Patents Assigned to Rockley Photonics Limited
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Patent number: 11600532Abstract: A method for fabricating an integrated structure, using a fabrication system having a CMOS line and a photonics line, includes the steps of: in the photonics line, fabricating a first photonics component in a silicon wafer; transferring the wafer from the photonics line to the CMOS line; and in the CMOS line, fabricating a CMOS component in the silicon wafer. Additionally, a monolithic integrated structure includes a silicon wafer with a waveguide and a CMOS component formed therein, wherein the waveguide structure includes a ridge extending away from the upper surface of the silicon wafer. A monolithic integrated structure is also provided which has a photonics component and a CMOS component formed therein, the photonics component including a waveguide having a width of 0.5 ?m to 13 ?m.Type: GrantFiled: May 19, 2021Date of Patent: March 7, 2023Assignee: Rockley Photonics LimitedInventors: Aaron Zilkie, Andrew Rickman, Damiana Lerose
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Patent number: 11543687Abstract: An optoelectronic device. The optoelectronic device comprising: a rib waveguide provided on a substrate of the device, the rib waveguide comprising a ridge portion and a slab portion; a heater, disposed within the slab portion; a thermally isolating trench, adjacent to the rib waveguide, and extending into the substrate of the device; and a thermally isolating cavity within the substrate, which is directly connected to the thermally isolating trench, and which extends across at least a part of a width of the rib waveguide between the rib waveguide and the substrate.Type: GrantFiled: May 10, 2019Date of Patent: January 3, 2023Assignee: Rockley Photonics LimitedInventors: Dong Yoon Oh, Hooman Abediasl, Yi Zhang, Aaron John Zilkie
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Patent number: 11520112Abstract: An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.Type: GrantFiled: November 6, 2020Date of Patent: December 6, 2022Assignee: Rockley Photonics LimitedInventors: Yi Zhang, Chia-Te Chou, William Vis, Amit Singh Nagra, Hooman Abediasl
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Patent number: 11508868Abstract: A germanium based avalanche photo-diode device and method of manufacture thereof. The device including: a silicon substrate; a lower doped silicon region, positioned above the substrate; a silicon multiplication region, positioned above the lower doped silicon region; an intermediate doped silicon region, positioned above the silicon multiplication region; an un-doped germanium absorption region, position above the intermediate doped silicon region; an upper doped germanium region, positioned above the un-doped germanium absorption region; and an input silicon waveguide; wherein: the un-doped germanium absorption region and the upper doped germanium region form a germanium waveguide which is coupled to the input waveguide, and the device also includes a first electrode and a second electrode, and the first electrode extends laterally to contact the lower doped silicon region and the second electrode extends laterally to contact the upper doped germanium region.Type: GrantFiled: May 15, 2018Date of Patent: November 22, 2022Assignee: Rockley Photonics LimitedInventor: Guomin Yu
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Patent number: 11480731Abstract: A splitter. In some embodiments, the splitter includes an input waveguide; a first output waveguide; a second output waveguide; a first internal waveguide, connected to the input waveguide and to the first output waveguide, and a second internal waveguide, coupled to the first internal waveguide and connected to the second output waveguide. The splitter may be configured, when fed, at the input waveguide, power in a fundamental mode of the input waveguide or power in a first order spatial mode of the input waveguide: to transmit at least 80% of the power in the fundamental mode to the first output waveguide, and to transmit at least 80% of the power in the first order spatial mode to the second output waveguide.Type: GrantFiled: May 21, 2020Date of Patent: October 25, 2022Assignee: Rockley Photonics LimitedInventors: Yangyang Liu, Andrea Trita
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Patent number: 11428882Abstract: A silicon interposer. The silicon interposer including: a silicon layer, including one or more optical waveguides each connectable to an optical fiber; an optically active component, configured to convert optical signals received from the optical fiber into electrical signals or to convert electrical signals into optical signals and provide them to the optical fiber; and one or more electrical interconnects, connected to the optically active component and connectable to a printed circuit board, a separate die, a separate substrate, or a wafer level package.Type: GrantFiled: June 11, 2020Date of Patent: August 30, 2022Assignee: Rockley Photonics LimitedInventors: Vivek Raghunathan, Aaron John Zilkie
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Patent number: 11428962Abstract: A MOS capacitor-type optical modulator and method of fabricating a MOS capacitor-type optical modulator, wherein the MOS capacitor-type optical modulator has a MOS capacitor region which comprises an insulator formed of an epitaxially grown crystalline rare earth oxide (REO).Type: GrantFiled: August 21, 2018Date of Patent: August 30, 2022Assignee: Rockley Photonics LimitedInventors: Yi Zhang, Aaron John Zilkie
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Patent number: 11387186Abstract: A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.Type: GrantFiled: November 20, 2019Date of Patent: July 12, 2022Assignee: Rockley Photonics LimitedInventors: Seungjae Lee, Brett Sawyer, Chia-Te Chou
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Patent number: 11378762Abstract: A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.Type: GrantFiled: February 3, 2021Date of Patent: July 5, 2022Assignee: Rockley Photonics LimitedInventors: Guomin Yu, Mohamad Dernaika, Ludovic Caro, Hua Yang, Aaron John Zilkie
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Patent number: 11342475Abstract: An optoelectronic device, and a method of fabricating an optoelectronic device. The device comprising: a rib waveguide formed of doped silicon, said doped waveguide having a ridge portion, containing an uppermost surface and two sidewall surfaces; and a slab portion, adjacent to the two sidewall surfaces. The device further comprises: a metal contact layer, which directly abuts the uppermost surface and two sidewall surfaces, and which extends along a part of the slab portion so as to provide a Schottky barrier between the metal contact layer and the rib waveguide.Type: GrantFiled: August 20, 2018Date of Patent: May 24, 2022Assignee: Rockley Photonics LimitedInventors: Guomin Yu, Hooman Abediasl, Aaron John Zilkie
