Patents Assigned to Samtec, Inc.
  • Patent number: 11824294
    Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: November 21, 2023
    Assignee: SAMTEC, INC.
    Inventor: Jonathan E. Buck
  • Publication number: 20230335960
    Abstract: A twinaxial cable splitter includes first and second electrical splitter conductors that are configured to be placed in electrical communication with respective first and second signal conductors of a twinaxial electrical cable at one end of the electrical splitter conductors, and are configured to be placed in electrical communication with respective first and second electrical signal conductors of first and second coaxial electrical cables. Thus, the first and second coaxial electrical cables are placed in electrical communication with the first and second electrical signal conductors, respectively, of the twinaxial cable. The twinaxial cable is in electrical communication with an IC die package. The first and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package.
    Type: Application
    Filed: February 4, 2021
    Publication date: October 19, 2023
    Applicant: SAMTEC, INC.
    Inventors: Brandon Thomas GORE, Richard MELLITZ, Gauss YANG, Kelly GARRISON, Norman S. MCMORROW
  • Patent number: 11769969
    Abstract: A connector includes a housing; a cage surrounding the housing; first contacts that are located in the housing and that transmit high-speed signals; second contacts that are located in the housing, that transmit low-speed signals, and that each include a portion that extends from a top surface of the housing; first cables connected to the first contacts; and second cables connected to the second contacts.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: September 26, 2023
    Assignee: SAMTEC, INC.
    Inventors: Jignesh H. Shah, Jean Karlo Williams Barnet
  • Patent number: 11735844
    Abstract: An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: August 22, 2023
    Assignee: SAMTEC, INC.
    Inventors: Liam Parkes, Eric Zbinden, Keith Guetig, Jignesh H. Shah, Jean Karlo Williams Barnett, Chadrick Paul Faith, R. Brad Bettman
  • Publication number: 20230251441
    Abstract: An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
    Type: Application
    Filed: April 14, 2023
    Publication date: August 10, 2023
    Applicant: Samtec, Inc.
    Inventors: Eric J. ZBINDEN, Randall E. MUSSER, Jean-Marc A. VERDIELL, John A. MONGOLD, Brian R. VICICH, Keith R. GUETIG
  • Patent number: 11693194
    Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: July 4, 2023
    Assignee: SAMTEC, INC.
    Inventors: Jignesh H. Shah, William J. Kozlovsky, David A. Langsam, Raymond J. Lee, R. Brad Bettman, Eric Jean Zbinden
  • Patent number: 11652325
    Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: May 16, 2023
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
  • Patent number: 11650383
    Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: May 16, 2023
    Assignee: SAMTEC, INC.
    Inventors: Eric J. Zbinden, Thomas A. Hall, III
  • Patent number: 11646246
    Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: May 9, 2023
    Assignee: SAMTEC, INC.
    Inventors: Tim Mobley, Roupen Leon Keusseyan
  • Patent number: 11637404
    Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: April 25, 2023
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
  • Patent number: 11637400
    Abstract: An orthogonal electrical connector system includes vertical electrical connectors that are configured to be mated to each other so as to place respective pluralities of first and second substrates that are oriented orthogonal to each other in data communication with each other through the mated electrical connectors. Other connector systems are also disclosed.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: April 25, 2023
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John Mongold
  • Patent number: 11626689
    Abstract: A first electrical connector includes a first latch that is configured to releasably engage a second latch of a second electrical connector when the first and second electrical connectors are mated to each other. The first latch can include an attachment portion that attaches to the connector housing of the first electrical connector, and an engagement portion that is movable with respect to the attachment portion between an engaged position and a disengaged position.
    Type: Grant
    Filed: March 16, 2022
    Date of Patent: April 11, 2023
    Assignee: SAMTEC, INC.
    Inventor: Chadrick Paul Faith
  • Patent number: 11621523
    Abstract: A cage assembly includes a cage including a top wall and a bottom wall and an electrical receptacle positioned between the top wall and the bottom wall such that the electrical receptacle floats within the cage in opposite directions between the top wall and the bottom wall.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: April 4, 2023
    Assignee: SAMTEC, INC.
    Inventors: Keith R. Guetig, Thomas A. Hall, III, Andrew R. Collingwood, John L. Nightingale, Eric J. Zbinden
  • Patent number: 11605480
    Abstract: Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: March 14, 2023
    Assignee: SAMTEC, INC.
    Inventors: Shashi Chuganey, Yasuo Sasaki, Scott McMorrow, Francisco Noyola, Cindy Lee Diegel, James Alexander Moss
  • Patent number: 11600956
    Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: March 7, 2023
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
  • Patent number: 11588262
    Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1 RU panel I/O connector attached to the cable connector.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: February 21, 2023
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck, Jignesh H. Shah, Chadrick P. Faith, Randall E. Musser, Jean Karlo Williams Barnet, Norman S. McMorrow
  • Patent number: 11576260
    Abstract: An electrical component is configured to allow electrical cables to be mounted directly to a package substrate, such that electrical traces of the package substrate directly place the electrical cables in electrical communication with an integrated circuit that is mounted to the package substrate without passing through any separable interfaces of an electrical connector.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: February 7, 2023
    Assignee: SAMTEC, INC.
    Inventor: James Dunlop
  • Patent number: D980801
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: March 14, 2023
    Assignee: SAMTEC, INC.
    Inventors: Kevin Bratcher, Douglas E. McCartin, Sr., Brian E. Thurston, Alexander Wroten
  • Patent number: D1002550
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: October 24, 2023
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Patent number: D1005964
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: November 28, 2023
    Assignee: SAMTEC, INC.
    Inventors: Chadrick Paul Faith, Dale Schmelz