Patents Assigned to Rockley Photonics Limited
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Patent number: 11966078Abstract: A method of manufacturing an optoelectronic device including a mode converter. The method has the steps of: on a first silicon-on-insulator (SOI) wafer, manufacturing the optoelectronic device; and either: on a second SOI wafer, manufacturing a mode converter; and bonding the mode converter to the first SOI wafer; or bonding a second SOI wafer to the first SOI wafer to form a combined wafer; and etching a mode converter into the combined wafer.Type: GrantFiled: December 9, 2019Date of Patent: April 23, 2024Assignee: Rockley Photonics LimitedInventor: Guomin Yu
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Patent number: 11962056Abstract: An enhanced bandwidth interconnect circuit. In some embodiments the circuit includes a two-terminal device and a network for forming a connection to the two-terminal device. The network may include a first set of coupled transmission lines and a second set of coupled transmission lines. A second end of the first set of coupled transmission lines may be connected to a first end of the second set of coupled transmission lines, and a second end of the second set of coupled transmission lines may be connected to the two-terminal device.Type: GrantFiled: June 29, 2021Date of Patent: April 16, 2024Assignee: Rockley Photonics LimitedInventor: David Arlo Nelson
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Patent number: 11953728Abstract: A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.Type: GrantFiled: July 5, 2022Date of Patent: April 9, 2024Assignee: Rockley Photonics LimitedInventors: Guomin Yu, Mohamad Dernaika, Ludovic Caro, Hua Yang, Aaron John Zilkie
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Patent number: 11955363Abstract: A bonding fixture. In some embodiments, the fixture includes: a plate for supporting a central region of the wafer, the central region including 80% of the area of the wafer; and a frame for supporting: the edge of the wafer, and the edge of the plate, the frame having: a first vacuum passage, for pulling the wafer against an upper surface of the frame, and a second vacuum passage, for pulling the plate against the frame.Type: GrantFiled: May 11, 2022Date of Patent: April 9, 2024Assignee: Rockley Photonics LimitedInventors: Moshe Amit, Chia-Te Chou, Arvind Jaikumar
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Patent number: 11953727Abstract: A device coupon for use in a hybrid integration process with a silicon platform. The device coupon comprises: an input waveguide, including an input facet; an active waveguide, coupled to the input waveguide, the active waveguide including a III-V semiconductor based electro-optical device; and an output waveguide, configured to couple light between the active waveguide and an output facet. The input waveguide and output waveguide are passive waveguides.Type: GrantFiled: May 12, 2021Date of Patent: April 9, 2024Assignee: Rockley Photonics LimitedInventors: Guomin Yu, Aaron John Zilkie
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Patent number: 11923327Abstract: A silicon integrated circuit. In some embodiments, the silicon integrated circuit includes a first conductive trace, on a top surface of the silicon integrated circuit, a dielectric layer, on the first conductive trace, and a second conductive trace, on the dielectric layer, connected to the first conductive trace through a first via.Type: GrantFiled: June 5, 2020Date of Patent: March 5, 2024Assignee: Rockley Photonics LimitedInventors: Michael Lee, John Paul Drake, Ying Luo, Vivek Raghunathan, Brett Sawyer
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Patent number: 11886787Abstract: A system and method for adjusting the shapes of polygons in a design. In some embodiments, the method includes inverting a first layer of the design, the first layer comprising one or more polygons, the inverting of the first layer forming a region complementary to the union of the polygons of the first layer, and including one or more inverse polygons. The method may further include performing a rounding operation on a first corner of a first inverse polygon of the one or more inverse polygons, to form a modified polygon.Type: GrantFiled: October 27, 2021Date of Patent: January 30, 2024Assignee: Rockley Photonics LimitedInventors: Gazi Mostafa Huda, Troy Vytautas Tamas
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Patent number: 11886058Abstract: An optical isolator on a silicon photonic integrated circuit. The optical isolator comprising: a polarization splitter; a polarization rotator; and a Faraday rotator. The Faraday rotator comprises: one or more magnets providing a magnetic field; and a silicon spiral delay line. The silicon spiral delay line being formed from a silicon waveguide shaped into a spiral region having no built-in phase shifters and a central region within the spiral region. The central region having no more than a total of 180 degree of phase shifters.Type: GrantFiled: May 22, 2020Date of Patent: January 30, 2024Assignee: Rockley Photonics LimitedInventors: Adam Scofield, Gerald Byrd, Aaron John Zilkie