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Patent number: 11342270Abstract: A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.Type: GrantFiled: November 20, 2019Date of Patent: May 24, 2022Assignee: Rockley Photonics LimitedInventors: Seungjae Lee, Brett Sawyer, Chia-Te Chou
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Patent number: 11333907Abstract: A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.Type: GrantFiled: April 12, 2019Date of Patent: May 17, 2022Assignee: Rockley Photonics LimitedInventors: David Arlo Nelson, Vivek Raghuraman, David Erich Tetzlaff, Karlheinz Muth, Vivek Raghunathan
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Patent number: 11327343Abstract: An electro-optically active device comprising: a silicon on insulator (SOI) substrate including a silicon base layer, a buried oxide (BOX) layer on top of the silicon base layer, a silicon on insulator (SOI) layer on top of the BOX layer, and a substrate cavity which extends through the SOI layer, the BOX layer and into the silicon base layer, such that a base of the substrate cavity is formed by a portion of the silicon base layer; an electro-optically active waveguide including an electro-optically active stack within the substrate cavity; and a buffer region within the substrate cavity beneath the electro-optically active waveguide, the buffer region comprising a layer of Ge and a layer of GaAs.Type: GrantFiled: May 14, 2019Date of Patent: May 10, 2022Assignee: Rockley Photonics LimitedInventors: Guomin Yu, Aaron John Zilkie
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Patent number: 11296794Abstract: An optoelectronic device for quadrature-amplitude modulation (QAM) and a method of modulating light according to the same. The device comprising: an input waveguide; two intermediate waveguides, each coupled to the input waveguide via an input coupler; and an output waveguide, coupled to each of the intermediate waveguides via an output coupler; wherein each intermediate waveguide includes a modulating component connected in series with a phase shifting component, and each modulating component is connected to a respective electronic driver, the electronic drivers together being operable to produce a QAM-N modulated output from light entering the device from the input waveguide.Type: GrantFiled: March 15, 2018Date of Patent: April 5, 2022Assignees: Rockley Photonics Limited, California Institute of TechnologyInventors: Arian Hashemi Talkhooncheh, Azita Emami, Yi Zhang, Aaron Zilkie
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Patent number: 11262498Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.Type: GrantFiled: July 31, 2020Date of Patent: March 1, 2022Assignee: Rockley Photonics LimitedInventors: Gerald Cois Byrd, Chia-Te Chou, Karlheinz Muth
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Patent number: 11262603Abstract: A silicon photonic integrated circuit with a heater. In some embodiments, the silicon photonic integrated circuit includes a first waveguide, on a top surface of the silicon integrated circuit, and a heater element, on the first waveguide. The heater element may include a first metal layer, on the first waveguide, and a second metal layer, on the first metal layer, the second metal layer having a different composition than the first metal layer, the second layer having a thickness of less than 300 nm.Type: GrantFiled: June 12, 2020Date of Patent: March 1, 2022Assignee: Rockley Photonics LimitedInventors: Yi Zhang, Chia-Te Chou, Sanna Leena Mäkelä
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Patent number: 11240572Abstract: An optoelectronic switch for transferring an optical signal from a source external client device to a destination external client device, includes a leaf rack unit having thereon a leaf switch assembly including: a leaf switch having a plurality of fabric ports including a first fabric port and a second fabric port; and a fabric port multiplexer associated with the leaf switch, arranged to combine a first signal from the first fabric port and a second signal from the second fabric port onto a first connection, in the form of an outgoing first multiplexed signal.Type: GrantFiled: March 5, 2018Date of Patent: February 1, 2022Assignee: Rockley Photonics LimitedInventors: Andrew Rickman, Cyriel Johan Agnes Minkenberg
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Patent number: 11239377Abstract: An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.Type: GrantFiled: August 6, 2018Date of Patent: February 1, 2022Assignee: Rockley Photonics LimitedInventors: Gerald Cois Byrd, Thomas Pierre Schrans, Chia-Te Chou, Arin Abed, Omar James Bchir
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Patent number: 11209678Abstract: An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 ?m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.Type: GrantFiled: February 20, 2019Date of Patent: December 28, 2021Assignee: Rockley Photonics LimitedInventors: Dong Yoon Oh, Hooman Abediasl, Gerald Cois Byrd, Karlheinz Muth, Yi Zhang, Aaron John Zilkie
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Patent number: 11209679Abstract: A photonic integrated circuit, an optoelectronic modulator, and a method of modulating light in a photonic integrated circuit are provided. The photonic integrated circuit comprises: an input waveguide which, in use, receives light in a superposition of two polarisation modes of the waveguide; a polarisation splitter, connected to the input waveguide, and configured to provide, at a first output, light in a first polarisation mode of the two polarisation modes of the waveguide and, at a second output, light in a second polarisation mode of the two polarisation modes of the waveguide; a first polarisation rotator, connected to the first output of the polarisation splitter, and configured to rotate light received therefrom from the first polarisation mode to the second polarisation mode; an optoelectronic modulator, having a first modulation waveguide connected to the first polarisation rotator and a second modulation waveguide connected to the second output of the polarisation splitter.Type: GrantFiled: October 29, 2019Date of Patent: December 28, 2021Assignee: Rockley Photonics LimitedInventors: Thomas Pierre Schrans, Dong Yoon Oh, Aaron John Zilkie