The cover glass may have any of a number of configurations. In some configurations, the cover glass may define an aperture for the electromechanical microphone device at an edge of the glass-encapsulated microphone. In some configurations, the cover glass may define a cavity to accommodate the integrated circuit device that is separate from a cavity that accommodates the electromechanical microphone device.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Philip Jason STEPHANOU, David William BURNS
  • GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
    Publication number: 20130050227
    Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass. The cover glass may be bonded to the glass substrate with an adhesive such as an epoxy, or a metal bond ring. The glass package also may include one or more signal transmission pathways between the one or more devices and the package exterior. In some implementations, a glass package including an EMS and/or IC device is configured to be directly attached to a printed circuit board (PCB) or other integration substrate by surface mount technology.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Kurt Edward Petersen, Ravindra V. Shenoy, Justin Phelps Black, David William Burns, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Nicholas Ian Buchan
  • FAMILY OF CURRENT/POWER-EFFICIENT HIGH VOLTAGE LINEAR REGULATOR CIRCUIT ARCHITECTURES
    Publication number: 20130049611
    Abstract: Power efficient power supply regulator circuits are disclosed. The circuits are configured to modify their overhead current according to current load. This is particularly advantageous for use in display devices with widely varying current loads. Such displays include bi-stable displays, such as interferometric modulation displays, LCD displays, and DMD displays.
    Type: Application
    Filed: October 29, 2012
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventor: QUALCOMM MEMS Technologies, Inc.
  • CAPACITIVE TOUCH SENSOR HAVING LIGHT SHIELDING STRUCTURES
    Publication number: 20130049844
    Abstract: This disclosure provides systems, methods, and apparatus related to a capacitive touch sensor with light shielding structures. In one aspect, a device includes an array formed by a plurality of row electrodes and a plurality of non-transparent column electrodes, wherein at least a first portion of the row electrodes is non-transparent and coplanar with the column electrodes and at least a second portion of the row electrodes is non-coplanar with the column electrodes. The device further includes light shielding structures that are non-transparent and coplanar with the column electrodes, wherein the light shielding structures substantially overlap the second portion.
    Type: Application
    Filed: August 23, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS Technologies, Inc.
    Inventors: Ion Bita, Leonard Eugene Fennell, William J. Cummings
  • GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
    Publication number: 20130050228
    Abstract: This disclosure provides systems, methods and apparatus for glass packaging of integrated circuit (IC) and electromechanical systems (EMS) devices. In one aspect, fabricating a glass package includes joining a cover glass panel to a glass substrate panel, and singulating the joined panels to form individual glass packages, each including one or more encapsulated devices and one or more signal transmission pathways. In another aspect, a glass package may include a glass substrate, a cover glass and one or more devices encapsulated between the glass substrate and the cover glass.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Kurt Edward Petersen, Ravindra V. Shenoy, Justin Phelps Black, David William Burns, Srinivasan Kodaganallur Ganapathi, Philip Jason Stephanou, Nicholas Ian Buchan