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Patent number: 11860427Abstract: The present disclosure includes a method of securing a photonic component to a semiconductor chip, the method including forming a thermosonic bond between the semiconductor chip and a cap to fix the cap against the photonic component. The present disclosure also includes an apparatus including a semiconductor chip having a V-groove, an optical fiber in the V-groove, and a cap secured to the semiconductor chip through a bond including a metal bump, wherein the cap fixes the optical fiber in the V-groove.Type: GrantFiled: June 13, 2022Date of Patent: January 2, 2024Assignee: Rockley Photonics LimitedInventors: Albert Benzoni, Shuhe Li
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Patent number: 11835762Abstract: A waveguide mode filter. In some embodiments, the waveguide mode filter includes a first section of waveguide. The first section may have: a first end; a second end; a rate of change of curvature having a magnitude not exceeding 15/mm2 within the first section; a curvature having a magnitude of at most 0.03/mm at the first end; and a curvature having a magnitude of at least 0.1/mm at the second end.Type: GrantFiled: March 4, 2022Date of Patent: December 5, 2023Assignee: Rockley Photonics LimitedInventors: Abu Thomas, Andrea Trita, Jeffrey Driscoll
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Patent number: 11815748Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: GrantFiled: December 2, 2021Date of Patent: November 14, 2023Assignee: Rockley Photonics LimitedInventors: James Dongyoon Oh, Hooman Abediasl, Gerald Cois Byrd, Karlheinz Muth, Yi Zhang, Aaron John Zilkie
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Patent number: 11808979Abstract: A method of fabricating a device coupon including a waveguide which is suitable for use in a micro-transfer printing process. The method comprises the steps, on a wafer, of: depositing a lower cladding layer on an uppermost surface of the wafer; providing a silicon nitride guiding layer on an uppermost surface of the lower cladding; depositing an upper cladding over at least an uppermost surface of the silicon nitride guiding layer; providing a tether over the coupon, and etching away a region of the uppermost layer of the wafer located between the lower cladding layer and a substrate of the wafer, thereby leaving the lower cladding layer, silicon nitride guiding layer, and upper cladding layer suspended above the wafer via the tether.Type: GrantFiled: March 16, 2021Date of Patent: November 7, 2023Assignee: Rockley Photonics LimitedInventors: Guomin Yu, Aaron John Zilkie
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Patent number: 11766216Abstract: An optical sensing module suitable for wearable devices, the optical sensing module comprising: a silicon or silicon nitride transmitter photonic integrated circuit (PIC), the transmitter PIC comprising: a plurality of lasers, each laser of the plurality of lasers operating at a wavelength that is different from the wavelength of the others; an optical manipulation region, the optical manipulation region comprising one or more of: an optical modulator, optical multiplexer (MUX); and additional optical manipulation elements; and one or more optical outputs for light originating from the plurality of lasers.Type: GrantFiled: December 11, 2020Date of Patent: September 26, 2023Assignee: Rockley Photonics LimitedInventors: Aaron John Zilkie, Hooman Abediasl, Cristiano Dalvi, Jeffrey Driscoll, Alexander Gondarenko, Richard Grote, Haydn Frederick Jones, Sean Merritt, Roozbeh Parsa, Philip Perea, Andrew George Rickman, Adam Scofield, Goumin Yu
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Patent number: 11740494Abstract: An electro-optically active device comprising: a silicon on insulator (SOI) substrate including a silicon base layer, a buried oxide (BOX) layer on top of the silicon base layer, a silicon on insulator (SOI) layer on top of the BOX layer, and a substrate cavity which extends through the SOI layer, the BOX layer and into the silicon base layer, such that a base of the substrate cavity is formed by a portion of the silicon base layer; an electro-optically active waveguide including an electro-optically active stack within the substrate cavity; and a buffer region within the substrate cavity beneath the electro-optically active waveguide, the buffer region comprising a layer of Ge and a layer of GaAs.Type: GrantFiled: May 6, 2022Date of Patent: August 29, 2023Assignee: Rockley Photonics LimitedInventors: Guomin Yu, Aaron John Zilkie
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Patent number: 11735679Abstract: A silicon based photodetector and method of manufacturing the same are provided. The photodetector comprising: a silicon substrate; a buried oxide layer, above the silicon substrate; and a waveguide, above the buried oxide layer. The waveguide includes a silicon, Si, containing region and a germanium tin, GeSn, containing region, both located between a first doped region and a second doped region of the waveguide, thereby forming a PIN diode. The first doped region and the second doped region are respectively connected to first and second electrodes, such that the waveguide is operable as a photodetector.Type: GrantFiled: May 29, 2019Date of Patent: August 22, 2023Assignee: Rockley Photonics LimitedInventors: Yi Zhang, Hooman Abediasl, Aaron John Zilkie
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Patent number: 11733461Abstract: A multi-path interference filter. The multi-path interference filter includes a first port waveguide, a second port waveguide, and an optical structure connecting the first port waveguide and the second port waveguide. The optical structure has a first optical path from the first port waveguide to the second port waveguide, and a second optical path, different from the first optical path, from the first port waveguide to the second port waveguide. The first optical path has a portion, having a first length, within hydrogenated amorphous silicon. The second optical path has a portion, having a second length, within crystalline silicon, and the second optical path has either no portion within hydrogenated amorphous silicon, or a portion, having a third length, within hydrogenated amorphous silicon, the third length being less than the first length.Type: GrantFiled: March 29, 2021Date of Patent: August 22, 2023Assignee: Rockley Photonics LimitedInventor: Andrea Trita
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Patent number: 11699892Abstract: A discrete wavelength tunable laser having an optical cavity which comprises: a reflective semiconductor optical amplifier (SOA); a demultiplexer (Demux) having a single input and a plurality of outputs, the Demux configured to receive the output of the SOA and to produce a plurality of fixed spectral passbands within the gain bandwidth of the SOA; one or more tunable distributed Bragg reflector(s) (DBR(s)) arranged to receive the outputs of the Demux, each tunable DBR configured to select a reflective spectral band within the gain bandwidth of the SOA upon application of a bias current; wherein the SOA forms the back end mirror of the optical cavity; the one or more tunable DBRs form the front end mirror of the optical cavity; and wherein the lasing channel of the discrete wavelength tunable laser is chosen by the overlap of the selected reflective spectral band of one of the one or more tunable DBRs with a fixed spectral passband of the Demux.Type: GrantFiled: June 1, 2020Date of Patent: July 11, 2023Assignee: Rockley Photonics LimitedInventor: Aaron Zilkie
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Patent number: 11686959Abstract: An optical instrument for determining a wavelength of light generated by a light source. The optical instrument may include a signal generator for generating a driving signal, a tunable optical filter device configured to receive the driving signal, the tunable optical filter device configured to diffract the light generated by the light source based on the driving signal, an optical detector device configured to detect a timing of maximum diffraction of light diffracted by the tunable optical filter device, and an analyzer configured to determine the wavelength of the light based the timing of maximum diffraction.Type: GrantFiled: June 3, 2022Date of Patent: June 27, 2023Assignee: Rockley Photonics LimitedInventors: Trevor Fowler, Richard Grote, Miguel Ángel Guillén-Torres, Caroline Lai, Haydn Frederick Jones
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Patent number: 11681167Abstract: A photonic chip. In some embodiments, the photonic chip includes a waveguide; and an optically active device comprising a portion of the waveguide. The waveguide may have a first end at a first edge of the photonic chip; and a second end, and the waveguide may have, everywhere between the first end and the second end, a rate of change of curvature having a magnitude not exceeding 2,000/mm2.Type: GrantFiled: June 16, 2021Date of Patent: June 20, 2023Assignee: Rockley Photonics LimitedInventors: Abu Thomas, Albert Benzoni, Jacob Levy, Thomas Pierre Schrans, Andrea Trita, Guomin Yu, Aaron John Zilkie
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Patent number: 11605930Abstract: A Distributed Feedback Laser (DFB) mounted on a Silicon Photonic Integrated Circuit (Si PIC), the DFB having a longitudinal length which extends from a first end of the DFB laser to a second end of the DFB laser, the DFB laser comprising: an epi stack, the epi stack comprising: one or more active material layers; a layer comprising a partial grating, the partial grating extending from the second end of the DFB laser, only partially along the longitudinal length of the DFB laser such that it does not extend to the first end of the DFB laser; a highly reflective medium located at the first end of the DFB laser; and a back facet located at the second end of the DFB laser.Type: GrantFiled: March 20, 2020Date of Patent: March 14, 2023Assignee: Rockley Photonics LimitedInventors: Mazin Alalusi, Kevin Masuda, Pradeep Srinivasan